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BR25H010F-2CE2

EEPROM SPI BUS 1K SOP8 EEPROM

器件类别:存储    存储   

厂商名称:ROHM(罗姆半导体)

厂商官网:https://www.rohm.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
包装说明
SOP-8
Reach Compliance Code
compliant
Factory Lead Time
16 weeks
其他特性
SEATED HT-CALCULATED AND ALSO OPERATES AT 2.5V WITH 5MHZ
最大时钟频率 (fCLK)
10 MHz
数据保留时间-最小值
100
耐久性
1000000 Write/Erase Cycles
JESD-30 代码
R-PDSO-G8
长度
5 mm
内存密度
1024 bit
内存集成电路类型
EEPROM
内存宽度
8
功能数量
1
端子数量
8
字数
128 words
字数代码
128
工作模式
SYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-40 °C
组织
128X8
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
SERIAL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3/5 V
认证状态
Not Qualified
筛选级别
AEC-Q100
座面最大高度
1.71 mm
串行总线类型
SPI
最大待机电流
0.00001 A
最大压摆率
0.004 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
4.4 mm
最长写入周期时间 (tWC)
4 ms
写保护
HARDWARE
Base Number Matches
1
文档预览
Datasheet
Serial EEPROM Series Automotive EEPROM
125℃ Operation SPI BUS EEPROM
BR25H010-2C
●General
Description
BR25H010-2C is a serial EEPROM of SPI BUS interface method.
●Features
High speed clock action up to 10MHz (Max.)
Wait function by HOLDB terminal.
Part or whole of memory arrays settable as read only
memory area by program.
2.5V to 5.5V single power source action most
suitable
for battery use.
Page write mode useful for initial value write at
factory shipment.
For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
Self-timed programming cycle.
Low Supply Current
At write operation (5V)
: 1.0mA (Typ.)
At read operation (5V)
: 1.0mA (Typ.)
At standby operation (5V)
: 0.1μA (Typ.)
Address auto increment function at read operation
Prevention of write mistake
Write prohibition at power on.
Write prohibition by command code (WRDI).
Write prohibition by WPB pin.
Write prohibition block setting by status registers
(BP1, BP0).
Prevention of write mistake at low voltage.
MSOP8, TSSOP-B8, SOP8, SOP-J8 Package
Data at shipment Memory array: FFh, status register
BP1, BP0 : 0
More than 100 years data retention.
More than 1 million write cycles.
AEC-Q100 Qualified.
●Package
MSOP8
2.90mm x 4.00mm x 0.90mm
TSSOP-B8
3.00mm x 6.40mm x 1.20mm
SOP8
5.00mm x 6.20mm x 1.71mm
●Page
write
Number of pages
Product Number
SOP-J8
4.90mm x 6.00mm x 1.65mm
16 Byte
BR25H010-2C
●BR25H010-2C
Capacity
Bit format
1Kbit
128x8
Product Number
BR25H010-2C
Supply Voltage
2.5V to 5.5V
MSOP8
TSSOP-B8
SOP8
SOP-J8
○Product
structure:Silicon monolithic integrated circuit
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This
product is not designed protection against radioactive rays
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BR25H010-2C
●Absolute
maximum ratings (Ta=25°C)
Parameter
Supply Voltage
Symbol
VCC
Limits
-0.3 to +6.5
380(MSOP8)
*1
410(TSSOP-B8)
*2
Permissible Dissipation
Pd
560(SOP8)
*3
Datasheet
Unit
V
mW
560(SOP-J8)
*4
Storage Temperature Range
Operating Temperature Range
Terminal Voltage
Tstg
Topr
-65½+150
-40 to +125
-0.3 to VCC+0.3
°C
°C
V
・When
using at Ta=25℃ or higher, 3.1mW(*1) , 3.3mW(*2) , 4.5mW (*3,*4)to be reduced per 1℃
●Memory
cell characteristics (VCC=2.5V to 5.5V)
Limits
Parameter
Min.
1,000,000
Write Cycles
*5
500,000
300,000
100
Data Retention
*5
60
50
*5: Not 100% TESTED
Unit
Typ.
Max.
