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BLKDQ67SWB3

Single Board Computers Micro-ATX / Core i5/i7 3-3.2GHz 32GB

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厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

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器件参数
参数名称
属性值
产品种类
Product Category
Single Board Computers
制造商
Manufacturer
Intel(英特尔)
RoHS
Details
Form Factor
Micro-ATX
Processor Brand
Intel
Processor Type
Intel Core i5/i7 vPro
频率
Frequency
3 GHz/3.2 GHz
Memory Size
32 GB
接口类型
Interface Type
Audio, Ethernet, PCI, PCIe, SATA, USB
工作电源电压
Operating Supply Voltage
3.3 V, 5 V, 12 V
最大工作温度
Maximum Operating Temperature
+ 55 C
Dimensions
9.6 in x 9.6 in
Battery Backup Switching
Backup Battery
Chipsets
Q67 Express
Core
Intel Core i5/i7 vPro
Description/Function
Designed with exceptional stability and compatibility, Intel Desktop Board DQ67SW is equipped with the latest SuperSpeed USB 3.0 and SATA 6 Gb/s ports with RAID support as well as dual independent display capability
Flash
32 Mb
Memory Type
DDR3
最小工作温度
Minimum Operating Temperature
0 C
系列
Packaging
Bulk
工厂包装数量
Factory Pack Quantity
1
文档预览
PRODuCt BRiEF
intel® Desktop Board DQ67SW
Executive Series
MicroATX Form Factor
Intel
®
Desktop Board DQ67SW
Executive Series
Built for Business
In today’s competitive office environment,
PC up-time is critical to business success.
The Intel® Desktop Board DQ67SW is
engineered to provide a stable and reliable
platform that enhances office productivity
with remote manageability and data security
features. Based on the new Intel® Q67
Express Chipset with built-in Intel® Active
Management Technology
1
7.0, the Intel
Desktop Board DQ67SW supports 2nd gen
Intel® Core™ vPro™ processors in the latest
LGA1155 package—bringing you unprece-
dented business PC performance. Abundant
expandability options are available in the
Intel Desktop Board DQ67SW, including two
SuperSpeed USB 3.0 ports, dual indepen-
dent display via DisplayPort*, DVI-D, and
DVI-I graphic ports
2
, six SATA ports including
two SATA 6.0 Gb/s ports, one PCI Express
2.0 x4 connector, and one PCI Express 2.0
x16 graphics connector.
Seamless PC Remote Manageability
The Intel Desktop Board DQ67SW is
equipped with improved KVM Remote
Control manageability, enabling remote
access and control of a PC, even when the
PC is in OOB (out-of-band) state. Desk-side
troubleshooting is greatly reduced with
KVM Remote Control, saving both time
and money.
Eco-Smart Computing
The Intel Desktop Board DQ67SW supports
Phase-Shedding Technology, which allows
it to shut down unneeded phases to
enhance energy efficiency for significant
power savings. The Intel Desktop Board
DQ67SW meets ENERGY STAR*, ErP, and
EPEAT* compliance standards and is RoHS-
compliant to requirements for hazardous
material reduction.
Data Security Features
Protect sensitive office data with RAID
built into the Intel Q67 Express Chipset,
with multiple configurations to support
RAID 0, 1, 5, and 10. Encryption and
signature keys are protected from soft-
ware-based attacks with onboard Trusted
Platform Module (TPM).
3
Also included in
the Intel Desktop Board DQ67SW is the
award-winning antivirus software ESET*
Smart Security 4 with a one-year license.
Multiple Operating System
Certifications
The Intel Desktop Board DQ67SW is
certified with the following operating
systems: Windows* 7, Windows Vista*
Premium, openSUSE*, and RedHat* Linux*.
