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BU-64843T8-E02

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Data Device Corporation

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Data Device Corporation
零件包装代码
BGA
包装说明
BGA, BGA312,13X24,40
针数
312
Reach Compliance Code
compliant
地址总线宽度
16
边界扫描
NO
总线兼容性
MIL-STD-1553
最大时钟频率
20 MHz
通信协议
MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
数据编码/解码方法
BIPH-LEVEL(MANCHESTER)
最大数据传输速率
1 MBps
外部数据总线宽度
16
JESD-30 代码
R-PBGA-B312
JESD-609代码
e0
长度
27.9 mm
低功率模式
YES
湿度敏感等级
3
串行 I/O 数
2
端子数量
312
片上数据RAM宽度
16
最高工作温度
100 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA312,13X24,40
封装形状
RECTANGULAR
封装形式
GRID ARRAY
认证状态
Not Qualified
RAM(字数)
2048
筛选级别
MIL-STD-883
座面最大高度
4.7 mm
最大压摆率
931 mA
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
HYBRID
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn63Pb37)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
15.2 mm
uPs/uCs/外围集成电路类型
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches
1
文档预览
Total-ACE
®
Complete MIL-STD-1553 Solution
Model: BU-648X3T/U/H/i8
Data Sheet
Save board space and simplify your 1553 design and layout with the world's first fully integrated MIL-STD-1553
component, complete with 1553 protocol, memory, transceivers, and isolation transformers—all in one small plastic
BGA package with direct and/or transformer coupled 1553 connections inside.
Features
•1
-
-
-
-
-
-
-
-
-
Dual Redundant MIL-STD-1553 Channel
BC, RT, MT or RT/MT Functionality
Direct and/or Transformer Coupled
Supports MIL-STD-1553 A/B & MIL-STD-1760
4K x 16 or 64K x 16 RAM
Tx Inhibit Ball for MT Only Applications
BC Disable Ball for RT Only Applications
External RT Address Inputs
MIL-STD-1760 RT Auto Boot
Simple System RT Mode
• Small 312 Ball BGA Package:
- Transformer-Coupled Component
(0.6" x 1.1") (15.2 mm x 27.9 mm)
- Direct & Transformer-Coupled Component
(0.7" x 1.1")(17.8 mm x 27.9 mm)
- 0.185" (4.7 mm) Max Height
• DO-254 Certifiable
• Leaded and
RoHS
Compliant
RoHS Versions Available
• High-Level C Software Development Kits with
Sample Code for Windows
®
, Linux
®
, and VxWorks
®
• Graphical Interface to Generate Application C
Code
• Autonomous Built-In Self-Test
• 3.3 Volt Only Operation
For more information:
www.ddc-web.com/BU-64843T
© 2008 Data Device Corporation. All trademarks are the property of their respective owners.
DDC's Data Networking Solutions
MIL-STD-1553 | ARINC 429 | Fibre Channel
As the leading global supplier of data bus components, cards, and software solutions for the military, commercial,
and aerospace markets, DDC’s data bus networking solutions encompass the full range of data interface
protocols from MIL-STD-1553 and ARINC 429 to USB, and Fibre Channel, for applications utilizing a spectrum of
form-factors including PMC, PCI, Compact PCI, PC/104, ISA, and VME/VXI.
DDC has developed its line of high-speed Fibre Channel and Extended 1553 products to support the real-time
processing of field-critical data networking netween sensors, compute notes, data storage displays, and weapons
for air, sea, and ground military vehicles.
Whether employed in increased bandwidth, high-speed serial communications, or traditional avionics and ground
support applications, DDC's data solutions fufill the expanse of military requirements including reliability,
determinism, low CPU utilization, real-time performance, and ruggedness within harsh environments. Out use of
in-house intellectual property ensures superior mutli-generational support, independent of the life cycles of
commercial devices. Moreover, we maintain software compatibility between product generations to protect our
customers' investments in software development, system testing, and end-product qualification.
MIL-STD-1553
DDC provides an assortment of quality MIL-STD-1553 commercial, military, and COTS grade cards and
components to meet your data conversion and data interface needs. DDC supplies MIL-STD-1553 board level
products in a variety of form factors including AMC, USB, PCI, cPCI, PCI-104, PCMCIA, PMC, PC/104, PC/104-
Plus, VME/VXI, and ISAbus cards. Our 1553 data bus board solutions are integral elements of military, aerospace,
and industrial applications. Our extensive line of military and space grade components provide MIL-STD-1553
interface solutions for microprocessors, PCI buses, and simple systems. Our 1553 data bus solutions are
designed into a global network of aircraft, helicopter, and missle programs.
