型号
- 型号
- 关键词
| 型号 | BR24L01AFVJ-WTR | BR24L01AF-WTR | BR24L01AFVT-WTR | BR24L01AFVM-WE2 | BR24L01AFJ-WTR | BR24L01ANUX-WE2 | BR24L01AFV-WTR |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 128X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, TSSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, SOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, TSSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, MSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, SOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, 2 X 3 MM, ROHS COMPLIANT, VSON-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, SSOP-8 |
| 厂商名称 | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
| 零件包装代码 | SOIC | SOIC | SOIC | MSOP | SOIC | SON | SOIC |
| 包装说明 | ROHS COMPLIANT, TSSOP-8 | ROHS COMPLIANT, SOP-8 | LSSOP, | ROHS COMPLIANT, MSOP-8 | ROHS COMPLIANT, SOP-8 | 2 X 3 MM, ROHS COMPLIANT, VSON-8 | ROHS COMPLIANT, SSOP-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| JESD-30 代码 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G8 |
| 长度 | 3 mm | 5 mm | 4.4 mm | 2.9 mm | 4.9 mm | 3 mm | 4.4 mm |
| 内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| 字数代码 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | LSSOP | VSSOP | SOP | HVSON | LSSOP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.5 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3 mm | 4.4 mm | 3 mm | 2.8 mm | 3.9 mm | 2 mm | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 座面最大高度 | 1.1 mm | - | 1.25 mm | 0.9 mm | - | 0.6 mm | 1.25 mm |
stm32/stm8
FPGA/CPLD
电子竞赛
stm32/stm8
模拟电子
DigiKey得捷技术专区