Intel® Desktop Board DQ67SW Executive Series
the boxed intel® Desktop Board DQ67SW solution includes:
• ATX 2.2 compliant I/O shield
• SATA cables
• Board and back panel I/O layout stickers
• Quick reference guide
• Intel® Express Installer driver and software DVD
Software included:
CAPABiLitY
SOFtWARE iNCLuDED:
Utilities
Security
Manageability
Productivity
• Intel® Core Utilities Bundle
4
• Intel® Desktop Utilities
• ESET* Smart Security 4 (one-year license)
• Wave* EMBASSY* Security Center
• RealVNC* Viewer Plus (Internet download)
• Spiceworks* IT Desktop
• Laplink* PCmover* Professional
2
Intel® Desktop Board DQ67SW Executive Series
Features and Benefits
1
Support for the intel® Core™ i7 vPro™,
intel® Core™ i5 vPro™, and intel®
Core™ i3 processors in the LGA1155
package:
Features Intel® Turbo
Boost Technology
5
and Intel® Hyper-
Threading Technology
6
for exceptional
performance and scalability.
intel® Q67 Express Chipset
integrated Memory Controller (iMC):
Four connectors designed to support
up to 32 GB
7
dual-channel DDR3 1333 /
1066 MHz memory.
two iEEE 1394a ports (one via
internal header)
twelve uSB 2.0 ports (four back
panel ports and eight additional
ports via internal headers)
two SuperSpeed uSB 3.0 ports:
5.0 Gb/s signaling rate for high-speed
connections to peripherals.
One PCi Express* 2.0 x16 graphics
connector
One PCi Express 2.0 x4 connector
One PCi connector and one PCi
Express 2.0 x1 connector
10
two SAtA 6.0 Gb/s ports and
16
two SAtA 3.0 Gb/s ports with
intel® Rapid Storage technology:
RAID 0, 1, 5, and 10.
11
two eSAtA 3.0 Gb/s ports
12
Eight-channel Intel® High Definition
9
8
7
12
4
11
5
15
14
6
2
3
Audio
8
with multi-streaming:
Features internal S/PDIF output and
front panel audio headers.
13
trusted Platform Module (tPM)
3
:
9.6” (24.38cm)
Delivers encryption and signature keys
protection.
14
intel® PRO 10/100/1000 Network
1
4
5
Connection:
Uses a new low-power
design to meet improved ENERGY
STAR* 5.0 specifications.
15
Dual independent display:
Display-
2
3
6
Port* + DVI-D + DVI-I graphics ports
2
.
16
Lead-free:
Meets all worldwide
7
regulatory requirements for lead-free
manufacturing.
17
MicroAtX Form Factor:
MicroATX
8
9
board supports smaller tower and
system designs.
10
13
17
9.6” (24.38cm)
3
Intel® Desktop Board DQ67SW Executive Series
Technical Specifications
PROCESSOR
Processor Support
• 2nd gen Intel® Core™ i7 vPro™, Intel® Core™ i5 vPro™,
and Intel® Core™ i3 processors in the LGA1155 package
• Intel® Turbo Boost Technology
5
• Intel® Hyper-Threading Technology
6
• Integrated Memory Controller with support for up
to 32 GB
6
of system memory using DDR3 1333 /
1066 MHz
• Intel® Fast Memory Access
• Supports Intel® 64 Architecture
9
ChiPSEt
intel® Q67 Express Chipset
• Intel® 82Q67 Platform Controller Hub (PCH)
• Intel® Active Management Technology
1
7.0
• Intel® Rapid Storage Technology (RAID 0, 1, 5, 10)
integrated intel® PCh Controllers
• Six Hi-Speed USB 2.0 ports
• Six additional ports via internal headers
• Two SATA 6.0 Gb/s ports and four SATA 3.0 Gb/s ports
System BiOS
• 32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play,
IDE drive auto-configure
• Advanced configuration and power interface
V1.0b, DMI 2.5
• Intel® Express BIOS update support
hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 1.0b
1
For ordering information, visit
www.intel.com
For the most current product information, visit
www.intel.com/go/idb
or
http://ark.intel.com
For specific processor compatibility, visit
http://processormatch.intel.com
Front-Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Four front panel Hi-Speed USB 2.0 headers
• Front panel audio header
• Front panel IEEE 1394a header
MEChANiCAL
Board Style
• MicroATX
Board Size
• 9.6” x 9.6” (24.38cm x 24.38cm)
Baseboard Power Requirements
• ATX 12 V
ENViRONMENt
Operating temperature
• 0° C to +55° C
Storage temperature
• -20° C to +70° C
REGuLAtiONS AND SAFEtY StANDARDS
united States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
Europe
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
EMC regulations (tested in representative
chassis)
united States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis (cover off) testing
depending on your hardware and software configurations. See
http://developer.intel.com/technology/intel64/index.htm for
more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-
CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-
ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving,
or life-sustaining applications. Intel may make changes to speci-
fications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based
on current expectations, and are subject to change without
notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, Core Inside, and Intel vPro are
trademarks of Intel Corporation in the U.S. and other countries..
