描述 |
Battery Management SBS 1.1 Comp Gas Gauge Enabled |
Battery Management SBS 1.1 Comp Gas Gauge Enabled |
Battery Management SBS 1.1 Comp Gas Gauge Enabled |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
TSSOP |
TSSOP |
TSSOP |
包装说明 |
GREEN, PLASTIC, TSSOP-30 |
PLASTIC, TSSOP-30 |
TSSOP, TSSOP30,.25,20 |
针数 |
30 |
30 |
30 |
Reach Compliance Code |
unknow |
compli |
unknow |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
可调阈值 |
YES |
YES |
YES |
模拟集成电路 - 其他类型 |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 |
R-PDSO-G30 |
R-PDSO-G30 |
R-PDSO-G30 |
JESD-609代码 |
e4 |
e4 |
e4 |
长度 |
7.8 mm |
7.8 mm |
7.8 mm |
湿度敏感等级 |
2 |
2 |
2 |
信道数量 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
端子数量 |
30 |
30 |
30 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
TSSOP |
TSSOP |
TSSOP |
封装等效代码 |
TSSOP30,.25,20 |
TSSOP30,.25,20 |
TSSOP30,.25,20 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
电源 |
2.5 V |
2.5 V |
2.5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.2 mm |
1.2 mm |
1.2 mm |
最大供电电压 (Vsup) |
2.6 V |
2.6 V |
2.6 V |
最小供电电压 (Vsup) |
2.4 V |
2.4 V |
2.4 V |
标称供电电压 (Vsup) |
2.5 V |
2.5 V |
2.5 V |
表面贴装 |
YES |
YES |
YES |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
4.4 mm |
4.4 mm |
4.4 mm |
Is Samacsys |
N |
N |
- |
Base Number Matches |
1 |
1 |
- |