Intel
®
Pentium
®
D Processor 900
∆
Sequence and Intel
®
Pentium
®
∆
Processor Extreme Edition 955
Datasheet
– On 65 nm Process in the 775-land LGA Package and supporting
Intel
®
Extended Memory 64 Technology
Φ
, and supporting Intel
®
Virtualization Technology
±
January 2006
Document Number: 310306-002
Contents
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future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Pentium D processor 900 sequence and Intel
®
Pentium processor Extreme Edition 955 may contain design defects or errors known as
errata which may cause the product to deviate from published specifications.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
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†
∆
Hyper-Threading Technology requires a computer system with an Intel
®
Pentium
®
4 processor supporting HT Technology and a HT Technology
enabled chipset, BIOS, and an operating system. Performance will vary depending on the specific hardware and software you use. See <http://
www.intel.com/info/hyperthreading> for information.
Intel
®
Extended Memory 64 Technology (Intel
®
EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device
drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.
Performance will vary depending on your hardware and software configurations. See www.intel.com/info/em64t for more information including details
on which processors support EM64T or consult with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.
Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
Enhanced HALT State (C1E) and Enhanced Intel SpeedStep
®
Technology (EIST) for specified units of this processor available Q2/06. See the
Processor Spec Finder at
http://processorfinder.intel.com
or contact your Intel representative for more information.
±
Intel
®
Φ
Virtualization Technology requires a computer system with an enabled Intel
®
processor, BIOS, virtual machine monitor (VMM) and for some
uses, certain platform software enabled for it. Functionality, performance or other benefit will vary depending on hardware and software configurations.
Intel Virtualization Technology-enabled BIOS and VMM applications are currently in development.
Intel, Pentium, Intel NetBurst Intel SpeedStep, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005–2006 Intel Corporation.
2
Datasheet
Contents
Contents
1
Introduction..................................................................................................................................
11
1.1
1.2
2
2.1
2.2
Terminology ........................................................................................................................ 12
1.1.1 Processor Packaging Terminology ........................................................................ 12
References ......................................................................................................................... 13
Power and Ground Lands................................................................................................... 15
Decoupling Guidelines........................................................................................................ 15
2.2.1 V
CC
Decoupling ..................................................................................................... 15
2.2.2 V
TT
Decoupling ...................................................................................................... 15
2.2.3 FSB Decoupling ..................................................................................................... 16
Voltage Identification .......................................................................................................... 16
Reserved, Unused, and TESTHI Signals ........................................................................... 18
Voltage and Current Specification ...................................................................................... 19
2.5.1 Absolute Maximum and Minimum Ratings............................................................. 19
2.5.2 DC Voltage and Current Specification ................................................................... 20
2.5.3 VCC Overshoot...................................................................................................... 24
2.5.4 Die Voltage Validation ........................................................................................... 24
Signaling Specifications...................................................................................................... 25
2.6.1 FSB Signal Groups ................................................................................................ 25
2.6.2 GTL+ Asynchronous Signals ................................................................................. 27
2.6.3 Processor DC Specifications ................................................................................. 28
2.6.3.1 GTL+ Front Side Bus Specifications ...................................................... 30
Clock Specifications............................................................................................................ 31
2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking .................................. 31
2.7.2 FSB Frequency Select Signals (BSEL[2:0])........................................................... 32
2.7.3 Phase Lock Loop (PLL) and Filter ......................................................................... 32
2.7.4 BCLK[1:0] Specifications ....................................................................................... 34
Package Mechanical Drawing ............................................................................................ 35
Processor Component Keep-Out Zones............................................................................. 39
Package Loading Specifications......................................................................................... 39
Package Handling Guidelines............................................................................................. 39
Package Insertion Specifications........................................................................................ 40
Processor Mass Specification............................................................................................. 40
Processor Materials ............................................................................................................ 40
Processor Markings ............................................................................................................ 40
Processor Land Coordinates ..............................................................................................42
Processor Land Assignments ............................................................................................. 43
Alphabetical Signals Reference .......................................................................................... 66
Processor Thermal Specifications ...................................................................................... 75
5.1.1 Thermal Specifications .......................................................................................... 75
Electrical Specifications
............................................................................................................. 15
2.3
2.4
2.5
2.6
2.7
3
Package Mechanical Specifications
.......................................................................................... 35
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4
Land Listing and Signal Descriptions
....................................................................................... 43
4.1
4.2
5
Thermal Specifications and Design Considerations................................................................