ARINC 429
DDC also has a wide assortment of quality ARINC-429 commercial, military, and COTS grade cards and
components, which will meet your data conversion and data interface needs. DDC supplies ARINC-429 board
level products in a variety of form factors including AMC, USB, PCI, PMC, PCI-104, PC/104 Plus, and PCMCIA
boards. DDC's ARINC 429 components ensure the accurate and reliable transfer of flight-critical data. Our 429
interfaces support data bus development, validation, and the transfer of flight-critical data aboard commercial
aerospace platforms.
Fibre Channel
DDC has developed its line of high-speed Fibre Channel network access controllers and switches to support the
real-time processing demands of field-critical data networking between sensors, computer nodes, data storage,
displays, and weapons, for air, sea, and ground military vehicles. Fibre Channel's architecture is optimized to
meet the performance,reliability, and demanding environmental requirements of embedded, real time, military
applications, and designed to endure the multi-decade life cycle demands of military/aerospace programs.
DATA DEVICE CORPORATION
TOTAL-ACE™ COMPLETE MIL-STD-1553 SOLUTION
BU-64843X/64863X DATA SHEET
The information provided in this Data Sheet is belived to be accurate; however, no
responsibility is assumed by Data Device Corporation for its use, and no license or rights are
granted by implication or otherwise connection therewith.
Specifications are subject to change without notice.
Please visit our Web site at
http://www.ddc-web.com/
for the latest information.
All rights reserved. No part of this Data Sheet may be reproduced or transmitted in any
form or by any mean, electronic, mechanical photocopying recording, or otherwise,
without the prior written permission of Data Device Corporation.
105 Wilbur Place
Bohemia, New York 11716-2426
Tel: (631) 567-5600, Fax: (631) 567-7358
World Wide Web -
http://www.ddc-web.com
For Technical Support -
1-800-DDC-5757 ext. 7771
United Kingdom -
Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
France -
Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425
Germany
Tel: +49-(0)89-15 00 12-11, Fax: +49-(0)89-15 00 12-22
Japan -
Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
Asia -
Tel: +65-6489-4801
© 2008 Data Device Corp.
Data Device Corporation
www.ddc-web.com
i
DS-BU-648X3X-H
6/11
RECORD OF CHANGE
Revision
Date
Pages
Description
A
B
C
5/2009
01/2010
02/2010
All
-
1-4, 38,40 - 43,
61
D
E
F
G
3/2010
05/2010
6/2010
11/2010
All
4
3, 43
4
H
6/2011
All
Initial Release
Rev Skipped – Document Error.
Added lead-free version of product to document.
Updated figures 1, 12, &15. Updated table 1 and
tables for figures 13 & 14. Updated Ordering
Information.
64K version added.
Changed min storage temp from -55° to -65°
Updated Current Drain, Power Dissipation, and
Hottest Die specs in Table 1, Updated Table 47
renaming from “SOLDERING” to
“SOLDERING/MOUNTING” and below the
information on reflow temperatures included the
following Refer to DDC’s Application Note
#A/N49 “BGA User’s Guide” for additional
important mounting information.
