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BLF881_1012

UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET
超高频波段, 硅, N沟道, 射频功率, 场效应管

器件类别:半导体    分立半导体   

厂商名称:Philips Semiconductors (NXP Semiconductors N.V.)

厂商官网:https://www.nxp.com/

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器件参数
参数名称
属性值
端子数量
2
最小击穿电压
104 V
加工封装描述
ROHS COMPLIANT, CERAMIC PACKAGE-2
无铅
Yes
欧盟RoHS规范
Yes
中国RoHS规范
Yes
状态
ACTIVE
包装形状
RECTANGULAR
包装尺寸
FLANGE MOUNT
表面贴装
Yes
端子形式
FLAT
端子涂层
NOT SPECIFIED
端子位置
DUAL
包装材料
CERAMIC, METAL-SEALED COFIRED
结构
SINGLE
壳体连接
SOURCE
元件数量
1
晶体管应用
AMPLIFIER
晶体管元件材料
SILICON
通道类型
N-CHANNEL
场效应晶体管技术
METAL-OXIDE SEMICONDUCTOR
操作模式
ENHANCEMENT
晶体管类型
RF POWER
最高频带
ULTRA HIGH FREQUENCY BAND
文档预览
BLF881; BLF881S
UHF power LDMOS transistor
Rev. 3 — 7 December 2010
Product data sheet
1. Product profile
1.1 General description
A 140 W LDMOS RF power transistor for broadcast transmitter applications and industrial
applications. The transistor can deliver 140 W from HF to 1 GHz. The excellent
ruggedness and broadband performance of this device makes it ideal for digital
transmitter applications.
Table 1.
Typical performance
RF performance at V
DS
= 50 V in a common-source 860 MHz test circuit.
Mode of operation
2-tone, class AB
DVB-T (8k OFDM)
[1]
f
(MHz)
f
1
= 860; f
2
= 860.1
858
P
L
-
-
P
L(PEP)
140
-
P
L(AV)
G
p
(W)
-
33
21
21
η
D
49
34
IMD3
−34
-
IMD
shldr
(dBc)
-
−33
[1]
(W) (W)
(dB) (%) (dBc)
Measured [dBc] with delta marker at 4.3 MHz from center frequency.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
2-Tone performance at 860 MHz, a drain-source voltage V
DS
of 50 V and a quiescent
drain current I
Dq
= 0.5 A:
Peak envelope power load power = 140 W
Power gain = 21 dB
Drain efficiency = 49 %
Third order intermodulation distortion =
−34
dBc
DVB performance at 858 MHz, a drain-source voltage V
DS
of 50 V and a quiescent
drain current I
Dq
= 0.5 A:
Average output power = 33 W
Power gain = 21 dB
Drain efficiency = 34 %
Shoulder distance =
−33
dBc (4.3 MHz from center frequency)
Integrated ESD protection
Excellent ruggedness
High power gain
NXP Semiconductors
BLF881; BLF881S
UHF power LDMOS transistor
High efficiency
Excellent reliability
Easy power control
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1.3 Applications
Communication transmitter applications in the UHF band
Industrial applications in the UHF band
2. Pinning information
Table 2.
Pin
1
2
3
Pinning
Description
drain
gate
source
[1]
Simplified outline
Graphic symbol
BLF881 (SOT467C)
1
2
3
sym112
BLF881S (SOT467B)
1
2
3
drain
gate
source
[1]
1
3
2
1
2
3
sym112
[1]
Connected to flange.
3. Ordering information
Table 3.
Ordering information
Name Description
BLF881
BLF881S
-
-
earless LDMOST ceramic package; 2 leads
Version
SOT467B
Type number Package
flanged LDMOST ceramic package; 2 mounting holes; 2 leads SOT467C
BLF881_BLF881S
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 3 — 7 December 2010
2 of 18
NXP Semiconductors
BLF881; BLF881S
UHF power LDMOS transistor
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DS
V
GS
T
stg
T
j
Parameter
drain-source voltage
gate-source voltage
storage temperature
junction temperature
Conditions
Min
-
−0.5
−65
-
Max
104
+13
+150
200
Unit
V
V
°C
°C
5. Thermal characteristics
Table 5.
Symbol
R
th(j-c)
[1]
Thermal characteristics
Parameter
thermal resistance from junction to case
Conditions
T
case
= 80
°C;
P
L(AV)
= 70 W
[1]
Typ
0.95
Unit
K/W
R
th(j-c)
is measured under RF conditions.
6. Characteristics
Table 6.
DC characteristics
T
j
= 25
°
C unless otherwise specified.
Symbol
V
(BR)DSS
V
GS(th)
I
DSS
I
DSX
I
GSS
R
DS(on)
C
iss
C
oss
C
rss
[1]
Parameter
drain-source breakdown voltage
gate-source threshold voltage
drain leakage current
drain cut-off current
gate leakage current
drain-source on-state resistance
input capacitance
output capacitance
reverse transfer capacitance
Conditions
V
GS
= 0 V; I
D
= 1.35 mA
V
DS
= 10 V; I
D
= 135 mA
V
