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BR93L66FJ-WE1

EEPROM, 256X16, Serial, CMOS, PDSO8

器件类别：存储    存储   

厂商名称：ROHM(罗姆半导体)

厂商官网：https://www.rohm.com/

器件标准：

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参数 预览 参数对比
器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
ROHM(罗姆半导体)
包装说明
SOP, SOP8,.25
Reach Compliance Code
compliant
数据保留时间-最小值
40
耐久性
1000000 Write/Erase Cycles
JESD-30 代码
R-PDSO-G8
内存密度
4096 bit
内存集成电路类型
EEPROM
内存宽度
16
端子数量
8
字数
256 words
字数代码
256
最高工作温度
85 °C
最低工作温度
-40 °C
组织
256X16
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
SERIAL
电源
2/5 V
认证状态
Not Qualified
串行总线类型
MICROWIRE
最大待机电流
0.000002 A
最大压摆率
0.0045 mA
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
写保护
SOFTWARE
文档预览
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1
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参数对比
与BR93L66FJ-WE1相近的元器件有：BR93L66RFV-WE1、BR93L66FV-WE1、BR93L66FVT-WE1、BR93L66RFJ-WE1、BR93L66F-WE1、BR93L66RFVT-WE1。描述及对比如下：
型号 BR93L66FJ-WE1 BR93L66RFV-WE1 BR93L66FV-WE1 BR93L66FVT-WE1 BR93L66RFJ-WE1 BR93L66F-WE1 BR93L66RFVT-WE1
描述 EEPROM, 256X16, Serial, CMOS, PDSO8 EEPROM, 256X16, Serial, CMOS, PDSO8 EEPROM, 256X16, Serial, CMOS, PDSO8 EEPROM Card, 256X16, Serial, CMOS, PDSO8 EEPROM, 256X16, Serial, CMOS, PDSO8 EEPROM, 256X16, Serial, CMOS, PDSO8 EEPROM Card, 256X16, Serial, CMOS, PDSO8
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
包装说明 SOP, SOP8,.25 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25 TSSOP-8 SOP, SOP8,.25 SOP, SOP8,.25 TSSOP, TSSOP8,.25
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
数据保留时间-最小值 40 40 40 40 40 40 40
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
内存密度 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM CARD EEPROM EEPROM EEPROM CARD
内存宽度 16 16 16 16 16 16 16
端子数量 8 8 8 8 8 8 8
字数 256 words 256 words 256 words 256 words 256 words 256 words 256 words
字数代码 256 256 256 256 256 256 256
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 256X16 256X16 256X16 256X16 256X16 256X16 256X16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSSOP TSSOP TSSOP SOP SOP TSSOP
封装等效代码 SOP8,.25 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25 SOP8,.25 SOP8,.25 TSSOP8,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
电源 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
串行总线类型 MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE
最大待机电流 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A
最大压摆率 0.0045 mA 0.0045 mA 0.0045 mA 0.0045 mA 0.0045 mA 0.0045 mA 0.0045 mA
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 1.27 mm 0.635 mm 0.635 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL
写保护 SOFTWARE SOFTWARE SOFTWARE SOFTWARE SOFTWARE SOFTWARE SOFTWARE
厂商名称 ROHM(罗姆半导体) - ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体)
JESD-609代码 - e2 e2 e3 - - e3
端子面层 - Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu) Matte Tin (Sn) - - Matte Tin (Sn)
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器件捷径:
S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY
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