SMD Comm C0G, Ceramic, 1.5 pF, +/-0.1 pF, 50 VDC, C0G, SMD, MLCC, Ultra-Stable, Low Loss, Class I, 0402
General Information
Supplier:
Series:
Style:
Description:
Features:
RoHS:
Termination:
Marking:
Miscellaneous:
Chip Size:
KEMET
SMD Comm C0G
SMD Chip
SMD, MLCC, Ultra-Stable, Low
Loss, Class I
Ultra-Stable, Low Loss, Class I
Yes
Tin
No
Note: KEMET 50V rated parts
may be operated at 63 Volts
0402
Dimensions
L
W
T
S
B
1mm +/-0.05mm
0.5mm +/-0.05mm
0.5mm +/-0.05mm
0.3mm MIN
0.3mm +/-0.1mm
Specifications
Capacitance:
Capacitance Tolerance:
Voltage DC:
Dielectric Withstanding
Voltage:
Temperature Range:
Temperature Coefficient:
Dissipation Factor:
Aging Rate:
Insulation Resistance:
1.5 pF
+/-0.1 pF
50 VDC
125 V
-55/+125C
C0G
0.10% 1MHz 25C
0% Loss/Decade Hour
100 GOhms
Packaging Specifications
Packaging:
Packaging Quantity:
T&R, 180mm, Paper Tape
10000
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and
we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the
requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us
with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
随着行动装置与穿戴式装置的普及使用，越来越多厂商纷纷将NFC近场无线通信(Near Field Communication)技术纳入其产品的基本配备，寻求更快速且便利的信息互连应用。根据市调研究机构IHS的报告显示，搭载NFC技术的智能型手机全球市场将从2013年至2018年大幅成长4倍之多，并可达12亿支的出货量。研究报告的背后显示，除了NFC的传输功能外，市场需求也逐渐意识到使用NFC的便利...[详细]
RF/无线