Updated to new format. Updated RT-Only
information
Data Device Corporation
www.ddc-web.com
ii
DS-BU-648X3X-H
6/11
TABLE OF CONTENTS
1
PREFACE............................................................................................................. 1
1.1
1.2
1.3
1.4
1.5
Text Usage.................................................................................................................. 1
Special Handling and Cautions ................................................................................... 1
Trademarks ................................................................................................................. 1
What is included in this data sheet? ............................................................................ 1
Technical Support ....................................................................................................... 2
2
3
OVERVIEW .......................................................................................................... 3
2.1 Features ...................................................................................................................... 3
INTRODUCTION ................................................................................................ 11
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
Supporting Documentation ........................................................................................ 12
Total-ACE in Simple System RT (SSRT) Mode ......................................................... 12
Test Components ...................................................................................................... 13
Transceiverless “Compatible” Version of Total-ACE .................................................. 13
Transceivers ............................................................................................................. 13
Built-In Isolation Transformers................................................................................... 14
Register and Memory Addressing ............................................................................. 14
Internal Registers ...................................................................................................... 14
4
NON-TEST REGISTER FUNCTION SUMMARY ............................................... 31
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
4.15
4.16
4.17
4.18
4.19
4.20
4.21
Interrupt Mask Registers #1 and #2........................................................................... 31
Configuration Registers #1 and #2 ............................................................................ 31
Start/Reset Register .................................................................................................. 31
BC/RT Command Stack Register .............................................................................. 31
BC Instruction List Pointer Register ........................................................................... 31
BC Control Word/RT Subaddress Control Word Register .......................................... 31
Time Tag Register ..................................................................................................... 32
Interrupt Status Registers #1 and #2 ......................................................................... 32
Configuration Registers #3, #4, and #5 ..................................................................... 32
RT/Monitor Data Stack Address Register .................................................................. 32
BC Frame Time Remaining Register ......................................................................... 33
BC Time Remaining to Next Message Register......................................................... 33
BC Frame Time / RT Last Command / MT Trigger Word Register............................. 33
BC Initial Instruction List Point Register ..................................................................... 33
RT Status Word Register and BIT Word Registers .................................................... 33
Configuration Registers #6 and #7 ............................................................................ 33
BC Condition Code Register ..................................................................................... 34
BC General Purpose Flag Register ........................................................................... 34
BIT Test Status Register ........................................................................................... 34
BC General Purpose Queue Pointer ......................................................................... 34
RT/MT Interrupt Status Queue Pointer ...................................................................... 34
Data Device Corporation
www.ddc-web.com
iii
DS-BU-648X3X-H
6/11
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参数对比
与BU-64843T8-E02相近的元器件有:BU-64863I8-E02、BU-64863H8-E02、BU-64843I8-E02、BU-64843U8-E02。描述及对比如下:
型号 BU-64843T8-E02 BU-64863I8-E02 BU-64863H8-E02 BU-64843I8-E02 BU-64843U8-E02
描述 Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312
是否无铅 含铅 不含铅 含铅 不含铅 不含铅
是否Rohs认证 不符合 符合 不符合 符合 符合
厂商名称 Data Device Corporation Data Device Corporation Data Device Corporation Data Device Corporation Data Device Corporation
零件包装代码 BGA BGA BGA BGA BGA
包装说明 BGA, BGA312,13X24,40 BGA, BGA312,13X24,40 BGA, BGA312,13X24,40 BGA, BGA312,13X24,40 BGA, BGA312,13X24,40
针数 312 312 312 312 312
Reach Compliance Code compliant compliant compliant compliant compliant
地址总线宽度 16 16 16 16 16
边界扫描 NO NO NO NO NO
总线兼容性 MIL-STD-1553 MIL-STD-1553 MIL-STD-1553 MIL-STD-1553 MIL-STD-1553
最大时钟频率 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
通信协议 MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
数据编码/解码方法 BIPH-LEVEL(MANCHESTER) BIPH-LEVEL(MANCHESTER) BIPH-LEVEL(MANCHESTER) BIPH-LEVEL(MANCHESTER) BIPH-LEVEL(MANCHESTER)
最大数据传输速率 1 MBps 1 MBps 1 MBps 1 MBps 1 MBps
外部数据总线宽度 16 16 16 16 16
JESD-30 代码 R-PBGA-B312 R-PBGA-B312 R-PBGA-B312 R-PBGA-B312 R-PBGA-B312
JESD-609代码 e0 e1 e0 e1 e1
长度 27.9 mm 27.9 mm 27.9 mm 27.9 mm 27.9 mm
低功率模式 YES YES YES YES YES
串行 I/O 数 2 2 2 2 2
端子数量 312 312 312 312 312
片上数据RAM宽度 16 16 16 16 16
最高工作温度 100 °C 100 °C 100 °C 100 °C 100 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA
封装等效代码 BGA312,13X24,40 BGA312,13X24,40 BGA312,13X24,40 BGA312,13X24,40 BGA312,13X24,40
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM(字数) 2048 8192 8192 2048 2048
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
座面最大高度 4.7 mm 4.7 mm 4.7 mm 4.7 mm 4.7 mm
最大压摆率 931 mA 937 mA 937 mA 931 mA 931 mA
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 3 V 3 V 3 V 3 V 3 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 HYBRID HYBRID HYBRID HYBRID HYBRID
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
端子形式 BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 15.2 mm 17.8 mm 17.8 mm 17.8 mm 15.2 mm
uPs/uCs/外围集成电路类型 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches 1 1 1 - -
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