Intel
®
Pentium
®
4 Processor with 512-KB
L2 Cache on 0.13 Micron Process and
Intel
®
Pentium
®
4 Processor Extreme
Edition Supporting Hyper-Threading
Technology
1
Datasheet
2 GHz – 3.40 GHz Frequencies Supporting Hyper-Threading
Technology
1
at 3.06 GHz with 533 MHz System Bus and All
Frequencies with 800 MHz System Bus
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Available at 2 GHz, 2.20 GHz, 2.26 GHz,
2.40 GHz, 2.50 GHz, 2.53 GHz, 2.60 GHz,
2.66 GHz, 2.80 GHz, 3 GHz, 3.06 GHz,
3.20 GHz, and 3.40 GHz
Supports Hyper-Threading Technology
(HT Technology) at 3.06 GHz with 533 MHz
system bus and all frequencies with 800 MHz
system bus
Binary compatible with applications running
on previous members of the Intel
microprocessor line
Intel NetBurst
®
microarchitecture
System bus frequency at 400 MHz, 533 MHz,
and 800 MHz
Rapid Execution Engine: Arithmetic Logic
Units (ALUs) run at twice the processor core
frequency
Hyper-Pipelined Technology
— Advance Dynamic Execution
— Very deep out-of-order execution
Enhanced branch prediction
Optimized for 32-bit applications running on
advanced 32-bit operating systems
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8-KB Level 1 data cache
Level 1 Execution Trace Cache stores 12-K
micro-ops and removes decoder latency from
main execution loops
512-KB Advanced Transfer Cache (on-die,
full-speed Level 2 (L2) cache) with 8-way
associativity and Error Correcting Code
(ECC)
2-MB Integrated Level 3 (L3) cache with
8-way associativity that is supported by Intel
®
Pentium
®
4 Processor Extreme Edition
Supporting Hyper-Threading Technology
144 Streaming SIMD Extensions 2 (SSE2)
instructions
Enhanced floating point and multimedia unit
for enhanced video, audio, encryption, and
3D performance
Power Management capabilities
— System Management mode
— Multiple low-power states
8-way cache associativity provides improved
cache hit rate on load/store operations
478-Pin Package
The Intel
®
Pentium
®
4 processor family supporting Hyper-Threading Technology
1
(HT Technology) delivers Intel's most advanced, most powerful processors for desktop PCs and
entry-level workstations, which are based on the Intel NetBurst
®
microarchitecture. The
Pentium 4 processor is designed to deliver performance across applications and usages where
end-users can truly appreciate and experience the performance. These applications include
Internet audio and streaming video, image processing, video content creation, speech, 3D, CAD,
games, multimedia, and multitasking user environments. The Intel
®
Pentium
®
4 processor
Extreme Edition supporting HT Technology features 2 MB of L3 cache and offers high levels of
performance targeted specifically for high-end gamers and computing power users.
February 2004
Document Number: 298643-012
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Pentium
®
4 processor on 0.13 micron process may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Hyper-Threading Technology requires a computer system with an Intel
®
Pentium
®
4 processor supporting HT Technology and a Hyper-Threading
Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See
<<http://www.intel.com/info/hyperthreading/>> for more information including details on which processors support HT Technology.
