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C0805A119B2GAH

Multilayer Ceramic Capacitors MLCC - SMD/SMT

器件类别:无源元件   

厂商名称:KEMET(基美)

厂商官网:http://www.kemet.com

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器件参数
参数名称
属性值
产品种类
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
制造商
Manufacturer
KEMET(基美)
电容
Capacitance
1.1 pF
电压额定值 DC
Voltage Rating DC
200 VDC
电介质
Dielectric
BP
容差
Tolerance
0.1 pF
外壳代码 - in
Case Code - in
0805
外壳代码 - mm
Case Code - mm
2012
最大工作温度
Maximum Operating Temperature
+ 125 C
最小工作温度
Minimum Operating Temperature
- 55 C
产品
Product
High Reliability MLCCs
封装 / 箱体
Package / Case
0805 (2012 metric)
工厂包装数量
Factory Pack Quantity
100
端接类型
Termination Style
SMD/SMT
单位重量
Unit Weight
0.000194 oz
文档预览
CERAMIC HIGH RELIABILITY CAPACITORS
CERAMIC HIGH RELIABILITY PRODUCTS
Ceramic Chips, Radial Molded
KEMET Electronics Corporation has been known for
many years as the leader in the ceramic high relia-
bility products. KEMET produces high reliability
monolithic ceramic capacitors under tightly-con-
trolled manufacturing procedures. These capacitors
achieve “State of the Art” performance by virtue of
careful materials selection, conservative design
rules, motivational training of employees, and
scrupulous inspection of all processes as well as the
finished product. KEMET not only manufactures its
own high reliability ceramic capacitor (GR900),
KEMET also manufactures MIL-PRF-123 product
which is built to the highest military standard in the
industry today.
BASIC REQUIREMENTS FOR KEMET’S
HIGH RELIABILITY
PRODUCTS ARE AS FOLLOWS:
1. Selected Raw Materials:
All raw materials are
selected for characteristics known to produce the
finest quality capacitors exhibiting the best electrical
parameters and physical integrity. Materials trace-
ability is maintained throughout the manufacturing
process.
2. Batch Homogeneity:
Production is under batch
control. Each batch is homogeneous with respect to
materials, design and processing conditions.
3. Clean Room Processing:
All processes sensitive
to particulate contamination take place in a clean
room environment.
4. Special Designs:
Special design considerations
such as dielectric thickness are strictly enforced.
Only C0G (BP) and X7R (BX) temperature charac-
teristics are made.
5. Destructive Physical Analysis (DPA, or
Cross-Sectioning):
All batches are sampled using
EIA-469 as a minimum requirement. The samples
remain on file and DPA Reports are shipped with the
capacitors.
6. C-SAM (C-Mode Surface Acoustical
Microscopy):
Optional 100% screening may be per-
formed using ultrasonic energy to detect voids or
delaminations. Screened lots must pass a final sample
DPA.
7. Batch Performance Monitoring:
All production
batches are tested to generate electrical characteris-
tics. Batches which show anomalous characteristics
are rejected.
8. Special Customer Requirements:
Many special
requirements such as serialization, DPA samples,
X-Ray plates, and special packaging can be accom-
modated.
9. Document Applicable:
The high reliability prod-
uct is implemented through various internal docu-
ments under revision control. The Manufacturing
Instructions provide detailed descriptions of all oper-
ations and delineate requirements for process con-
trol and product performance at various points in the
process flow. Inspector Operating Documents
describe test procedures and sampling plans for
inspection of raw materials, in-process material and
finished product. Raw material specifications
describe physical and chemical characteristics as
well as the packaging and labeling needed to pre-
serve characteristics and identity. Customer specifi-
cations are internal documents applicable only to
products manufactured and inspected to require-
ments of individual customers; in effect, these docu-
ments translate customer drawings into modifica-
tions of the specified portions of KEMET standard
procedures.
The Quality System in total is controlled by the
KEMET Quality Manual and by various Quality
Operating Documents. All documents, and revisions
thereto, bear specified approval signatures.
