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Product Bulletin

Surface Mount Ceramic Chip Capacitors – C0G Dielectric

Outline Drawing

ELECTRODES

NICKEL PLATE

CONDUCTIVE METALLIZATION

TIN PLATE

Dimensions - Millimeters (Inches)

EIA SIZE

CODE

0402

0603

0805

1206

1210

METRIC

SIZE CODE

1005

1608

2012

3216

3225

L - LENGTH

W - WIDTH

B - BANDWIDTH

SEPARATION

minimum

0.3 (.012)

0.7 (.028)

0.75 (.030)

N/A

Solder Wave +

Solder Reflow

MOUNTING

TECHNIQUE

Solder Reflow

1.0 (.04) ± .05 (.002)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

0.5 (.02) ± .05 (.002)

0.8 (.032) ± .15 (.006)

1.25 (.049) ± .20 (.008)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

0.20 (.008) -.40 (.016)

0.35 (.014) ± .15 (.006)

0.50 (.02) ± .25 (.010)

See Capacitance Value Chart below for thickness dimension.

+ For extended values 1210 case sizes - solder reflow only.

Electrical Parameters

As detailed in the KEMET Surface Mount Catalog F3102 for C0G, with following specific requirements based on room

temperature (25°C) parameters:

• Operating Range: -55°C to +125°C, with no-bias capacitance shift limited to ± 30 PPM/°C over that range.

• Insulation Resistance (IR) measured after 2 minutes at rated voltage @ 25°C: Limit is 1000 megohm microfarads or

100GΩ, whichever is less.

• Capacitance and Dissipation Factor (DF) measured at the following conditions.

Capacitance - 1 kHz and 1 vrms if capacitance >1000 pF

1 MHz and 1 vrms if capacitance

≤

1000 pF

DF Limit is 0.1%.

Soldering Process

These components are suitable for wave and reflow soldering. All parts incorporate the standard KEMET

barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resist-

ance to leaching.

Marking

These chips will be supplied unmarked. However, marking is available as an extra cost option.

Qualification/Certification

AEC-Q200 Rev. C - Automotive

RoHS 6 - 100% tin termination

F9126 5/07

C 0805

Style

C - Ceramic

Size Code

0402, 0603, 0805, 1206, 1210

Specification

C - Standard

103

End Metallization

C = Standard (Tin-plate

nickel barrier)

Failure Rate Level

A = Not Applicable

Capacitance Code, pF

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

(Use “8” for 0.1 through .99 pF)

Capacitance Tolerance

F = ±1%

K = ±10%

G = ±2%

M = ±20%

J = ±5%

Temperature Characteristic

Designated by Capacitance

Change Over Temperature Range

G = C0G (NP0) (±30 PPM/°C)

Voltage

3 = 25V

Capacitance Value

Capacitance

Values (pF)

470

560

680

820

1000

2200

2700

3300

3900

4700

5600

6800

8200

10,000

4700

5600

6800

8200

10,000

18,000

22,000

33.000

18,000

22,000

33,000

47,000

68,000

100,000

22,000

27,000

33,000

47,000

68,000

100,000

220,000

KEMET Part

Number

C0402C471(1)3GAC

C0402C561(1)3GAC

C0402C681(1)3GAC

C0402C821(1)3GAC

C0402C102(1)3GAC

C0603C222(1)3GAC

C0603C272(1)3GAC

C0603C332(1)3GAC

C0603C392(1)3GAC

C0603C472(1)3GAC

C0603C562(1)3GAC

C0603C682(1)3GAC

C0603C822(1)3GAC

C0603C103(1)3GAC

C0805C472(1)3GAC

C0805C562(1)3GAC

C0805C682(1)3GAC

C0805C822(1)3GAC

C0805C103(1)3GAC

C0805C183(1)3GAC

C0805C223(1)3GAC

C0805C333(1)3GAC

C1206C183(1)3GAC

C1206C223(1)3GAC

C1206C333(1)3GAC

C1206C473(1)3GAC

C1206C683(1)3GAC

C1206C104(1)3GAC

C1210C223(1)3GAC

C1210C273(1)3GAC

C1210C333(1)3GAC

C1210C473(1)3GAC

C1210C683(1)3GAC

C1210C104(1)3GAC

C1210C224(1)3GAC

Voltage

Capacitance

Tolerance

F,G,J,K,M

Thickness

.50

.80

.05

.10

Qty

7” Reel

10,000

4,000

3,000

4,000

2,500

2,000

4,000

2,500

2,000

Qty

13” Reel

50,000

10,000

8,000

10,000

8,000

.78 ± .10

.90 ± .10

1.25 ± .20

.78 ± .10

.90 ± .10

1.20 ± .15

1.60 ± .20

.78 ± .10

1.00 ± .10

2.10 ± .20

(1) Insert capacitance tolerance as shown: F = ±1%; G = ±2%; J = ± 5%; K = ±10% or M = ±20%.

In general, the information in the KEMET Surface Mount catalog F3102 applies to these capacitors. The information in this bulletin supplements that in the catalog.