Thin Film BGA Delay Lines
BL1L Series
US Patent 5,365,203 6,127,906
1.0 Description
These delay lines offer the same excellent frequency performance as the GL delay lines but come in a solder
bump configuration that takes up less board space than the GL series. As with all of TFT’s delay lines, these
feature stripline conductors on ceramic for high speed, high stability performance.
2.0 Mechanical
-Please refer to page 37 for land pattern
dimension mm
6.40
±0.10
1.27
±0.07
3.81
1.27
±0.07
0.80
max
1.27
1.27
1.27
1.27
5.10
±0.10
schematic
1
2
0.711 (28 mil) Dia.
10/90 Sn/Pb sphere
schematic
Height (H) Code
1.80 max W
2.40 max X
3.00 max Y
Time delay
0.1 - 0.8 ns
0.9 - 1.7 ns
1.8 - 2.6 ns
2.7 - 3.5 ns
Height (H) Code
1.05 max
P
1.65 max
Q
2.25 max
R
2.85 max
S
Time delay
0.10 to 0.20ns
0.30 to 0.50ns
0.60 to 0.80ns
3.0 Electrical
Type
Time delay
Time delay increment
Rated current
Insulation resistance
Temp. coefficient of Td
Time delay tolerance
Characteristic impedance
BL1L (P, Q, R, S)
0.1- 3.5 ns
0.1 ns step to 3.5 ns
100 mA
>100 Mohm 50V
0 to +150 ppm/°C
±0.05 ns
50 ±5 ohm
BL1L (W, X, Y)
0.10 - 0.80 ns
0.1 ns step to 0.80 ns
Rise/fall time
DC resistance
Rated voltage
Operating temperature
-40 to + 85°
Storage temperature
-55 to +125°C
200 ps/ns
<1.0 ohm/ns max
100 VDC (1 min)
4.0 Part Number
BL
1L
5
R
T
250
S
Product designator
Circuit/element qualifier
Impedance (5 = 50 ohm)
Height code
Solder bump
Time delay (250 = 2.5ns)
Serial code
T1
Packaging (T = Tape, 1 = 100)
Manufacturer(s) of the products described on this page are indicated by their respective logos.
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