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BUS-61560-170

MIL-STD-1553B NOTICE 2 ADVANCED INTEGRATED MUX HYBRIDS WITH ENHANCED RT FEATURES (AIM-HYer)

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BUS-61559 SERIES
MIL-STD-1553B NOTICE 2
ADVANCED INTEGRATED MUX HYBRIDS
WITH ENHANCED RT FEATURES (AIM-HY’er)
DESCRIPTION
DDC’s BUS-61559 series of Advanced
Integrated Mux Hybrids with enhanced
RT Features (AIM-HY’er) comprise a
complete interface between a micro-
processor and a MIL-STD-1553B
Notice 2 bus, implementing Bus
Controller (BC), Remote Terminal (RX,
and Monitor Terminal (MT) modes.
Packaged in a single 78-pin DIP or
82-pin flat package the BUS-61559
series contains dual low-power trans-
ceivers and encoder/decoders, com-
plete BC/RT/MT protocol logic, memory
management and interrupt logic, 8K x 16
of shared static RAM, and a direct,
buffered interface to a host processor bus.
buffers to provide a direct interface to
a host processor bus. Alternatively,
the buffers may be operated in a fully
transparent mode in order to interface
to up to 64K words of external shared
RAM and/or connect directly to a com-
ponent set supporting the 20 MHz
STANAG-3910 bus.
The memory management scheme
for RT mode prevails an option for
separation of broadcast data, in com-
pliance with 1553B Notice 2. A circu-
lar buffer option for RT message data
blocks offloads the host processor for
bulk data transfer applications.
FEATURES
Complete Integrated 1553B
Notice 2 Interface Terminal
Functlonal Superset of BUS-
61553 AlM-HYSeries
Internal Address and Data
Buffers for Dlrect Interface to
Processor Bus
RT Subaddress Circular Buffers
to Support Bulk Data Transfers
Another feature besides those listed
The BUS-61559 includes a number of
to the right, is a transmitter inhibit con-
advanced features in support of
trol for the individual bus channels.
MIL-STD-1553B Notice 2 and STANAG
3838. Other salient features of the The BUS-61559 series hybrids oper-
BUS-61559 serve to provide the bene- ate over the full military temperature
fits of reduced board space require- range of -55 to +125”C and MIL-PRF-
ments enhanced software flexibility, 38534 processing is available. The
and reduced host processor overhead hybrids are ideal for demanding mili-
tary and industrial microprocessor-to-
The BUS-61559 contains internal
1553 applications
address latches and bidirectional data
Optlonal Separatlon of
RT Broadcast Data
Internal Interrupt Status and
Time Tag Registers
Internal ST Command
Illegalization
MIL-PRF-38534 Processing
Available
(ILLEGALIZATION ILLENA
ENABLE)
ILLEGALLIZATION
LOGIC
8K x 16
DUAL
PORT
RAM
BUS-25679
8
1
7
2
5
4
3
TX_INH_A
CLK IN (16MHz)
LOW-POWER
TRANSCEIVER
A
DUAL
ENCODER/
DECODER
BC/RT/MT
PROTOCOL
LOW-POWER
TRANSCEIVER
A
MEMORY DATA
DATA
BUFFERS*
D15-D∅
(PROCESSOR
DATA)
BUS-25679
8
1
7
2
5
4
3
TX_INH_A
(RT ADDRESS)
(BROADCAST
ENABLE)
(RTFAIL,
RTFLAG)
(BROADCAST,
MESSAGE
TIMING, DATA
STROBE AND ERROR
INDICATORS)
MEMORY ADDRESS
ADDRESS
LATCHES/
BUFFERS*
A15-A∅
(PROCESSOR
ADDRESS)
LATCH
CONTROL)
ADDR_LAT
(ADDRESS
RTAD 4-∅, RTADP
BRO_ENA
RTFAIL
RTFLAG
BCSTRCV, CMD_STR, TXDTA_STR
RXDTA_STR, MSG_ERR, INCMD
TRANSPARENT/BUFFERED, MSTCLR,
STRBD, SELECT, MEM/REG, RD/WR
MEMORY
IOEN, READYD
MANAGEMENT,
INT
SHARED
MEMEN-OUT,MEMWR, MEMOE
RAM/
PROCESSOR
MEMENA-IN
INTERFACE,
SSFLAG
INTERRUPT
LOGIC
TAGCLK
(PROCESSOR
CONTROL)
(INTERRUPT
REQUEST)
(MEMORY
CONTROL)
(SUBSYSTEM
FLAG)
(TIME TAG
CLOCK)
BU-61559 BLOCK DIAGRAM
© 1990, 1999 Data Device Corporation
ORDERING INFORMATION
BUS-615XX- XX0X*
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Inspection
K = One Lot Date Code
W = One Lot Date Code and PreCap Source
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, PreCap Source and 100% Pull Test
Blank = None of the Above
Process Requirements:
0 = Standard DDC Processing, no Burn-In (See page xiii.)
1 = MIL-PRF-38534 Compliant
2 = B**
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B** with PIND Testing
7 = B** with Solder Dip
8 = B** with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In (See page xiii.)
Temperature Grade/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
8 = 0°C to +70°C with Variables Test Data
Power Supply and Packaging
59 = +5 V/-15 V DDIP
60 = +5 V/-12 V DIP
69 = +5 V/-15 V Flat Pack
70 = +5 V/-12 V Flat Pack
71 = +5 V Flat Pack
*-601 version also available = MIL-STD-1760 compatible with fully compliant
MIL-PRF-38534 Processing Available
2
NOTES
3
The information in this data sheet is believed to be accurate; however, no responsibility is
assumed by Data Device Corporation for its use, and no license or rights are
granted by implication or otherwise in connection therewith.
Specifications are subject to change without notice.
105 Wilbur Place, Bohemia, New York 11716-2482
For Technical Support - 1-800-DDC-5757 ext. 7257 or 7381
Headquarters -
Tel: (631) 567-5600 ext. 7257 or 7381, Fax: (631) 567-7358
Southeast -
Tel: (703) 450-7900, Fax: (703) 450-6610
West Coast -
Tel: (714) 895-9777, Fax: (714) 895-4988
Europe -
Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
Asia/Pacific -
Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
World Wide Web -
http://www.ddc-web.com
ILC DATA DEVICE CORPORATION
REGISTERED TO ISO 9001
FILE NO. A5976
K-ABR
PRINTED IN THE U.S.A.
4
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