* Other names and brands may be claimed as the property of others.
Copyright © 2010 Intel Corporation. All rights reserved.
1210/TC/MS/PDF 324736-001US
intel® 82579LM ENERGY StAR*-ready
intel® PRO 10/100/1000 Network Connection
• High quality and reliability with Intel’s world-class
manufacturing and validation
• New low-power design
Expansion Capabilities
• One PCI Express* 2.0 x16 connector
• One PCI Express 2.0 x4 connector
• One PCI Express x1 connector
• One PCI connector
Audio
• Eight-channel Intel® High Definition Audio
8
with
multi-streaming
• One front panel audio header
• One internal S/PDIF output header
SYStEM MEMORY
Memory Capacity
• Four 240-pin DIMM connectors supporting
up to four double-sided DIMMs
Memory types
• DDR3 1333 / 1066 SDRAM memory support
• Non-ECC Memory
Memory Voltage
• Memory voltage control from 1.2 V to 1.8 V
• 1.5 V standard JEDEC voltage
JuMPERS AND FRONt-PANEL CONNECtORS
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Canada
ICES-003, Class B
Europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via
EN55022 +6 db in system configurations with an
open chassis and EU Directive 89/336/EEC and use
via EN55022 and EN50082-1 in a representative
chassis.
Lead-Free:
The symbol is used to identify
electrical and electronic assemblies and
components in which the lead (Pb) concen-
tration level in any of the raw materials and the end
product is not greater than 0.1% by weight (1000
ppm). This symbol is also used to indicate confor-
mance to lead-free requirements and definitions
adopted under the European Union’s Restriction on
Hazardous Substances (RoHS) directive, 2002/95/EC.
Intel® Active Management Technology (Intel® AMT) requires
the computer to have an Intel® AMT-enabled chipset, network
hardware and software, connection with a power source, and
a network connection.
Requires the use of a processor with Intel® HD Graphics.
The original equipment manufacturer must provide TPM function-
ality, which requires a TPM-supported BIOS. TPM functionality
must be initialized and may not be available in all countries.
The Intel® Core Utilities Bundle includes Intel® Integrator Assistant,
Intel® Integrator Toolkit, Intel® Express Installer, and Intel® Express
BIOS Update.
Intel® Turbo Boost Technology requires a PC with a processor with
Intel Turbo Boost Technology capability. Intel Turbo Boost Technol-
ogy performance varies depending on hardware, software, and
overall system configuration. Check with your PC manufacturer on
whether your system delivers Intel Turbo Boost Technology. See
www.intel.com/technology/turboboost for more information.
Intel® Hyper-Threading Technology requires a computer system
with a processor supporting HT Technology and an HT Technology-
enabled chipset, BIOS, and operating system. Performance will vary
depending on the specific hardware and software you use. For
more information including details on which processors support HT
Technology, see www.intel.com/info/hyperthreading.
7
2
3
4
System resources and hardware (such as PCI and PCI Express*)
require physical memory address locations that can reduce avail-
able addressable system memory. This could result in a reduction
of as much as 1 GB or more of physical addressable memory being
available to the operating system and applications, depending on
the system configuration and operating system.
Intel® High Definition Audio requires a system with an appropriate
Intel® chipset and a motherboard with an appropriate codec and
the necessary drivers installed. System sound quality will vary
depending on actual implementation, controller, codec, drivers,
and speakers. For more information about Intel® HD Audio, refer to
www.intel.com/design/chipsets/hdaudio.htm.
64-bit computing on Intel® architecture requires a computer
system with a processor, chipset, BIOS, operating system, device
drivers, and applications enabled for Intel® 64 architecture.
Processors will not operate (including 32-bit operation) without
an Intel 64 architecture-enabled BIOS. Performance will vary
8
5
9
6
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