DETAILED SPECIFICATION:
Temperature Characteristics
Electrical stability with respect to temperature and
voltage is related inversely to the packaging effi-
ciency (capacitance X voltage in a given case size).
C0G (BP) is made from ceramic materials which are
not ferroelectric, yielding superior stability but low
packaging efficiency. X7R (BX) is made from materi-
als which are ferroelectric, such as barium titanate,
yielding a stable and high packaging efficiency.
Aging
If the temperature of a barium titanate dielectric is
lowered after an excursion above its curie point, the
ceramic crystalline structure gradually reverts to the
tetragonal form typical of the low temperature condi-
tions. The reversion requires a considerable length
of time, and its effect in practical capacitors has
become known as “Aging”. The rate of aging is
affected by both the temperature and the applied
voltage experienced by the capacitor. The COG (BP)
formulation is non-ferroelectric and does not exhibit
2
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
CERAMIC HIGH RELIABILITY CAPACITORS
aging. The X7R (BX) formulation exhibits its own
characteristic aging rate which describes a decrease
in capacitance versus time. The capacitance of the
X7R dielectric decreases approximately 1.0% dur-
ing each decade of hours following a return to tem-
peratures below the curie point. In other words,
capacitance will decrease 1.0% between 1 and 10
hours, another 1.0% between 10 and 100 hours,
another 1.0% between 100 and 1000 hours, etc.
KEMET takes into consideration the aging rate by
designing capacitors to fall within the specified
capacitance tolerance at 1000 hours. Inasmuch as
the aging rate is exponential, very little change in
capacitance will take place after 1000 hours.
Voltage Effects
Ferroelectric materials are also affected by applied
voltage, both alternating and direct. Low values of
voltage produce a slight increase in capacitance and
dissipation factor. Higher voltages cause a decrease
in capacitance. Typically, capacitors with X7R char-
acteristic decrease in capacitance by approximately
10% when rated DC voltage is applied.
A small portion of the decrease in capacitance by
the application of a high DC voltage persists after the
voltage is removed and then disappears gradually.
Customer Testing
Because of temperature and voltage effects, caution
must be used in establishing a testing sequence for
ceramic capacitors. Insulation resistance measure-
ments and tests of dielectric withstanding voltage
both require application of high DC voltage and
cause temporary changes in capacitance. These
tests, therefore, should not be conducted until
capacitance testing is completed. Alternatively, the
capacitors can be “de-aged” at high temperature as
described above. A stabilization time at room ambi-
ent of 24 hours should be used after de-aging.
See F-3101 Catalog for more details.
PERFORMANCE CHARACTERISTICS
General Information
Working Voltage:
C0G (BP)
- 50,100 & 200 volts
X7R (BX)
- 50,100 & 200 volts
Temperature Characteristics:
C0G (BP):
0 ±30 ppm/°C from -55°C to +125°C.
(Limits widen below 20 pF.)
X7R (BX):
±15%; from -55°C to +125°C.
Capacitance Tolerance:
C0G (BP):
C - ±0.25pF; D - ±0.5pF; F - ±1%;
G- ±2%; J- ±5%; K- ±10%; M- ±20%.
X7R (BX):
J - ±5%; K - ±10%; M - ±20%.
Electrical
Capacitance:
Within specified tolerance when
measured with 1 volt RMS @ 1 kHz (1000pF or less
@ 1 MHz for C0G (BP)).
Dissipation Factor:
25°C @ 1 kHz (1000 pF or less at 1 MHz for
C0G (BP)).
C0G (BP):
0.15% maximum
X7R (BX):
2.5% maximum
Insulation Resistance:
After 2 minutes electrification:
at 25°C and rated voltage:
C0G (BP):
l00 GΩ or (1000 megohm
X µF), whichever is less.
X7R (BX):
l00 GΩ or (1000 megohm
X µF), whichever is less.
at 125°C and rated voltage:
C0G (BP):
l0 GΩ or (100 megohm
X µF), whichever is less.
