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BTA208-600F

Triacs RAIL TRIAC

器件类别:模拟混合信号IC    触发装置   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
Source Url Status Check Date
2013-06-14 00:00:00
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
TO-220AB
包装说明
FLANGE MOUNT, R-PSFM-T3
针数
3
Reach Compliance Code
unknown
外壳连接
MAIN TERMINAL 2
配置
SINGLE
关态电压最小值的临界上升速率
50 V/us
最大直流栅极触发电流
25 mA
最大直流栅极触发电压
1.5 V
最大维持电流
30 mA
JEDEC-95代码
TO-220AB
JESD-30 代码
R-PSFM-T3
JESD-609代码
e3
最大漏电流
0.5 mA
元件数量
1
端子数量
3
最高工作温度
125 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
最大均方根通态电流
8 A
重复峰值关态漏电流最大值
500 µA
断态重复峰值电压
600 V
表面贴装
NO
端子面层
Tin (Sn)
端子形式
THROUGH-HOLE
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
触发设备类型
TRIAC
Base Number Matches
1
文档预览
BTA312-800E
4 October 2012
3Q Hi-Com Triac
Product data sheet
1. Product profile
1.1 General description
Planar passivated high commutation three quadrant triac in a SOT78 (TO-220AB) plastic
package. This "series E" triac balances the requirements of commutation performance
and gate sensitivity. The "sensitive gate" "series E" is intended for interfacing with low
power drivers including microcontrollers.
1.2 Features and benefits
3Q technology for improved noise immunity
Direct interfacing with low power drivers and microcontrollers
Good immunity to false turn-on by dV/dt
High commutation capability with sensitive gate
High voltage capability
Planar passivated for voltage ruggedness and reliability
Sensitive gate for easy logic level triggering
Triggering in three quadrants only
1.3 Applications
Electronic thermostats (heating and cooling)
High power motor controls e.g. washing machines and vacuum cleaners
1.4 Quick reference data
Table 1.
Symbol
V
DRM
I
TSM
I
T(RMS)
Quick reference data
Parameter
repetitive peak off-
state voltage
non-repetitive peak on- full sine wave; T
j(init)
= 25 °C;
state current
t
p
= 20 ms;
Fig. 4; Fig. 5
RMS on-state current
full sine wave; T
mb
≤ 100 °C;
Fig. 1;
Fig. 2; Fig. 3
Static characteristics
I
GT
gate trigger current
V
D
= 12 V; I
T
= 0.1 A; T2+ G+;
T
j
= 25 °C;
Fig. 7
V
D
= 12 V; I
T
= 0.1 A; T2+ G-;
T
j
= 25 °C;
Fig. 7
2
-
10
mA
2
-
10
mA
Conditions
Min
-
-
-
Typ
-
-
-
Max
800
100
12
Unit
V
A
A
Scan or click this QR code to view the latest information for this product
NXP Semiconductors
BTA312-800E
3Q Hi-Com Triac
Symbol
Parameter
Conditions
V
D
= 12 V; I
T
= 0.1 A; T2- G-;
T
j
= 25 °C;
Fig. 7
Min
2
Typ
-
Max
10
Unit
mA
2. Pinning information
Table 2.
Pin
1
2
3
mb
Pinning information
Symbol Description
T1
T2
G
T2
main terminal 1
main terminal 2
gate
mounting base; main
terminal 2
Simplified outline
mb
Graphic symbol
T2
sym051
T1
G
1 2 3
TO-220AB (SOT78)
3. Ordering information
Table 3.
Ordering information
Package
Name
BTA312-800E
TO-220AB
Description
plastic single-ended package; heatsink mounted; 1 mounting
hole; 3-lead TO-220AB
Version
SOT78
Type number
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DRM
I
T(RMS)
I
TSM
Parameter
repetitive peak off-state voltage
RMS on-state current
non-repetitive peak on-state
current
full sine wave; T
mb
≤ 100 °C;
Fig. 1;
Fig. 2; Fig. 3
full sine wave; T
j(init)
= 25 °C;
t
p
= 20 ms;
Fig. 4; Fig. 5
full sine wave; T
j(init)
= 25 °C;
t
p
= 16.7 ms
I t
dI
T
/dt
BTA312-800E
Conditions
Min
-
-
-
-
-
-
Max
800
12
100
110
50
100
Unit
V
A
A
A
2
2
I t for fusing
rate of rise of on-state current
2
t
p
= 10 ms; SIN
I
T
= 20 A; I
G
= 0.2 A; dI
G
/dt = 0.2 A/µs
A s
A/µs
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
4 October 2012
2 / 11
NXP Semiconductors
BTA312-800E
3Q Hi-Com Triac
Symbol
I
GM
P
GM
P
G(AV)
T
stg
T
j
15
I
T(RMS )
(A)
Parameter
peak gate current
peak gate power
average gate power
storage temperature
junction temperature
Conditions
Min
-
-
Max
2
5
0.5
150
125
003a a b687
Unit
A
W
W
°C
°C
over any 20 ms period
-
-40
-
003a a b686
50
I
T(RMS )
(A)
40
10
30
5
20
10
0
-50
0
50
100
150
T
mb
(°C)
0
10
-2
10
-1
1
10
s urge duration (s )
Fig. 1.
