BZG05C...
Silicon Z–Diodes
Features
D
D
D
D
D
Glass passivated junction
High reliability
Voltage range 3.3V to 15V
Fits onto 5 mm SMD footpads
Wave and reflow solderable
Applications
Voltage stabilization
94 9535
Absolute Maximum Ratings
T
j
= 25
_
C
Parameter
Power dissipation
p
Non repetitive peak surge
power dissipation
Junction temperature
Storage temperature range
Test Conditions
R
thJA
<30K/W, T
amb
=60
°
C
R
thJA
<100K/W, T
amb
=25
°
C
t
p
=100
m
s sq.pulse, T
j
=25
°
C
prior to surge
Type
Symbol
P
V
P
V
P
ZSM
T
j
T
stg
Value
3
1.25
60
150
–65...+150
Unit
W
W
W
°
C
°
C
Maximum Thermal Resistance
T
j
= 25
_
C
Parameter
Junction lead
Junction ambient
Test Conditions
mounted on epoxy–glass hard tissue, Fig. 1a
mounted on epoxy–glass hard tissue, Fig. 1b
mounted on Al–oxid–ceramic (Al
2
O
3
), Fig. 1b
Symbol
R
thJL
R
thJA
R
thJA
R
thJA
Value
30
150
125
100
Unit
K/W
K/W
K/W
K/W
Characteristics
T
j
= 25
_
C
Parameter
Forward voltage
Test Conditions
I
F
=0.2A
Type
Symbol
V
F
Min
Typ
Max
1.2
Unit
V
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
1 (5)
BZG05C...
Type
BZG05C...
BZG05C
3V3
3V6
3V9
4V3
4V7
5V1
5V6
6V2
6V8
7V5
8V2
9V1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
Min.
3.1
3.4
3.7
4.0
4.4
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28
31
34
V
z
V
Max.
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32
35
38
r
zj
W
Max.
25
25
20
15
15
15
10
5
4
3.5
6
6
8
10
10
12
20
20
25
30
30
30
35
35
40
45
TK
vz
at I
z
%/K
mA
Typ. Max.
–0.08 –0.05
80
–0.08 –0.05
60
–0.07 –0.02
60
–0.07 –0.01
50
–0.03 0.04
45
–0.01 0.04
45
0.00
0.05
45
0.01
0.06
35
0.02
0.06
35
0.02
0.07
35
0.03
0.07
25
0.04
0.08
25
0.04
0.08
25
0.05
0.08
20
0.05
0.09
20
0.05
0.09
20
0.06
0.09
15
0.06
0.09
15
0.06
0.09
15
0.06
0.09
10
0.06 0.095
10
0.06 0.095
10
0.06 0.095
8
0.06 0.095
8
0.06 0.095
8
0.06 0.095
8
r
zk
at I
zk
W
mA
Max.
500
1
500
1
500
1
500
1
500
1
500
1
400
1
300
1
300
1
200
0.5
200
0.5
200
0.5
200
0.5
300
0.5
350
0.5
400
0.5
500
0.5
500
0.5
500
0.5
600
0.5
600
0.5
600
0.5
750
0.25
1000
0.25
1000
0.25
1000
0.25
I
R
at V
R
m
A
V
Max.
40
1
20
1
10
1
3
1
3
1
1
1.5
1
2
1
3
1
4
1
4.5
1
6.2
1
6.8
0.5
7.5
0.5
8.2
0.5
9.1
0.5
10
0.5
11
0.5
12
0.5
13
0.5
15
0.5
16
0.5
18
0.5
20
0.5
22
0.5
24
0.5
27
2 (5)
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
BZG05C...
Typical Characteristics (T
j
= 25
_
C unless otherwise specified)
a)
b)
5.0
2.0
1.5
10.0
2.6
2.0
2.4
2.2
7.0
2.4
25.0
94 9313
1.0
94 9314
25.0
Figure 1. Boards for R
thJA
definition (copper overlay 35
m
)
Figure 2. Recommended foot pads (in mm)
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
3 (5)
BZG05C...
Dimensions in mm
2.2
1.5
2.1
technical drawings
according to DIN
specifications
4.75
5.45
5.15
Plastic Case
JEDEC DO 214 AC
SOD 106 A
Cathode indicated by a Band
4.57
2.55
2.45
2.65
2.50
1.45
1.30
0.2
0.17
0.05
94 9534
4 (5)
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
BZG05C...
Ozone Depleting Substances Policy Statement
It is the policy of
TEMIC TELEFUNKEN microelectronic GmbH
to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH
semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC
can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
5 (5)
