Intel
®
Pentium
®
D Processor 800
Δ
Sequence
Datasheet
– On 90 nm Process in the 775-land LGA Package and supporting
Intel
®
Extended Memory 64 Technology
Φ
February 2006
Document Number: 307506-003
Contents
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future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Pentium
®
D processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
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for details.
Intel
®
Extended Memory 64 Technology (Intel
®
EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device
drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.
Performance will vary depending on your hardware and software configurations. See
http://www.intel.com/info/em64t
for more information including
details on which processors support EM64T or consult with your system vendor for more information.
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Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
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Copyright © 2005–2006 Intel Corporation.
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2
Datasheet
Contents
Contents
1
Introduction.................................................................................................................................... 11
1.1
1.2
2
2.1
2.2
Terminology ........................................................................................................................ 12
1.1.1 Processor Packaging Terminology ........................................................................ 12
References ......................................................................................................................... 13
Power and Ground Lands................................................................................................... 15
Decoupling Guidelines........................................................................................................ 15
2.2.1 VCC Decoupling .................................................................................................... 15
2.2.2 VTT Decoupling ..................................................................................................... 15
2.2.3 FSB Decoupling ..................................................................................................... 16
Voltage Identification .......................................................................................................... 16
Reserved, Unused, FC and TESTHI Signals...................................................................... 18
Voltage and Current Specifications .................................................................................... 19
2.5.1 Absolute Maximum and Minimum Ratings............................................................. 19
2.5.2 DC Voltage and Current Specifications .................................................................19
2.5.3 VCC Overshoot Specification ................................................................................ 25
2.5.4 Die Voltage Validation ........................................................................................... 26
Signaling Specifications...................................................................................................... 26
2.6.1 FSB Signal Groups ................................................................................................ 26
2.6.2 GTL+ Asynchronous Signals ................................................................................. 28
2.6.3 FSB DC Specifications .......................................................................................... 29
Clock Specifications............................................................................................................ 32
2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 32
2.7.2 FSB Frequency Select Signals .............................................................................. 32
2.7.3 Phase Lock Loop (PLL) and Filter ......................................................................... 33
Package Mechanical Drawing ............................................................................................ 35
Processor Component Keep-Out Zones............................................................................. 39
Package Loading Specifications......................................................................................... 39
Package Handling Guidelines............................................................................................. 39
Package Insertion Specifications........................................................................................ 40
Processor Mass Specification............................................................................................. 40
Processor Materials ............................................................................................................ 40
Processor Markings ............................................................................................................ 40
Processor Land Coordinates ..............................................................................................42
Processor Land Assignments ............................................................................................. 43
Alphabetical Signals Reference .......................................................................................... 66
Processor Thermal Specifications ...................................................................................... 75
5.1.1 Thermal Specifications .......................................................................................... 75
5.1.2 Thermal Metrology ................................................................................................. 79
Electrical Specifications ................................................................................................................. 15
2.3
2.4
2.5
2.6
2.7
3
Package Mechanical Specifications ..............................................................................................35
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4
Land Listing and Signal Descriptions ............................................................................................ 43
4.1
4.2
5
Thermal Specifications and Design Considerations ...................................................................... 75
5.1
Datasheet
3
Contents
5.2
Processor Thermal Features .............................................................................................. 79
5.2.1 Thermal Monitor..................................................................................................... 79
5.2.2 On-Demand Mode ................................................................................................. 80
5.2.3 PROCHOT# Signal................................................................................................ 80
5.2.4 FORCEPR# Signal Pin .......................................................................................... 81
5.2.5 THERMTRIP# Signal............................................................................................. 82
5.2.6 T
CONTROL
and Fan Speed Reduction.................................................................... 82
