The BTM510 and BTM511 are low-power Bluetooth® modules from Laird Technologies
are designed for adding robust audio and voice capabilities. Based on the market-leading
Cambridge Silicon Radio BC05 chipset, these modules provide exceptionally low power
consumption with outstanding range. Supporting the latest Bluetooth Version 2.1+EDR
specification, these modules provide the important advantage of secure simple pairing
that improves security and enhances easy use. BTM510 and BTM511 modules now come
standard with the apt-X™ audio codec for wireline-quality stereo audio.
The modules’ compact size makes them ideal for battery-powered headset form factor
audio and voice devices. With a 16-bit stereo codec and microphone inputs to support
stereo and mono applications, the modules contain a fully integrated Bluetooth-qualified
stack along with SPP, HFP 1.5, HSP, AVRCP, and A2DP profiles.
The BTM510/511 modules include an embedded 32-bit, 64-MIPS DSP core within the
BC05. This allows designers to add significant product enhancements including features
such as echo cancellation, noise reduction, and audio enhancement using additional soft
codecs. The availability of the 16 MB of flash memory in the module allows complex
functionality to be supported.
BTM510 and BTM511 modules are provided with CSR’s apt-X codec without additional
license fees. CSR’s world renowned apt-X™ audio compression solutions retain the full
integrity of original digital audio and are optimized for instant real-time audio streaming
(http://www.csr.com/products/technology/aptx).
To speed product development and integration, Laird Technologies has developed a
comprehensive AT command interface that simplifies application development, including
support for audio and headset functionality. Combined with a low-cost development kit,
Laird’s Bluetooth modules provide faster time to market.
Features and Benefits
Application Areas
USA: +1.800.492.2320
Europe: +44.1628.858.940
Asia: +852.2268.6567
wirelessinfo@lairdtech.com
www.lairdtech.com/wireless
Fully featured Bluetooth multimedia chipset
Bluetooth v2.1+EDR
Supports mono / stereo headset applications
apt-X Audio Codec provided free of charge
Adaptive frequency hopping to cope with
interference from other wireless devices
32-bit Kalimba DSP for enhanced audio applications
Support for secure simple pairing
External or internal antenna options
HSP, HFP, A2DP, and AVRCP audio profiles
16-bit stereo codec and microphone input
AptX, AAC and SBC codecs supported
CVC audio enhancement supported
EIR fully supported
Integrated audio amplifiers for driving stereo speaker
Comprehensive AT interface for simple programming
Bluetooth End Product qualified
Compact size
Class 2 output – 4 dBm
Low power operation
WLAN co-existence hardware support
High-quality stereo headsets
Mono voice headsets
Hands-free devices
Wireless audio cable
replacement
MP3 and music players
Phone accessories
VoIP products
Cordless headsets
Aftermarket automotive
applications
Bluetooth
®
Audio Modules
BTM510/511
CATEGORIES
Wireless
Specification
FEATURE
Bluetooth®
Frequency
Max Transmit Power
Receive Sensitivity
Range
Data Rates
UART Data Transfer Rate
UART
Codec
I2S / PCM
Microphone
Integrated Kalimba DSP
4 x GPIO
IMPLEMENTATION
Version 2.1+EDR
2.402 – 2.480 GHz
Class 2 - 4 dBm (at antenna pad – BTM510)
4 dBmi (from integrated antenna – BTM511)
Better than -86 dBm
Up to 30 meters
Up to 3 Mbps (over the air)
Greater than 300 Kbps
Supports DTR, DSR, DCD and RI, multiplexed with other functionality
Internal 16-bit Stereo Codec
Integrated Amplifiers for driving stereo speaker
Master / slave roles
Stereo microphone input
32-bit, 64 MIPS
Function Mapping e.g. button control
SPP (Serial Port Profile), HSP, HFP (Audio Gateway and Handset), A2DP
(Source and Sink), AVRCP (Target and Controller)
3.0 V to +3.6 V DC
1.7 V to +3.6 V DC
Operational - Less than 70 mA (including speaker amplifiers)
Idle (sleep) < 1.0 mA
2 wire and 3 wire schemes supported
Connection via SMT pad – BTM510
Multilayer ceramic – BTM511
AT Command Set (extended for audio and headset functions)
14 mm x 20 mm x 3.4 mm (SMT connector – BTM510)
14 mm x 25 mm x 3.4 mm (integrated antenna – BTM511)
-30° C to +70° C
-40° C to +85° C
Lead-free and RoHS compliant
1 Year
Development board and software tools
End Product Approved
BTM510 - Limited Modular Approval
BTM511 - Full Modular Approval
Host Interface
Audio Interfaces
DSP
Additional I/O
Profiles
Supply Voltage
Power Consumption
Coexistence
Connections
Programming API
Physical
Environmental
Miscellaneous
Developmental Tools
Approvals
Supply
I/O
Current Consumption
802.11 (WLAN)
External Antenna
Internal Antenna
Dimensions
Operating Temperature
Storage Temperature
Lead Free
Warranty
Development Kit
Bluetooth
FCC/IC & CE
Ordering Information
BTM510
BTM511
DVK-BTM510
DVK-BTM511
Bluetooth Multimedia Module (external antenna)
Bluetooth Multimedia Module (with internal antenna)
Development Kit (external antenna)
Development Kit (with internal antenna)
The details contained within the document are subject to change. Download the product specification from
www.lairdtech.com/wireless
for the most current specification.
LWS-DS-BTM510-511_0313
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and
application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies
materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the
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the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.