X7R (BX):
l0 GΩ or (100 megohm
X µF), whichever is less.
Dielectric Withstanding Voltage:
250% of
rated voltage for 5 seconds with current limited to
50 MA at 25°C.
Aging Rate:
% Delta Cap/Decade Hour, Typical
C0G (BP):
0%
X7R (BX):
1.0%
IMPORTANT NOTICE
KEMET Electronics Corporation disclaims all warranties, whether express, implied, or statutory as to any manner whatso-
ever, including the condition of the equipment, its compatibility with specific requirements, its merchantability, or fitness for any
particular purpose which extend beyond the description on the face hereof.
Furthermore, under no circumstances shall KEMET Electronics Corporation be liable for consequential, special, incidental
or indirect damages resulting from the use or handling of this product.
Finally, KEMET Electronics Corporation does not assume any responsibility for the correctness of the information contained
in this catalog. All design characteristics, specifications, tolerances, and the like are subject to change without notice.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
3
CERAMIC HIGH RELIABILITY CAPACITORS
MIL-PRF-123/GR900
TYPICAL PERFORMANCE CURVES
4
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
CERAMIC HIGH RELIABILITY MOLDED & CHIPS
GENERAL INFORMATION MIL-PRF-123
INTRODUCTION
MIL-PRF-123 specification covers the general requirements for high
reliability, general purpose (BX) and temperature stable (BP) ceramic
dielectric fixed capacitors for space, missile, and other high reliability
applications. Capacitors covered by MIL-PRF-123 may be used in
critical frequency determining applications, timing circuits, and other
applications where absolute stability is required (BP) and in applica-
tions where appreciable variations in capacitance with respect to
temperature, voltage, frequency, and life can be tolerated (BX).
10.
Radiographic Inspection
(leaded devices only) (100% of lot).
11.
Visual Inspection
per MIL-PRF-123 criteria.
12.
Destructive Physical Analysis
per EIA-469 and MIL-PRF-123.
SAMPLE TESTS
The following Group B tests shall be performed on samples from
each lot, which have been subjected to and have passed Group A
inspection.
1.
Thermal Shock—Performed
in accordance to MIL-STD-202,
Method 107, Condition A, with step 3 being 125°C. Number of
cycles shall be 100.
2.
Life Test per MIL-5TD-202, Method 108.
Test temperature and
tolerance is +125°C +4, -0°C. Capacitors shall be subjected to
2X rated voltage for 1000 hours.
3.
Humidity, steady state, low voltage per MIL-STD-202,
Method 103, Condition A.
Capacitors shall be subjected to an
environment of 85°C with 85% relative humidity for 240 hours
minimum. Cycling shall not be performed. A dc potential of 1.3
±0.25 volts shall be applied continuously through a 100,000
ohm resistance to each device under test. At completion, 25°C
IR and Cap are read.
4.
Voltage-temperature limits—Capacitance
is measured at var-
ious temperatures (-55°C to +125°C) with and without rated
voltage.
5.
Moisture Resistance per MIL-STD-202, Method 106.
There
shall be 20 continuous cycles. During the first 10 cycles only, a
dc potential of 50 volts shall be applied across the capacitor ter-
minals. Once each day, a check shall be performed to deter-
mine whether a capacitor has shorted. Vibration cycle of MIL-
STD-202, Method 106, Step 7b shall not be performed. Upon
completion of MIL-STD-202, Method 106, Step 6 of the final
cycle, capacitors shall be measured for capacitance, dielectric
withstanding voltage and insulation resistance.
The following Group C tests shall be performed on samples selected
from lots that have passed Group A and have been submitted for
Group B inspection. Samples shall be selected every two months.
1. Terminal Strength
2. Solderability
3. Resistance to Soldering Heat
4. Solvent Resistance (Leaded devices only)
All lots shipped must have been subjected to and passed Group A
and B testing.
