- General Purpose Queue: Message Status, Time Tag,
Immediate Data, Indirect Data
- Fully User-definable Interrupts
- Legacy Mode for Compatibility with ACE and
Mini-ACE Applications
Data Device Corporation
www.ddc-web.com
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-
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Remote Terminal Flexibility
- Compatibility with ACE and Mini-ACE Applications
- Multiprotocol: MIL-STD-1553A/B, STANAG-3838
- Choice of Subaddress Single Message, Double
Buffering, or Circular Buffering; or Global Circular
Buffering
- 50% and 100% Circular Buffer Rollover Interrupts
- Stack with Descriptors for Individual Messages
- Message Status, Time Tag, Command Word,
Data Pointer
- Hardware (via connector) or Software-
Programmable RT Address
- Programmable Command Illegalization
- Programmable Busy by Subaddress
- Interrupts on All Messages, or Individual Subaddresses
and/or Mode Codes
- 32-Entry Interrupt Status Queue
- Available with Option for RT AUTO-BOOT with BUSY
Bit Set for MIL-STD Applications
- Option for RT AUTO-BOOT: Initialize to RT Mode
with Busy bit Set Following Power-Up
BU-61740B3/61840B3/61860B3
REV 3 - 04/06 - WEB
True Message Monitor
- Selective Message Monitor
- Filter Based on RT Address, T/R bit, Subaddress
- True Message Monitor
- Command Stack
- Message Status, Time Tag, Command Word,
Data Pointer
- Data Stack
- All Monitored Words Following (first)
Command Word
- 50% and 100% Rollover Interrupts for Command
and Data Stacks
- 32-Entry Interrupt Status Queue
- Simultaneous RT/Message Monitor Option
Autonomous Built-In Self-Test
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Protocol Self-Test
RAM Self-Test
Online Loopback Test
Capability for CH. A-to-CH. B
Wraparound Test
- Capability to Test
Transmitter Timeout Function
Specifications
PARAMETER
POWER SUPPLY REQUIREMENTS
Voltages/Tolerance
+3.3 V (Logic)
+5 V Transceiver (Ch. A, Ch. B)
+5 V-LOGIC, 5 V-RAM
(64K RAM for 62860B3)
Current Drain (Total Hybrid)
BU-61740B3, BU-61840B3
(Operated with 3.3 V logic power)
+5 V (CH A, CH B)
0% Transmit/Monitor
25% Duty Transmitter Cycle
50% Duty Transmitter Cycle
75% Duty Transmitter Cycle
+3.3 V (Logic)
BU-61860B3
(Operated with 3.3 V logic power)
+5 V (RAM, CH A, CH B)
0% Transmit/Monitor
25% Duty Transmitter Cycle
50% Duty Transmitter Cycle
75% Duty Transmitter Cycle
+3.3 V (Logic)
POWER DISSIPATION (See Note)
Total Hybrid
BU-61740B3, BU-61840B3
(Operated with 3.3 V logic power)
0% Transmit/Monitor
25% Duty Transmitter Cycle
50% Duty Transmitter Cycle
75% Duty Transmitter Cycle
MIN TYP
MAX UNITS
PARAMETER
BU-61860B3
(Operated with 3.3 V logic power)
Idle
25% Duty Transmitter Cycle
50% Duty Transmitter Cycle
100% Duty Transmitter Cycle
Hottest Die (Transceiver chip)
0% Transmit/Monitor
25% Duty Transmitter Cycle
50% Duty Transmitter Cycle
75% Duty Transmitter Cycle
MIN TYP
MAX UNITS
3.0
4.75
4.5
3.3
5.0
5.0
3.6
5.5
5.25
V
V
V
0.44
0.80
1.17
1.53
0.80
1.09
1.39
1.68
W
W
W
W
0.18
0.48
0.78
1.09
0.28
0.58
0.88
1.18
W
W
W
W
65
180
295
410
25
100
216
332
449
40
mA
mA
mA
mA
mA
CLOCK INPUTS
Frequency:
Nominal Value
Default Mode
Option
Option
Option
THERMAL
Thermal Resistance, Junction-to-
Balls, Hottest Die (0
JC
)
Operating Balls Temperature
Operating Junction Temperature
Storage Temperature
PHYSICAL CHARACTERISTICS
Size
128-Ball BGA Package
16.0
12.0
10.0
20.0
MHz
MHz
MHz
MHz
66
174
282
390
25
120
236
352
469
40
mA
mA
mA
mA
mA
18
-40
-55
-65
22
+85
+150
+150
°C/W
°C
°C
°C
0.41
0.72
0.97
1.21
0.63
0.86
1.09
1.33
W
W
W
W
Weight
0.815 x 0.815 x 0.120
20.7 x 20.7 x 3.05
0.088
2.5
in.
mm
oz
g
Note: Power dissipation specifications assume a transformer coupled configuration with external dissipation (while transmitting) of 0.14 watts for the
active isolation transformer, 0.80 watts for the active bus coupling transformer, 0.45 watts for each of the two bus isolation resistors and 0.15 watts for
each of the two bus termination resistors.
Data Device Corporation
www.ddc-web.com
BU-61740B3/61840B3/61860B3
REV 3 - 04/06 - WEB
BU-61XX0B3-202
Test Criteria:
2 = MIL-STD-1760 Amplitude Compliant
Process Requirements:
0 = Standard DDC Processing, no Burn-In
Temperature Range**/Data Requirements:
2 = -40°C to +85°C
Voltage/Transceiver Option:
3 = +5 V, rise/fall times = 100 to 300 ns (-1553B)
Package Type:
B = 128-Ball BGA Package
Logic/RAM Voltage
(for BU-61860 version, 64K x 17K RAM voltage is always 5V)
0 = 3.3 V or 5.0 V Logic
Product Type:
BU-6174 = RT-only with 4K X 16 RAM
BU-6184 = BC/RT/MT with 4K X 16 RAM
BU-6186 = BC/RT/MT with 64K X 17 RAM
** Temperature Range applies to ball temperature
BU-61860B3-601
µ-ACE (128-ball BGA) mechanical sample, with “daisy chain” connections
of alternating balls, for use in environmental (mechanical / thermal)
integrity testing.
STANDARD DDC PROCESSING
TEST
INSPECTION
TEMPERATURE CYCLE
MIL-STD-883
METHOD(S)
2010, 2017, AND 2032
1010
B
CONDITION(S)
These products contain tin-lead solder finish as applicable to solder dip requirements.
The information in this product brief is believed to be accurate; however,
no responsibility is assumed by Data Device Corporation for its use,
and no license or rights are granted by implication or otherwise in
connection therewith. Specifications are subject to change without notice.
®
ST
ERED
www.ddc-web.com
Call DDC or visit www.ddc-web.com for a quote today:
DATA DEVICE CORPORATION
REGISTERED TO ISO 9001:2000
FILE NO. A5976
105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2482