Intel, Pentium, Intel NetBurst, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States
and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2001–2004, Intel Corporation
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Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet
Contents
1
Introduction
.................................................................................................................. 9
1.1
1.2
Terminology.........................................................................................................11
1.1.1 Processor Packaging Terminology.........................................................11
References ..........................................................................................................12
System Bus and GTLREF ...................................................................................15
Power and Ground Pins ......................................................................................15
Decoupling Guidelines ........................................................................................16
2.3.1 VCC Decoupling .....................................................................................16
2.3.2 System Bus AGTL+ Decoupling.............................................................16
Voltage Identification ...........................................................................................16
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18
Reserved, Unused Pins, and TESTHI[12:0]........................................................20
System Bus Signal Groups .................................................................................21
Asynchronous GTL+ Signals...............................................................................22
Test Access Port (TAP) Connection....................................................................22
System Bus Frequency Select Signals (BSEL[1:0])............................................22
Maximum Ratings................................................................................................23
Processor DC Specifications...............................................................................23
AGTL+ System Bus Specifications .....................................................................35
Package Load Specifications ..............................................................................40
Processor Insertion Specifications ......................................................................41
Processor Mass Specifications ...........................................................................41
Processor Materials.............................................................................................41
Processor Markings.............................................................................................42
Processor Pin Assignments ................................................................................45
Signal Descriptions..............................................................................................58
Processor Thermal Specifications.......................................................................68
5.1.1 Thermal Specifications ...........................................................................68
5.1.2 Thermal Metrology .................................................................................70
5.1.2.1 Processor Case Temperature Measurement ............................70
Power-On Configuration Options ........................................................................71
Clock Control and Low Power States..................................................................71
6.2.1 Normal State—State 1 ...........................................................................71
6.2.2 AutoHALT Powerdown State—State 2...................................................72
6.2.3 Stop-Grant State—State 3 .....................................................................73
6.2.4 HALT/Grant Snoop State—State 4 ........................................................73
6.2.5 Sleep State—State 5..............................................................................74
2
Electrical Specifications
........................................................................................15
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
3
Package Mechanical Specifications
.................................................................37
3.1
3.2
3.3
3.4
3.5
4
Pin Lists and Signal Descriptions
.....................................................................45
4.1
4.2
5
Thermal Specifications and Design Considerations
.................................67
5.1
6
Features
.......................................................................................................................71
6.1
6.2
Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet
3
6.3
Thermal Monitor .................................................................................................. 74
6.3.1 Thermal Diode........................................................................................ 76
Introduction ......................................................................................................... 77
Mechanical Specifications................................................................................... 78
7.2.1 Boxed Processor Cooling Solution Dimensions ..................................... 78
7.2.2 Boxed Processor Fan Heatsink Weight.................................................. 79
7.2.3 Boxed Processor Retention Mechanism and Heatsink Assembly.......... 79
Electrical Requirements ...................................................................................... 80
7.3.1 Fan Heatsink Power Supply ................................................................... 80
Thermal Specifications........................................................................................ 82
7.4.1 Boxed Processor Cooling Requirements ............................................... 82
7.4.2 Variable Speed Fan ............................................................................... 83
Logic Analyzer Interface (LAI)............................................................................. 85
8.1.1 Mechanical Considerations .................................................................... 85
8.1.2 Electrical Considerations........................................................................ 85
7
Boxed Processor Specifications
....................................................................... 77
7.1
7.2
7.3
7.4
8
Debug Tools Specifications
................................................................................. 85
8.1
4
Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet
Figures
2-1
2-2
2-3
2-4
2-5
2-6
2-7
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
5-1
5-2
6-1
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
V
CC
VID Pin Voltage and Current Requirements .................................................17
Typical VCCIOPLL, VCCA and VSSA Power Distribution ..................................19
Phase Lock Loop (PLL) Filter Requirements ......................................................19
V
CC
Static and Transient Tolerance (For Intel
®
Pentium
®
4
Processor With 512-KB L2 Cache on 0.13 Micron Process)...............................29
V
CC
Static and Transient Tolerance (For Intel
®
Pentium
®
4
Processor Extreme Edition Supporting Hyper-Threading Technology)...............31
ITPCLKOUT[1:0] Output Buffer Diagram ............................................................34
Test Circuit ..........................................................................................................35
Exploded View of Processor Components on a System Board ..........................37
Processor Package .............................................................................................38
Processor Cross-Section and Keep-In ................................................................39
Processor Pin Detail............................................................................................39
IHS Flatness Specification ..................................................................................40
Processor Markings (Processors with Fixed VID) ...............................................42
Processor Markings (Processors with Multiple VID) ...........................................42
The Coordinates of the Processor Pins As Viewed from the Top
of the Package ....................................................................................................43
Example Thermal Solution (Not to Scale) ...........................................................67
Guideline Locations for Case Temperature (TC) Thermocouple Placement ......70
Stop Clock State Machine ...................................................................................72
Mechanical Representation of the Boxed Processor ..........................................77
Side View Space Requirements for the Boxed Processor ..................................78
Top View Space Requirements for the Boxed Processor ...................................79
Boxed Processor Fan Heatsink Power Cable Connector Description.................80
MotherBoard Power Header Placement Relative to Processor Socket ..............81
Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 1 View) .......................................................................................................82
Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 2 View) .......................................................................................................83
Boxed Processor Fan Heatsink Set Points .........................................................83
Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet
5
