NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
1 of 8
B
DATE
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
S.Watanabe
CLASSIFICATION
Sep./05/’18
UNRESTRICTED
1.0
Scope
This standard summarizes the important items for using the 1.0mm staggered pitch Board to Board
connector ” BTFW series”. Before this connector is used, please be sure to look through these specifications.
2.0
Application product
Product name
Product No.
BTFW**P-*******
BTFW**R-*******
BTFW
series connector
3.0
Part numbers structure
BTFW
1
20
2
R
3
-
3
4
R
5
ST
6
G
7
E4
8
LF
9
1
2
3
4
5
Series name
Number of contact
Connector Type
P : Plug
R : Receptacle
Number of contact rows Two rows (Staggered)
Terminal type
S : Straight
R : Right angle
Terminal variation
ST : SMT without boss
SB : SMT with boss
D : Dipping type
Plating Option
G : Contact area Gold plating Terminal area: Tin plating
A : Contact area Gold plating Terminal area : Tin plating
Blank : Tin plating
Packaging
E4 : Plastic reel (SMT Type)
7 : Tray (Only for Dipping Type Rece)
Lead free
6
7
8
9
© 2016 AFCI
Form E-3727
Rev C
PDS: Rev :B
STATUS:Released
GS-01-001
Printed: Sep 18, 2018
NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
2 of 8
B
DATE
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
S.Watanabe
CLASSIFICATION
Sep./05/’18
UNRESTRICTED
4.0
Each part name
Plug connector
Housing
Receptacle connector
Housing
Contact
Contact
Mounting
Plate
Mounting
Plate
© 2016 AFCI
Form E-3727
Rev C
PDS: Rev :B
STATUS:Released
GS-01-001
Printed: Sep 18, 2018
NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
3 of 8
B
DATE
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
S.Watanabe
CLASSIFICATION
Sep./05/’18
UNRESTRICTED
5.0
5.1
Mounting method
Recommended PCB layout
Refer to drawings
Mounting method of the connector on the PCB
5.2.1 SMT Type Connector
This connector has adopted the form of automatic mounting and the surface mount match.
Therefore, please mount the connector to PCB with the automatic mounting machine.
Then, please perform reflow soldering by the following our company recommendation conditions.
1) Recommended Stencil thickness : 0.15mm
2) Recommended Reflow condition : See below
Peak temperature 240˚C max. Time 10 sec. max.
Maximum temperature on the PCB : 260˚C.
5.2
Reflow temp. [˚C]
Reflow time [sec.]
5.2.2
DIP Type Connector
Dipping type proceeds flow soldering after inserting into the PCB
1) Solder Temp. : 250˚C max
2) Soldering Time : 5sec. max.
© 2016 AFCI
Form E-3727
Rev C
PDS: Rev :B
STATUS:Released
GS-01-001
Printed: Sep 18, 2018
NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
4 of 8
B
DATE
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
S.Watanabe
CLASSIFICATION
Sep./05/’18
UNRESTRICTED
Note
1) Please take care hand soldering of rework to prevent penetrating flux on to the contacting portion.
2) Please take care hand soldering of rework, do not apply external force to the contact lead section
at the soldering iron point.
3) Please do not solder when connector is mated condition.
4) Please do not touch the contact portion by hand.
5) Please control warpage of PCB. Soldering may become poor, if PCB warpage is large.
6) Please do not give the external force beyond 0.5N to a connector before mounting.
Connector may be damaged.
7) Do not apply any forces affecting soldered joints when PC Board cut off multiple board and screw
cramp of board etc.
6.0
6.1
Cautions for operation
Mating method
Please adjust the center line of connectors and mating straight.
Mating angle is the following figure.
Mating angle: ±1.5 degree max.
Mating angle: ±5 degree max.
Center line
Center line
Center line
Center line
© 2016 AFCI
Form E-3727
Rev C
PDS: Rev :B
STATUS:Released
GS-01-001
Printed: Sep 18, 2018
NUMBER
TYPE
GS-20-0355
TITLE
Application Specification
PAGE
REVISION
5 of 8
B
DATE
BTFW series (1.0mm staggered pitch Board to Board connector)
AUTHORIZED BY
S.Watanabe
CLASSIFICATION
Sep./05/’18
UNRESTRICTED
6.2 Mating allowance
(1) X direction allowance
：±0.5mm
max.
Mating allowance: +0.5mm max.
Mating allowance: -0.5mm max.
Center condition
(2) Y direction allowance
：±0.8mm
max.
Mating allowance: +0.8mm max.
Mating allowance: -0.8mm max.
Center condition
© 2016 AFCI
Form E-3727
Rev C
PDS: Rev :B
STATUS:Released
GS-01-001
Printed: Sep 18, 2018
