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CERAMIC CHIP CAPACITORS

FEATURES

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

barrier

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

+80%-20%

• Tape and reel packaging per EIA481-1. (See page

92 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

• RoHS Compliant

CAPACITOR OUTLINE DRAWINGS

ELECTRODES

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

DIMENSIONS—MILLIMETERS AND (INCHES)

SIZE CODE

EIA

SIZE

CODE

METRIC

(Ref only)

CODE

SIZE CODE

0402*

1005

EIA

METRIC

L - LENGTH

0.6 (.024) ± .03 (.001)

1.0 (.04) ± .05 (.002)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

4.5 (.177) ± .30 (.012)

5.6 (.220) ± .40 (.016)

W - WIDTH

0.3 ± (.012) ± .03 (.001)

0.5 (.02) ± .05 (.002)

0.8 (.032) ± .15 (.006)

1.25 (.049) ± .20 (.008)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

3.2 (.126) ± .30 (.012)

6.4 (.252) ± .40 (.016)

5.0 (.197) ± .40 (.016)

6.3 (.248) ± .40 (.016)

THICKNESS

B - BANDWIDTH

0.15 (.006) ± .05 (.002)

0.20 (.008) -.40 (.016)

0.35 (.014) ± .15 (.006)

0.50 (.02) ± .25 (.010)

0.60 (.024) ± .35 (.014)

SEPARATION

minimum

N/A

0.3 (.012)

0.7 (.028)

0.75 (.030)

N/A

MOUNTING

TECHNIQUE

Solder Reflow

0201*

0603*

0402*

0805*

0603

1206*

0805*

1210*

1206*

1812

2220

2225

1812

0603

1608

1005

2012

1608

3216

2012

3225

3216

4532

4564

5650

5664

4532

4564

5650

5664

1210*

1825*

2220

2225

3225

See page 78

for thickness

dimensions.

Solder Wave +

Solder Reflow

Solder

Reflow

Solder Reflow

* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)

+ For extended value 1210 case size - solder reflow only.

CAPACITOR ORDERING INFORMATION

(Standard Chips - For

C 0805 C 103 K 5 R A C*

CERAMIC

SIZE CODE

SPECIFICATION

C - Standard

CAPACITANCE CODE

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – ±0.10pF J – ±5%

C – ±0.25pF K – ±10%

D – ±0.5pF

M – ±20%

F – ±1%

P – (GMV) – special order only

G – ±2%

Z – +80%, -20%

Military see page

87)

END METALLIZATION

C-Standard (Tin-plated nickel barrier)

FAILURE RATE LEVEL

A- Not Applicable

TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15%) (-55°C + 125°C)

P– X5R (±15%) (-55°C + 85°C)

U – Z5U (+22%, -56%) (+10°C + 85°C)

V – Y5V (+22%, -82%) (-30°C + 85°C)

VOLTAGE

1 - 100V

3 - 25V

2 - 200V

4 - 16V

5 - 50V

8 - 10V

* Part Number Example: C0805C103K5RAC (14 digits - no spaces)

7 - 4V

9 - 6.3V

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Ceramic Surface Mount

CERAMIC CHIP/STANDARD

X5R CAPACITANCE RANGE

Cap

10,000

12,000

15,000

18,000

22,000

27,000

33,000

39,000

47,000

56,000

68,000

82,000

100,000

120,000

150,000

180,000

220,000

270,000

330,000

390,000

470,000

560,000

680,000

820,000

1,000,000

1,200,000

1,500,000

1,800,000

2,200,000

2,700,000

3,300,000

4,700,000

5,600,000

6,800,000

8,200,000

10,000,000

12,000,000

15,000,000

18,000,000

22,000,000

27,000,000

33,000,000

39,000,000

47,000,000

100,000,000

Cap

Code

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

155

185

225

275

335

475

565

685

825

106

126

156

186

226

276

336

396

476

107

Cap

Tolerance

K,M

0201

6.3V 16V 6.3V

AA~

C0402*

10V

16V

6.3V

C0603*

10V

16V

25V

C0805*

6.3V 10V 16V 25V 6.3V

C1206*

10V 16V 25V

C1210*

6.3V 10V 16V 25V

50V

BB°

CC+ CC+ CC+

CD+

FK+

FH+

FD+

FG+

FH+

FK+ FK+

FH+ FH+

FD+

FG+

FH+

FK+

CD°+

DJ+

DJ+ DK+

DH°+

EH+

FJ+ FJ+ FJ+ FF+

FK+ FK+ FK+ FG+

EH+ FK+ FK+ FK+ FH+

FD+ FD+ FG+

FD+ FD+ FL+

FL+ FL+ FH+

FH+ FH+ FJ+

DJ°+

EH°+

FQ°+

NOTE: For non-standard capacitance values or voltages, contact your local KEMET sales representative.

