BR24L32F-WE1,BR24L32F-WE1 pdf中文资料,BR24L32F-WE1引脚图,BR24L32F-WE1电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否无铅

不含铅

是否Rohs认证

符合

厂商名称

ROHM(罗姆半导体)

包装说明

SOP, SOP8,.25

Reach Compliance Code

compliant

其他特性

IT ALSO OPERATES AT 0.1MHZ AT 1.8MIN

最大时钟频率 (fCLK)

0.4 MHz

数据保留时间-最小值

耐久性

1000000 Write/Erase Cycles

I2C控制字节

1010DDDR

JESD-30 代码

R-PDSO-G8

JESD-609代码

长度

5 mm

内存密度

32768 bit

内存集成电路类型

EEPROM

内存宽度

湿度敏感等级

功能数量

端子数量

字数

4096 words

字数代码

4000

工作模式

SYNCHRONOUS

最高工作温度

85 °C

最低工作温度

-40 °C

组织

4KX8

封装主体材料

PLASTIC/EPOXY

封装代码

SOP

封装等效代码

SOP8,.25

封装形状

RECTANGULAR

封装形式

SMALL OUTLINE

并行/串行

SERIAL

峰值回流温度（摄氏度）

225

电源

2/5 V

认证状态

Not Qualified

座面最大高度

1.71 mm

串行总线类型

I2C

最大待机电流

0.000002 A

最大压摆率

0.003 mA

最大供电电压 (Vsup)

5.5 V

最小供电电压 (Vsup)

2.5 V

标称供电电压 (Vsup)

3 V

表面贴装

YES

技术

CMOS

温度等级

INDUSTRIAL

端子面层

Matte Tin (Sn)

端子形式

GULL WING

端子节距

1.27 mm

端子位置

DUAL

处于峰值回流温度下的最长时间

NOT SPECIFIED

宽度

4.4 mm

最长写入周期时间 (tWC)

5 ms

写保护

HARDWARE

Base Number Matches

文档预览

Appendix

Notes

No technical content pages of this document may be reproduced in any form or transmitted by any

means without prior permission of ROHM CO.,LTD.

The contents described herein are subject to change without notice. The specifications for the

product described in this document are for reference only. Upon actual use, therefore, please request

that specifications to be separately delivered.

Application circuit diagrams and circuit constants contained herein are shown as examples of standard

use and operation. Please pay careful attention to the peripheral conditions when designing circuits

and deciding upon circuit constants in the set.

Any data, including, but not limited to application circuit diagrams information, described herein

are intended only as illustrations of such devices and not as the specifications for such devices. ROHM

CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any

third party's intellectual property rights or other proprietary rights, and further, assumes no liability of

whatsoever nature in the event of any such infringement, or arising from or connected with or related

to the use of such devices.

Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or

otherwise dispose of the same, no express or implied right or license to practice or commercially

exploit any intellectual property rights or other proprietary rights owned or controlled by

ROHM CO., LTD. is granted to any such buyer.

Products listed in this document are no antiradiation design.

The products listed in this document are designed to be used with ordinary electronic equipment or devices

(such as audio visual equipment, office-automation equipment, communications devices, electrical

appliances and electronic toys).

Should you intend to use these products with equipment or devices which require an extremely high level of

reliability and the malfunction of with would directly endanger human life (such as medical instruments,

transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other

safety devices), please be sure to consult with our sales representative in advance.

About Export Control Order in Japan

Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control

Order in Japan.

In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)

on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.

Appendix1-Rev1.1

参数对比

与BR24L32F-WE1相近的元器件有：BR24L32FV-WE1、BR24L32FJ-WE1。描述及对比如下：

型号	BR24L32F-WE1	BR24L32FV-WE1	BR24L32FJ-WE1
描述	EEPROM, 4KX8, Serial, CMOS, PDSO8	EEPROM, 4KX8, Serial, CMOS, PDSO8,	EEPROM, 4KX8, Serial, CMOS, PDSO8
是否无铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合
厂商名称	ROHM(罗姆半导体)	ROHM(罗姆半导体)	ROHM(罗姆半导体)
包装说明	SOP, SOP8,.25	LSSOP, TSSOP8,.25	LSOP, SOP8,.25
Reach Compliance Code	compliant	compliant	compliant
其他特性	IT ALSO OPERATES AT 0.1MHZ AT 1.8MIN	IT ALSO OPERATES AT 0.1MHZ AT 1.8MIN	IT ALSO OPERATES AT 0.1MHZ AT 1.8MIN
最大时钟频率 (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz
数据保留时间-最小值	40	40	40
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C控制字节	1010DDDR	1010DDDR	1010DDDR
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609代码	e3	e2	e3
长度	5 mm	4.4 mm	4.9 mm
内存密度	32768 bit	32768 bit	32768 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8
功能数量	1	1	1
端子数量	8	8	8
字数	4096 words	4096 words	4096 words
字数代码	4000	4000	4000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C
组织	4KX8	4KX8	4KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	LSSOP	LSOP
封装等效代码	SOP8,.25	TSSOP8,.25	SOP8,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE
并行/串行	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	225	NOT SPECIFIED	225
电源	2/5 V	2/5 V	2/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.71 mm	1.35 mm	1.65 mm
串行总线类型	I2C	I2C	I2C
最大待机电流	0.000002 A	0.000002 A	0.000002 A
最大压摆率	0.003 mA	0.003 mA	0.003 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2.5 V	2.5 V	2.5 V
标称供电电压 (Vsup)	3 V	3 V	3 V
表面贴装	YES	YES	YES
技术	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Matte Tin (Sn)	Tin/Copper (Sn/Cu)	Matte Tin (Sn)
端子形式	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	0.65 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	4.4 mm	3 mm	3.9 mm
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms
写保护	HARDWARE	HARDWARE	HARDWARE
Base Number Matches	1	1	1
湿度敏感等级	1	-	1