SCREENING TESTS
Each lot has the following In-Process Inspections performed:
1. 100% C-SAM (C-Mode Surface Acoustical Microscopy)
2. In-Process Destructive Physical Analysis
3. 100% visual inspection at a minimum of 10X magnification
4. Pre-encapsulation terminal strength evaluation (leaded devices
only). Radial leaded capacitors must meet a minimum lead pull
of 1.8 kg (4.0 lbs.).
The following Group A shall be performed on each lot:
1.
Thermal Shock—Performed
in accordance to MIL-STD-202,
Method 107, Condition A, with step 3 being 125°C. Number of
cycles shall be 20 (100% of lot).
2.
Voltage Conditioning—The
voltage conditioning shall consist
of applying twice the rated voltage to the units at the maximum
rated temperature of 125°C for a minimum of 168 hours and a
maximum of 264 hours. The voltage conditioning may be termi-
nated at any time during 168 hours to 264 hours time interval
that confirmed failures meet the requirements for the PDA dur-
ing the last 48 hours listed in Table I below (100% of lot).
Optional Voltage Conditioning (Accelerated Voltage
Conditioning)—AII
conditions of the standard voltage condi-
tioning apply with the exception of the increased voltage and the
decreased test time. (Refer to Mil-PRF-123 for formula.)
*Step 5
is performed on chips at this point (100% of lot).
3.
Dielectric Withstanding Voltage
250% of the dc rated voltage
at 25°C (100% of lot).
4.
Insulation Resistance—The
25°C measurement with rated
voltage applied shall be the lesser of 100 GΩ or 1000 megohm-
microfarads (100% of lot).
*5.Insulation
Resistance—The
125°C measurement with rated
voltage applied shall be the lesser of 10 GΩ or 100 megohm-
microfarads (1000% of lot). For chips 125°C IR is performed
prior to step 3 above.
6.
Storage
at 150°C for 2 hours minimum without voltage applied
followed by a 12-hour minimum stabilization period (tempera-
ture characteristic BX only).
7.
Capacitance
must be within specified tolerance at 25°C (100%
of lot).
Cap Exclusion:
Capacitance values no more than 5% or
.5 pF, whichever is greater, for BX characteristics or 1% or .3 pF,
whichever is greater, for BP characteristics beyond specified tol-
erance limit shall be removed from the lot but shall not be con-
sidered defective for determination of the PDA.
8.
Dissipation Factor
shall not exceed 2.5% for X dielectric,
0.15% for G dielectric at 25°C (100% of lot).
9.
Percent Defective Allowable (PDA).
The following table lists
the PDA requirements for MIL-PRF-123 Group A:
TABLE I
BURN IN PDA
LAST 48 HOURS
1 unit or 0.1%
1 unit or 0.2%
1 unit or 0.2%
1 unit or 0.1%
1 unit or 0.1%
1 unit or 0.1%
1 unit or 0.1%
1 unit or 0.1%
1 unit or 0.1%
1 unit or 0.1%
STANDARD PACKAGING FOR
MIL-PRF-123 IS AS FOLLOWS:
C052Z
C062Z
C512Z
tray
tray
1 pc. per bag
C0805Z
C1206Z
C1210Z
C1808Z
C1812Z
C1825Z
C2225Z
chip
chip
chip
chip
chip
chip
chip
tray
tray
tray
tray
tray
tray
tray
DATA PACKAGE
A data package is sent with each shipment which contains:
1. Summary of Group A testing
2. Summary of Group B testing
3. Group B Variables Test Data
4. Lead Pull Data (Leaded Devices Only)
5. Final Destructive Physical Analysis Report
6. Certificate of Compliance stating that the ceramic capacitors
supplied meet all the requirements of MIL-PRF-123, the applic-
able slash sheet(s) and all associated documents.
KEMET
STYLE
C052Z
C062Z
C512Z
C0805Z
C1210Z
C1808Z
C2225Z
C1206Z
C1812Z
C1825Z
MIL
STYLE
CKS05
CKS06
CKS07
CKS51
CKS52
CKS53
CKS54
CKS55
CKS56
CKS57
PDA
OVERALL
3%
5%
5%
3%
3%
3%
3%
3%
3%
3%
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
5
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