5.2.7 Thermal Diode ....................................................................................................... 82
Power-On Configuration Options........................................................................................ 85
Clock Control and Low Power States ................................................................................. 85
6.2.1 Normal State.......................................................................................................... 86
6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 86
6.2.3 Stop-Grant State.................................................................................................... 87
6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88
6.2.5 Enhanced Intel SpeedStep
®
Technology .............................................................. 88
Mechanical Specifications .................................................................................................. 90
7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 90
7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 91
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly....... 91
Electrical Requirements...................................................................................................... 91
7.2.1 Fan Heatsink Power Supply .................................................................................. 91
Thermal Specifications ....................................................................................................... 93
7.3.1 Boxed Processor Cooling Requirements............................................................... 93
7.3.2 Variable Speed Fan ............................................................................................... 95
Mechanical Specifications .................................................................................................. 98
8.1.1 Cooling Solution Dimensions................................................................................. 98
8.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 98
8.1.3 Boxed Processor Support and Retention Module (SRM) ...................................... 99
Electrical Requirements...................................................................................................... 99
8.2.1 Fan Heatsink Power Supply .................................................................................. 99
Thermal Specifications ..................................................................................................... 101
8.3.1 Boxed Processor Cooling Requirements............................................................. 101
8.3.2 Variable Speed Fan ............................................................................................. 102
Logic Analyzer Interface (LAI) .......................................................................................... 105
9.1.1 Mechanical Considerations.................................................................................. 105
9.1.2 Electrical Considerations ..................................................................................... 105
6
Features ........................................................................................................................................ 85
6.1
6.2
7
Boxed Processor Specifications .................................................................................................... 89
7.1
7.2
7.3
8
Balanced Technology Extended (BTX) Type I Boxed Processor Specifications........................... 97
8.1
8.2
8.3
9
Debug Tools Specifications ......................................................................................................... 105
9.1
4
Datasheet
Contents
Figures
2-1
2-2
2-3
2-4
3-1
3-2
3-3
3-4
3-5
3-6
3-7
4-1
4-2
5-1
5-2
5-3
6-1
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
7-9
8-1
8-2
8-3
8-4
8-5
8-6
VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor............ 22
VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor............ 24
VCC Overshoot Example Waveform .......................................................................................... 25
Phase Lock Loop (PLL) Filter Requirements.............................................................................. 34
Processor Package Assembly Sketch ........................................................................................ 35
Processor Package Drawing 1 ................................................................................................... 36
Processor Package Drawing 2 ................................................................................................... 37
Processor Package Drawing 3 ................................................................................................... 38
Processor Top-Side Marking Example (Intel
®
Pentium
®
D Processors 840, 830, 820) ............. 40
Processor Top-Side Marking Example (Intel
®
Pentium
®
D Processor 805)............................... 41
Processor Land Coordinates, Top View ..................................................................................... 42
Landout Diagram (Top View – Left Side).................................................................................... 44
Landout Diagram (Top View – Right Side) ................................................................................. 45
Thermal Profile for the Pentium D Processor with PRB=1 ......................................................... 77
Thermal Profile for the Pentium D Processor with PRB=0 ......................................................... 78
Case Temperature (TC) Measurement Location ........................................................................ 79
Processor Low Power State Machine......................................................................................... 86
Mechanical Representation of the Boxed Processor.................................................................. 89
Side View Space Requirements for the Boxed Processor (Applies to all four side views) ......... 90
Top View Space Requirements for the Boxed Processor........................................................... 90
Overall View Space Requirements for the Boxed Processor ..................................................... 91
Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92
Baseboard Power Header Placement Relative to Processor Socket ......................................... 93
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ........................ 94
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ........................ 94
Boxed Processor Fan Heatsink Set Points................................................................................. 95
Mechanical Representation of the Boxed Processor.................................................................. 97
Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes .......... 98
Assembly Stack Including the Support and Retention Module ................................................... 99
Boxed Processor Fan Heatsink Power Cable Connector .........................................................100
Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) 101
Boxed Processor TMA Set Points ............................................................................................102
Datasheet
5