Cycles
Cycles
Cycles
Years
Years
Years
Condition
Ta
85°C
Ta
105°C
Ta
125°C
Ta
25°C
Ta
105°C
Ta
125°C
●Recommended
Operating Ratings
Parameter
Supply Voltage
Input Voltage
Symbol
VCC
Vin
Limits
2.5
to
5.5
V
0 to VCC
Unit
●Input
/ output capacity (Ta=25°C, frequency=5MHz)
Parameter
Input Capacity
*6
Output Capacity
*6
Symbol
C
IN
C
OUT
Conditions
V
IN
=GND
V
OUT
=GND
Min
Max
8
Unit
pF
8
*6: Not 100% TESTED
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0R1R0G100070-1-2
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BR25H010-2C
●DC
characteristics (Unless otherwise specified, Ta=-40°C to +125°C, VCC=2.5V to 5.5V)
Limits
Parameter
Symbol
Min.
Input High Voltage
Input Low Voltage
Output Low Voltage
Output High Voltage
Input Leakage
Current
Output Leakage
Current
VIH
VIL
VOL
VOH
ILI
ILO
0.7xVCC
-0.3
0
VCC-0.5
-2
-2
Typ.
Max.
VCC
+0.3
0.3x
VCC
0.4
VCC
2
2
V
V
V
V
μA
μA
2.5V≦VCC≦5.5V
2.5V≦VCC≦5.5V
IOL=2.1mA
IOH=-0.4mA
V
IN
=0V to VCC
V
OUT
=0V to VCC, CSB=VCC
Unit Conditions
Datasheet
ICC1
Supply Current
(WRITE)
ICC2
2.0
VCC=2.5V,fSCK=5MHz, tE/W=4ms
mA VIH/VIL=0.9VCC/0.1VCC, SO=OPEN
Byte write, Page write, Write status register
VCC=5.5V,fSCK=5 or 10 MHz, tE/W=4ms
mA VIH/VIL=0.9VCC/0.1VCC, SO=OPEN
Byte write, Page write, Write status register
VCC=2.5V,fSCK=5MHz
mA VIH/VIL=0.9VCC/0.1VCC, SO=OPEN
Read, Read status register
VCC=5.5V,fSCK=5MHz
mA VIH/VIL=0.9VCC/0.1VCC, SO=OPEN
Read, Read status register
VCC=5.5V,fSCK=10MHz
mA VIH/VIL=0.9VCC/0.1VCC, SO=OPEN
Read, Read status register
μA
VCC=5.5V
CSB=HOLDB=WPB=VCC,
SCK=SI=VCC or =GND, SO=OPEN
3.0
ICC3
Supply Current
(READ)
1.5
ICC4
2.0
ICC5
4.0
Standby Current
ISB
10
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0R1R0G100070-1-2
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BR25H010-2C
●AC
characteristics (Ta=-40°C to +125°C, unless otherwise specified, load capacity C
L1
=100pF)
Parameter
SCK Frequency
SCK High Time
SCK Low Time
CSB High Time
CSB Setup Time
CSB Hold Time
SCK Setup Time
SCK Hold Time
SI Setup Time
SI Hold Time
Data Output Delay Time1
Data Output Delay Time2
(C
L2
=30pF)
Datasheet
Symbol
fSCK
tSCKWH
tSCKWL
tCS
tCSS
tCSH
tSCKS
tSCKH
tDIS
tDIH
tPD1
tPD2
tOH
tOZ
tHFS
tHFH
tHRS
tHRH
tHOZ
tHPD
tRC
tFC
tRO
tFO
tE/W
2.5V≦VCC≦5.5V
Min.
85
85
85
90
85
90
90
20
30
0
0
40
0
70
Typ.
Max.
5
60
50
100
100
60
1
1
40
40
4
4.5V≦VCC≦5.5V
Min.
40
40
40
30
30
30
30
10
10
0
0
30
0
30
Typ.
Max.
