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© Nexperia B.V. (year). All rights reserved.
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BZB100A
Bidirectional Zener diode
Rev. 02 — 24 June 2008
Product data sheet
1. Product profile
1.1 General description
Bidirectional Zener diode in a SOD323 (SC-76) very small Surface-Mounted
Device (SMD) plastic package.
1.2 Features
I
I
I
I
Non-repetitive peak reverse power dissipation: P
ZSM
≤
30 W
Bidirectional configuration
Small plastic package suitable for surface-mounted design
AEC-Q101 qualified
1.3 Applications
I
General regulation functions
I
Overvoltage protection for ElectroLuminescent (EL) driver circuits
1.4 Quick reference data
Table 1.
Symbol
Per device
V
Z
I
ZSM
[1]
Quick reference data
Parameter
working voltage
non-repetitive peak reverse
current
Conditions
I
Z
= 1 mA
[1]
Min
95
-
Typ
-
-
Max
105
0.23
Unit
V
A
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
2. Pinning information
Table 2.
Pin
1
2
Pinning
Description
cathode (diode 1)
cathode (diode 2)
1
2
1
2
006aab041
Simplified outline
Graphic symbol
NXP Semiconductors
BZB100A
Bidirectional Zener diode
3. Ordering information
Table 3.
Ordering information
Package
Name
BZB100A
SC-76
Description
plastic surface-mounted package; 2 leads
Version
SOD323
Type number
4. Marking
Table 4.
BZB100A
Marking codes
Marking code
AT
Type number
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per device
I
ZSM
P
ZSM
P
tot
non-repetitive peak reverse
current
non-repetitive peak reverse
power dissipation
total power dissipation
T
amb
≤
25
°C
[1]
Parameter
Conditions
Min
-
-
-
-
-
-
-
−55
−65
Max
0.23
30
75
300
540
830
150
+150
+150
Unit
A
W
W
mW
mW
mW
°C
°C
°C
[1]
[2]
[3]
[4]
[5]
T
j
T
amb
T
stg
[1]
[2]
[3]
[4]
[5]
junction temperature
ambient temperature
storage temperature
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
t
p
= 10
µs;
square wave; T
j
= 25
°C
prior to surge
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
BZB100A_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 24 June 2008
2 of 10
NXP Semiconductors
BZB100A
Bidirectional Zener diode
1.0
P
tot
(W)
0.8
(1)
006aab042
0.6
(2)
0.4
(3)
0.2
0
−75
−25
25
75
125
175
T
amb
(°C)
(1) Ceramic PCB, Al
2
O
3
, standard footprint
(2) FR4 PCB, mounting pad for cathode 1 cm
2
(3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
6. Thermal characteristics
Table 6.
Symbol
Per device
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
[2]
[3]
Thermal characteristics
Parameter
Conditions
Min
-
-
-
-
Typ
-
-
-
-
Max
415
230
150
90
Unit
K/W
K/W
K/W
K/W
R
th(j-sp)
[1]
[2]
[3]
[4]
thermal resistance from
junction to solder point
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
Soldering point of cathode tab.
BZB100A_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 24 June 2008
3 of 10
NXP Semiconductors
BZB100A
Bidirectional Zener diode
7. Characteristics
Table 7.
Characteristics
T
j
= 25
°
C unless otherwise specified.
Symbol
Per device
V
Z
r
dif
I
R
S
Z
C
d
working voltage
differential resistance
reverse current
temperature coefficient
diode capacitance
I
Z
= 1 mA
I
Z
= 1 mA
V
R
= 76 V
I
Z
= 1 mA
f = 1 MHz;
V
R
= 0 V
95
-
-
-
-
-
-
-
123
-
105
700
0.05
-
10
V
Ω
µA
mV/K
pF
Parameter
Conditions
Min
Typ
Max
Unit
10
3
P
ZSM
(W)
10
2
006aab043
150
S
Z
(mV/K)
140
006aab044
130
120
10
110
1
10
−5
10
−4
10
−3
t
p
(s)
10
−2
100
0
1
2
3
4
I
Z
(mA)
5
T
j
= 25
°C
(prior to surge)
T
j
= 25
°C
to 150
°C
Fig 2.
Non-repetitive peak reverse power dissipation
as a function of pulse duration; maximum
values
Fig 3.
Temperature coefficient as a function of
working current; typical values
BZB100A_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 24 June 2008
4 of 10