+Reflow only

° Available M ±20% tolerance only

Improved product with higher ratings and tighter capacitance tolerance product may be substituted within the same size (length, width, and thickness) at KEMET's option.

Reels with such substitutions will be marked with the improved KEMET part numbers.

Z5U CAPACITANCE RANGE

(KEMET's Z5U also meets Y5V Characteristics)

50V 100V

6800

6,800

8200

8,200

10,000

12,000

15,000

18,000

22,000

27,000

33,000

39,000

47,000

56,000

68,000

82,000

100,000

120,000

150,000

180,000

220,000

270,000

330,000

390,000

470,000

560,000

680,000

820,000

1,000,000

1,200,000

1,500,000

1,800,000

2,200,000

2,700,000

NOTE: For non-standard capacitance values or voltages, contact your local KEMET sales representative.

50 Volt Ceramic Chips can be used for 63 volt applications.

* EIA preferred chip sizes

See page 78 for Thickness Code Reference Chart.

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Ceramic Surface Mount

Cap

CAP.

C1206*

C1210*

C1812*

C1825*

C0805*

C1206*

C1210*

C1812*

C1825*

Cap

CAP

Cap

CAP

C0805*

CODE

Tol. 50V 100V 50V 100V 50V 100V 50V 100V 50V 100V

TOL 50V 100V 50V 100V 50V 100V 50V 100V 50V 100V

Code

682

M,Z

DC DC

682

822

M,Z

DC DC

822

103

M,Z

DC DC EB EB

103

123

M,Z

123

153

M,Z

153

183

M,Z

183

223

M,Z

223

273

M,Z

273

333

M,Z

333

393

M,Z

393

EC FB FB

473

M,Z

EC FB FB

473

FB FB

563

M,Z

563

FB FB

683

M,Z

683

FB FC GB GB

823

M,Z

823

FB FD GB GB

104

M,Z

FD GB GB

124

M,Z

FD GB GB

154

FD GB GB

154

M,Z

184

M,Z

224

M,Z

274

M,Z

334

M,Z

394

M,Z

474

M,Z

564

M,Z

684

M,Z

824

M,Z

105

M,Z

125

M,Z

155

M,Z

185

M,Z

225

M,Z

275

M,Z

C2225

CERAMIC CHIP CAPACITORS

Thickness Code Reference Chart

Packaging Quantity Based on Finished Chip Thickness Specifications

Thickness

Code

Chip

Size

Chip Thickness

Range (mm)

Qty per Reel

7" Plastic

Qty per Reel

13" Plastic

Qty per Reel

7" Paper

Qty per Reel

13" Paper

Qty per Bulk

Cassette

0201

0402

0603

0805

1206

1210

1812

1825

2220

2225

.30 ± .03

.50 ± .05

.80 ± .07

.80 ± .10

.80 ± .15

.60 ± .10

.78 ± .10

.90 ± .10

1.00 ± .10

1.10 ± .10

1.25 ± .15

1.25 ± .20

1.25 ± .15

.78 ± .10

.90 ± .10

1.00 ± .10

1.10 ± .10

1.20 ± .15

1.60 ± .15

1.60 ± .20

1.70 ± .20

.80 ± .10

1.15 ± .15

1.25 ± .15

0.95 ± .10

.78 ± .10

.90 ± .10

.95 ± .10

1.00 ± .10

1.10 ± .10

1.25 ± .15

1.55 ± .15

1.85 ± .20

2.10 ± .20

1.40 ± .15

1.70 ± .20

1.85 ± .20

1.50 ± .20

1.60 ± .20

2.5 ± .20

2.25 ± .20

2.50 ± .20

1.00 ± .10

1.10 ± .10

1.25 ± .15

1.30 ± .10

1.50 ± .10

1.55 ± .10

1.40 ± .15

1.70 ± .15

1.60 ± .20

1.90 ± .20

2.00 ± .20

1.70 ± .20

1.10 ± .15

1.15 ± .15

1.30 ± .15

1.40 ± .15

1.50 ± .15

1.00 ± .15

1.10 ± .15

1.30 ± .15

1.40 ± .15

1.50 ± .15

1.00 ± .15

1.10 ± .15

1.30 ± .15

1.40 ± .15

N/A

4,000

2,500

3,000

4,000

2,500

2,000

2,500

4,000

2,500

2,000

1,500

2,000

1,000

N/A

10,000

8,000

10,000

8,000

4,000

15,000

10,000

4,000

N/A

4,000

N/A

4,000

N/A

50,000

10,000

N/A

10,000

N/A

10,000

N/A

50,000

15,000

N/A

10,000

N/A

This chart refers to ceramic chip thickness codes on pages

73-76.