10
40
30
40
40
40
1
1
40
40
4
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
μs
μs
ns
ns
ms
Output Hold Time
Output Disable Time
HOLDB Setting
Setup Time
HOLDB Setting
Hold Time
HOLDB Release
Setup Time
HOLDB Release
Hold Time
Time from HOLDB
to Output High-Z
Time from HOLDB
to Output Change
SCK Rise Time
*1
SCK Fall Time
*1
OUTPUT Rise Time
*1
OUTPUT Fall Time
*1
Write Time
*1 NOT 100% TESTED
●AC
measurement conditions
Parameter
Load Capacity 1
Load Capacity 2
Input Rise Time
Input Fall Time
Input Voltage
Input / Output
Judgment Voltage
Symbol
C
L1
C
L2
Limits
Min.
Typ.
Max.
100
30
50
50
Unit
Input Voltage
pF
pF
ns
ns
V
V
0.2Vcc
0.8Vcc
Input/Output judgement voltage
0.7Vcc
0.3Vcc
0.2VCC/0.8VCC
0.3VCC/0.7VCC
Figure 1.
Input/Output judgment voltage
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0R1R0G100070-1-2
27.Jan.2016 Rev.002
BR25H010-2C
●Serial
Input / Output Timing
tCS
tCSS
Datasheet
CSB
tSCKS
tSCKWL
tSCKWH
tRC
tFC
SCK
tDIS tDIH
SI
SO
High-Z
Figure 2. Input timing
SI is taken into IC inside in sync with data rise edge of SCK. Input address and data from the most significant bit MSB.
tCS
CSB
SCK
SI
SO
tPD
tCSH tSCKH
tOH
tRO,tFO
tOZ
High-Z
Figure 3. Input / Output timing
SO is output in sync with data fall edge of SCK. Data is output from the most significant bit MSB.
CSB
"H"
"L"
tHFS
tHFH
tHRS tHRH
SCK
tDIS
SI
n+1
tHOZ
High-Z
tHPD
n
n-1
SO
Dn+1
Dn
Dn
Dn-1
HOLDB
Figure 4. HOLD timing
●Block
diagram
CSB
SCK
VOLTAGE
INSTRUCTION DECODE
CONTROL CLOCK
GENERATION
WRITE
INHIBITION
HIGH VOLTAGE
GENERATOR
DETECTION
SI
HOLDB
INSTRUCTION
REGISTER
ADDRESS
REGISTER
ADDRESS
DECODER
READ/WRITE
AMP
STATUS REGISTER
7bit
7bit
1K
EEPROM
WPB
SO
DATA
REGISTER
8bit
8bit
Figure 5. Block diagram
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/32
TSZ02201-0R1R0G100070-1-2
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参数对比
与BR25H010F-2CE2相近的元器件有:BR25H010FJ-2CE2。描述及对比如下:
型号 BR25H010F-2CE2 BR25H010FJ-2CE2
描述 EEPROM SPI BUS 1K SOP8 EEPROM EEPROM SPI BUS 10MHz 1Kbit 2.5-5.5V
是否Rohs认证 符合 符合
包装说明 SOP-8 SOP-8
Reach Compliance Code compliant compliant
其他特性 SEATED HT-CALCULATED AND ALSO OPERATES AT 2.5V WITH 5MHZ SEATED HT-CALCULATED AND ALSO OPERATES AT 2.5V WITH 5MHZ
最大时钟频率 (fCLK) 10 MHz 10 MHz
数据保留时间-最小值 100 100
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G8 R-PDSO-G8
长度 5 mm 4.9 mm
内存密度 1024 bit 1024 bit
内存集成电路类型 EEPROM EEPROM
内存宽度 8 8
功能数量 1 1
端子数量 8 8
字数 128 words 128 words
字数代码 128 128
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 125 °C 125 °C
最低工作温度 -40 °C -40 °C
组织 128X8 128X8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP LSOP
封装等效代码 SOP8,.25 SOP8,.25
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, LOW PROFILE
并行/串行 SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
电源 3/5 V 3/5 V
认证状态 Not Qualified Not Qualified
筛选级别 AEC-Q100 AEC-Q100
座面最大高度 1.71 mm 1.65 mm
串行总线类型 SPI SPI
最大待机电流 0.00001 A 0.00001 A
最大压摆率 0.004 mA 0.004 mA
最大供电电压 (Vsup) 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING
端子节距 1.27 mm 1.27 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 4.4 mm 3.9 mm
最长写入周期时间 (tWC) 4 ms 4 ms
写保护 HARDWARE HARDWARE
Base Number Matches 1 1
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