75
5.1
Datasheet
3
Contents
5.2
5.1.2 Thermal Metrology................................................................................................. 79
Processor Thermal Features .............................................................................................. 79
5.2.1 Thermal Monitor..................................................................................................... 79
5.2.2 On-Demand Mode ................................................................................................. 80
5.2.3 PROCHOT# Signal................................................................................................ 81
5.2.4 FORCEPR# Signal ................................................................................................ 81
5.2.5 THERMTRIP# Signal............................................................................................. 82
5.2.6 T
CONTROL
and Fan Speed Reduction.................................................................... 82
5.2.7 Thermal Diode ....................................................................................................... 82
Power-On Configuration Options........................................................................................ 85
Clock Control and Low Power States ................................................................................. 86
6.2.1 Normal State.......................................................................................................... 86
6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 86
6.2.2.1 HALT Powerdown State......................................................................... 87
6.2.2.2 Enhanced HALT Powerdown State ....................................................... 87
6.2.3 Stop Grant State .................................................................................................... 87
6.2.4 Enhanced HALT Snoop or HALT Snoop State,
Stop Grant Snoop State......................................................................................... 88
6.2.4.1 HALT Snoop State, Stop Grant Snoop State......................................... 88
6.2.4.2 Enhanced HALT Snoop State................................................................ 88
6.2.5 Enhanced Intel SpeedStep
®
Technology .............................................................. 88
Mechanical Specifications .................................................................................................. 92
7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 92
7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 93
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly............................................................................................. 93
Electrical Requirements...................................................................................................... 93
7.2.1 Fan Heatsink Power Supply .................................................................................. 93
Thermal Specifications ....................................................................................................... 95
7.3.1 Boxed Processor Cooling Requirements............................................................... 95
Mechanical Specifications .................................................................................................. 98
8.1.1 BTX Type I and Type II Boxed Processor Cooling Solution Dimensions .............. 98
8.1.2 Boxed Processor Thermal Module Assembly Weight.......................................... 100
8.1.3 Boxed Processor Support and Retention Module (SRM) .................................... 100
Electrical Requirements.................................................................................................... 101
8.2.1 Thermal Module Assembly Power Supply ........................................................... 101
Thermal Specifications ..................................................................................................... 103
8.3.1 Boxed Processor Cooling Requirements............................................................. 103
8.3.2 Variable Speed Fan ............................................................................................. 104
Logic Analyzer Interface (LAI) .......................................................................................... 107
9.1.1 Mechanical Considerations.................................................................................. 107
9.1.2 Electrical Considerations ..................................................................................... 107
6
Features........................................................................................................................................
85
6.1
6.2
7
Boxed Processor Specifications................................................................................................
91
7.1
7.2
7.3
8
Balanced Technology Extended (BTX) Boxed Processor Specifications..............................
97
8.1
8.2
8.3
9
Debug Tools Specifications
..................................................................................................... 107
9.1
4
Datasheet
Contents
Figures
2-1 V
CC
Static and Transient Tolerance for 775_VR_CONFIG_05A and 775_VR_CONFIG_05B Pro-
cessors23
2-2 V
CC
Overshoot Example Waveform ........................................................................................... 24
2-3 Phase Lock Loop (PLL) Filter Requirements.............................................................................. 33
3-1 Processor Package Assembly Sketch ........................................................................................ 35
3-2 Processor Package Drawing Sheet 1 of 3 .................................................................................. 36
3-3 Processor Package Drawing Sheet 2 of 3 .................................................................................. 37
3-4 Processor Package Drawing Sheet 3 of 3 .................................................................................. 38
3-5 Processor Top-Side Markings Example (Intel
®
Pentium
®
D Processor 900 Sequence)............ 40
3-6 Processor Top-Side Markings Example (Intel
®
Pentium
®
Processor Extreme Edition 955) ...... 41
3-7 Processor Land Coordinates and Quadrants (Top View) ........................................................... 42
4-1 land-out Diagram (Top View – Left Side).................................................................................... 44
4-2 land-out Diagram (Top View – Right Side) ................................................................................. 45
5-1 Thermal Profile for 775_VR_CONFIG_05B Processors............................................................. 77
5-2 Thermal Profile for 775_VR_CONFIG_05A Processors............................................................. 78
5-3 Case Temperature (TC) Measurement Location ........................................................................ 79
6-1 Processor Low Power State Machine......................................................................................... 86
7-1 Mechanical Representation of the Boxed Processor.................................................................. 91
7-2 Space Requirements for the Boxed Processor (Side View: applies to all four side views) ........ 92
7-3 Space Requirements for the Boxed Processor (Top View) ........................................................ 92
7-4 Space Requirements for the Boxed Processor (Overall View) ................................................... 93
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 94
7-6 Baseboard Power Header Placement Relative to Processor Socket ......................................... 95
7-7 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 1 View) .............................................................................................................................. 96
7-8 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 2 View) .............................................................................................................................. 96
8-1 Mechanical Representation of the Boxed Processor with a Type I TMA.................................... 97
8-2 Mechanical Representation of the Boxed Processor with a Type II TMA................................... 98
8-3 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes .......... 99
8-4 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume .........100
8-5 Assembly Stack Including the Support and Retention Module .................................................101
8-6 Boxed Processor TMA Power Cable Connector Description....................................................102
8-7 Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)103
8-8 Boxed Processor TMA Set Points ............................................................................................104
Datasheet
5
