型号
- 型号
- 关键词
| 型号 | BR25L040FVJ-W | BR25L040FJ-W | BR25L040F-W | BR25L040FV-W | BR25L040FVM-W | BR25L040FVT-W |
|---|---|---|---|---|---|---|
| 描述 | SPI BUS 4Kbit (512 x 8bit) EEPROM | SPI BUS 4Kbit (512 x 8bit) EEPROM | SPI BUS 4Kbit (512 x 8bit) EEPROM | SPI BUS 4Kbit (512 x 8bit) EEPROM | SPI BUS 4Kbit (512 x 8bit) EEPROM | SPI BUS 4Kbit (512 x 8bit) EEPROM |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | MSOP | SOIC |
| 包装说明 | TSSOP, | SOP, SOP8,.25 | ROHS COMPLIANT, SOP-8 | LSSOP, TSSOP8,.25 | VSSOP, TSSOP8,.16 | LSSOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
| JESD-30 代码 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e2 | e2 | e2 | e2 | e2 | e2 |
| 长度 | 3 mm | 4.9 mm | 5 mm | 4.4 mm | 2.9 mm | 4.4 mm |
| 内存密度 | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | LSOP | LSSOP | VSSOP | LSSOP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn/Cu) | Tin/Copper (Sn97.5Cu2.5) | Tin/Copper (Sn/Cu) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 10 | 10 | 10 | 10 | NOT SPECIFIED |
| 宽度 | 3 mm | 3.9 mm | 4.4 mm | 3 mm | 2.8 mm | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 座面最大高度 | 1.05 mm | - | 1.6 mm | 1.25 mm | 0.9 mm | 1.25 mm |
| Base Number Matches | 1 | 1 | 1 | - | - | 1 |
| 数据保留时间-最小值 | - | 40 | 40 | 40 | 40 | - |
| 耐久性 | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - |
| 封装等效代码 | - | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.16 | - |
| 电源 | - | 2/5 V | 2/5 V | 2/5 V | 2/5 V | - |
| 最大待机电流 | - | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | - |
| 最大压摆率 | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | - |
| 写保护 | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - |
模拟电子
嵌入式系统
汽车电子
微控制器 MCU
FPGA/CPLD
ARM技术