CERAMIC CHIP CAPACITORS

Packaging Information

Tape & Reel Packaging

KEMET offers Multilayer Ceramic Chip Capacitors

packaged in 8mm and 12mm plastic tape on 7" and

13" reels in accordance with EIA standard 481-1:

Taping of surface mount components for automatic

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 78

for details on reeling quantities for commercial chips

and page 87 for MIL-PRF-55681 chips.

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 81

for details on reeling quantities for commercial chips

and page 90 for MIL-PRF-55681 chips.

Anti-Static Reel

Embossed Carrier*

0402 and 0603 case sizes

available on punched paper only.

Chip Orientation

in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

Embossment

8mm

±.30

(.315

±.012")

12mm

±.30

(.472

±.012")

178mm (7.00")

330mm (13.00")

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

* Punched paper carrier used for 0402 and 0603 case size.

SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM

Grid

placement

courtyard

Placement

Reflow Solder

Dimension

0402

0603

0805

1206

1210

1812

1825

2220

2225

2.14

2.78

3.30

4.50

5.90

7.00

0.28

0.68

0.70

1.50

2.30

3.30

X Y(ref) C(ref)

0.74 0.93 1.21

1.08 1.05 1.73

1.60 1.30 2.00

2.00 1.50 3.00

2.90 1.50 3.00

3.70 1.80 4.10

6.90 1.80 4.10

5.50 1.85 5.15

6.80 1.85 5.15

3.18

3.70

4.90

Wave Solder

0.80

1.10

1.40

2.00

Y(ref) Smin

1.25

1.50

1.70

1.93

2.20

3.20

Not Recommended

Courtyard

0.68

0.70

1.50

Not Recommended

Calculation Formula

Z = Lmin + 2Jt + Tt

G = Smax - 2Jh -Th

X = Wmin + 2Js + Ts

Tt, Th, Ts = Combined tolerances

Packaging

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

Performance Notes

1. Cover Tape Break Force:

1.0 Kg Minimum.

2. Cover Tape Peel Strength:

The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

Peel Strength

8 mm

0.1 Newton to 1.0 Newton (10g to 100g)

12 mm

0.1 Newton to 1.3 Newton (10g to 130g)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier

tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape

shall be pulled at a velocity of 300 ±10 mm/minute.

3. Reel Sizes:

Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")

reels (with C-7280). Note that 13” reels are preferred.

4. Labeling:

Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.

Refer to EIA-556.

Embossed Carrier Tape Configuration:

Figure 1

Table 1 — EMBOSSED TAPE DIMENSIONS

(Metric will govern)

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

and

12 mm

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

T Max

0.600

(0.024)

Max

0.100

(0.004)

1.5

1.75 ±0.10

+0.10 -0.0

(0.059

(0.069 ±0.004)

+0.004, -0.0)

Pitch

Single

(4 mm)

Max.

Note 1

4.4

(0.173)

12 mm

Double

(8 mm)

8.2

(0.323)

Min.

Note 2

1.0

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

3.5 ±0.05

4.0 ±0.10

R Min.

Note 3

25.0

Max

2.5

(0.098)

8.0 ±0.30

(.315 ±0.012)

Note 4

(0.039) (0.138 ±0.002)

1.5

5.5 ±0.05

(0.059) (0.217 ±0.002)

(0.157 ±0.004) (0.984)

8.0 ±0.10

30.0

(0.315 ±0.004) (1.181)

4.6

12.0 ±0.30

(0.181) (0.472 ±0.012)

NOTES

1. B1 dimension is a reference dimension for tape feeder clearance only.

2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of

embossment location and hole location shall be applied independent of each other.

3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require

additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)

4. The cavity defined by A

and K

shall be configured to surround the part with sufficient clearance such that the chip does not pro-

trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical

restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm

maximum in the pocket (not applicable to vertical clearance.)