RMS on-state current as a function of mounting
base temperature; maximum values
f = 50 Hz; T
mb
= 100 °C
Fig. 2.
RMS on-state current as a function of surge
duration; maximum values
003aab690
16
P
tot
(W)
12
conduction
angle
(degrees)
30
60
90
120
180
form
factor
a
4
2.8
2.2
1.9
1.57
α
α = 180°
120°
90°
60°
30°
8
4
0
0
3
6
9
I
T(RMS)
(A)
12
α = conduction angle
Fig. 3.
Total power dissipation as a function of RMS on-state current; maximum values
BTA312-800E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
4 October 2012
3 / 11
NXP Semiconductors
BTA312-800E
3Q Hi-Com Triac
10
3
I
TSM
(A)
(1)
003aab806
10
2
I
T
I
TSM
t
t
p
T
j(init)
= 25 °C max
10
10
-5
10
-4
10
-3
10
-2
t
p
(s)
10
-1
t
p
≤ 20 ms
(1) dI
T
/dt limit
Fig. 4.
I
TSM
(A)
100
80
60
40
20
0
120
Non-repetitive peak on-state current as a function of pulse duration; maximum values
003aab809
I
T
I
TSM
t
1/f
T
j(init)
= 25 °C max
1
10
10
2
number of cycles (n)
10
3
f = 50 Hz
Fig. 5.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
5. Thermal characteristics
Table 5.
Symbol
R
th(j-mb)
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Conditions
full cycle;
Fig. 6
half cycle;
Fig. 6
in free air
Min
-
-
-
Typ
-
-
60
Max
1.5
2
-
Unit
K/W
K/W
K/W
R
th(j-a)
BTA312-800E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
4 October 2012
4 / 11
NXP Semiconductors
BTA312-800E
3Q Hi-Com Triac
10
Z
th(j-mb)
(K/W)
1
(1)
003aab775
10
-1
(2)
10
-2
P
D
10
-3
10
-5
t
p
t
10
-4
10
-3
10
-2
10
-1
1
t
p
(s)
10
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig. 6.
Transient thermal impedance from junction to mounting base as a function of pulse duration
6. Characteristics
Table 6.
Symbol
I
GT
Characteristics
Parameter
gate trigger current
Conditions
V
D
= 12 V; I
T
= 0.1 A; T2+ G+;
T
j
= 25 °C;
Fig. 7
V
D
= 12 V; I
T
= 0.1 A; T2+ G-;
T
j
= 25 °C;
Fig. 7
V
D
= 12 V; I
T
= 0.1 A; T2- G-;
T
j
= 25 °C;
Fig. 7
I
L
latching current
V
D
= 12 V; I
G
= 0.1 A; T2+ G+;
T
j
= 25 °C;
Fig. 8
V
D
= 12 V; I
G
= 0.1 A; T2+ G-;
T
j
= 25 °C;
Fig. 8
V
D
= 12 V; I
G
= 0.1 A; T2- G-;
T
j
= 25 °C;
Fig. 8
I
H
V
T
V
GT
holding current
on-state voltage
gate trigger voltage
V
D
= 12 V; T
j
= 25 °C;
Fig. 9
I
T
= 15 A; T
j
= 25 °C;
Fig. 10
V
D
= 12 V; T
j
= 25 °C;
Fig. 11
V
D
= 400 V; T
j
= 125 °C;
Fig. 11
I
D
off-state current
V
D
= 800 V; T
j
= 125 °C
-
-
-
0.25
-
-
1.3
0.8
0.4
0.1
15
1.6
1.5
-
0.5
mA
V
V
V
mA
-
-
25
mA
-
-
30
mA
-
-
25
mA
2
-
10
mA
2
-
10
mA
Min
2
Typ
-
Max
10
Unit
mA
Static characteristics
BTA312-800E
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
4 October 2012
5 / 11
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