GS
= 0 V; V
DS
= 50 V
V
GS
= V
GSth
+ 3.75 V; V
DS
= 10 V
V
GS
= 10 V; V
DS
= 0 V
V
GS
= V
GSth
+ 3.75 V; I
D
= 4.5 A
V
GS
= 0 V; V
DS
= 50 V; f = 1 MHz
V
GS
= 0 V; V
DS
= 50 V; f = 1 MHz
V
GS
= 0 V; V
DS
= 50 V; f = 1 MHz
[1]
[1]
[1]
Min
104
1.4
-
19
-
-
-
-
-
Typ
-
-
-
21
-
210
100
33.5
1
Max
-
2.4
1.4
-
140
-
-
-
-
Unit
V
V
μA
A
nA
pF
pF
pF
I
D
is the drain current.
Table 7.
RF characteristics
T
h
= 25
°
C unless otherwise specified.
Symbol
V
DS
I
Dq
P
L(PEP)
G
p
η
D
IMD3
BLF881_BLF881S
Parameter
drain-source voltage
quiescent drain current
peak envelope power load power
power gain
drain efficiency
third-order intermodulation distortion
Conditions
Min
-
-
-
20
45
-
Typ
50
0.5
140
21
49
−34
Max
-
-
-
-
-
−30
Unit
V
A
W
dB
%
dBc
3 of 18
2-Tone, class AB
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 3 — 7 December 2010
NXP Semiconductors
BLF881; BLF881S
UHF power LDMOS transistor
Table 7.
RF characteristics
…continued
T
h
= 25
°
C unless otherwise specified.
Symbol
V
DS
I
Dq
P
L(AV)
G
p
η
D
IMD
shldr
PAR
[1]
[2]
Parameter
drain-source voltage
quiescent drain current
average output power
power gain
drain efficiency
intermodulation distortion shoulder
peak-to-average ratio
Conditions
Min
-
-
-
20
30
[1]
[2]
Typ
50
0.5
33
21
34
−33
8.3
Max
-
-
-
-
-
−30
-
Unit
V
A
W
dB
%
dBc
dB
DVB-T (8k OFDM)
-
-
Measured [dBc] with delta marker at 4.3 MHz from center frequency.
PAR (of output signal) at 0.01 % probability on CCDF; PAR of input signal = 9.5 dB at 0.01 % probability on CCDF.
200
C
oss
(pF)
160
001aal074
120
80
40
0
0
20
40
60
V
DS
(V)
80
V
GS
= 0 V; f = 1 MHz.
Fig 1.
Output capacitance as a function of drain-source voltage; typical values
BLF881_BLF881S
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 3 — 7 December 2010
4 of 18
NXP Semiconductors
BLF881; BLF881S
UHF power LDMOS transistor
7. Application information
7.1 Narrowband RF figures
7.1.1 CW
001aal075
23
G
p
(dB)
22
21
20
19
18
17
16
0
40
80
120
G
p
70
η
D
(%)
60
50
40
30
20
10
η
D
0
160
200
P
L
(W)
V
DS
= 50 V; I
Dq
= 0.5 A; measured in a common-source narrowband 860 MHz test circuit.
Fig 2.
CW power gain and drain efficiency as function of load power; typical values
7.1.2 2-Tone
0001aal076
001aal077
23
G
p
(dB)
22
21
20
19
18
17
16
0
40
80
G
p
70
η
D
(%)
60
50
40
30
0
IMD3
(dBc)
−20
η
D
−40
20
10
0
120
160
P
L(AV)
(W)
−60
0
40
80
120
160
P
L(AV)
(W)
V
DS
= 50 V; I
Dq
= 0.5 A; measured in a common-source
narrowband 860 MHz test circuit.
V
DS
= 50 V; I
Dq
= 0.5 A; measured in a common-source
narrowband 860 MHz test circuit.
Fig 3.
2-Tone power gain and drain efficiency as
function of average load power; typical values
Fig 4.
2-Tone third order intermodulation distortion
as a function of average load power; typical
values
BLF881_BLF881S
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 3 — 7 December 2010
5 of 18
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参数对比
与BLF881_1012相近的元器件有:BLF881、BLF881S。描述及对比如下:
型号 BLF881_1012 BLF881 BLF881S
描述 UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET
端子数量 2 2 2
最小击穿电压 104 V 104 V 104 V
加工封装描述 ROHS COMPLIANT, CERAMIC PACKAGE-2 ROHS COMPLIANT, CERAMIC PACKAGE-2 ROHS COMPLIANT, CERAMIC PACKAGE-2
无铅 Yes Yes Yes
欧盟RoHS规范 Yes Yes Yes
中国RoHS规范 Yes Yes Yes
状态 ACTIVE ACTIVE ACTIVE
包装形状 RECTANGULAR RECTANGULAR RECTANGULAR
包装尺寸 FLANGE MOUNT FLANGE MOUNT FLATPACK
表面贴装 Yes Yes Yes
端子形式 FLAT FLAT FLAT
端子涂层 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
端子位置 DUAL DUAL DUAL
包装材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
结构 SINGLE SINGLE SINGLE
壳体连接 SOURCE SOURCE SOURCE
元件数量 1 1 1
晶体管应用 AMPLIFIER AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON SILICON SILICON
通道类型 N-CHANNEL N-CHANNEL N-CHANNEL
场效应晶体管技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
操作模式 ENHANCEMENT ENHANCEMENT ENHANCEMENT
晶体管类型 RF POWER RF POWER RF POWER
最高频带 ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
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