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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC

(Commercial & Automotive Grade)

Overview

KEMET’s Ceramic Open Mode capacitor in X7R dielectric

is designed to significantly minimize the probability of a low

IR or short circuit condition when forced to failure in a board

stress flex situation, thus reducing the potential for catastrophic

failure. The Open Mode capacitor may experience a drop in

capacitance; however, a short is unlikely because a crack

will not typically propagate across counter electrodes within

the device’s “active area.” Since there will not be any current

leakage associated with a typical Open Mode flex crack,

there is no localized heating and therefore little chance for a

catastrophic and potentially costly failure event.

Driven by the demand for a more robust and reliable

component, the Open Mode capacitor was designed for

critical applications where higher operating temperatures and

mechanical stress are a concern. These capacitors are widely

used in automotive circuits as well as power supplies (input and

output filters) and general electronic applications.

Concerned with flex cracks resulting from excessive tensile and

shear stresses produced during board flexure and thermal cycling?

These devices are available with KEMET's Flexible termination

technology which inhibits the transfer of board stress to the rigid

ceramic body, therefore mitigating flex cracks which can result

in low IR or short circuit failures. Although flexible termination

technology does not eliminate the potential for mechanical

damage that may propagate during extreme environmental and

handling conditions, it does provide superior flex performance

over standard termination systems. When combined with flexible

termination technology these devices offer the ultimate level of

protection against a low IR or short circuit condition. Open Mode

devices compliment KEMET's Floating Electrode (FE-CAP) and

Floating Electrode with Flexible Termination (FF-CAP) product

lines by providing a fail-safe design optimized for mid to high range

capacitance values. These devices exhibit a predictable change in

capacitance with respect to time and voltage and boast a minimal

change in capacitance with reference to ambient temperature.

Capacitance change is limited to ±15% from -55°C to +125°C.

Ordering Information

Ceramic

1210

Case Size

(L" x W")

0805

1206

1210

1812

Specification/

Series

685

Capacitance

Code (pF)

Capacitance

Tolerance

Voltage

Dielectric

Failure Rate/

Design

A = N/A

Termination Finish

C = 100% Matte Sn

L = SnPb (5%

minimum)

Packaging/Grade

(C-Spec)

Blank = Bulk

TU = 7" Reel

Unmarked

TM = 7" Reel Marked

AUTO = Automotive

Grade

F = Open Mode 2 Significant Digits K = ±10%

J = Open Mode + Number of Zeros M = ±20%

with Flexible

Termination

4 = 16 V R = X7R

3 = 25 V

5 = 50 V

1 = 100 V

2 = 200 V

Additional termination finish options may be available. Contact KEMET for details.

SnPb termination finish option is not available on automotive grade product.

Additional reeling or packaging options may be available. Contact KEMET for details.

1, 2

One world. One KEMET

C1012_X7R_OPENMODE_SMD • 5/30/2013

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches) – Standard Termination

Nickel Plate

Electrodes

Conductive Metalization

100% Tin or SnPb Plate

EIA

Size

Code

0805

1206

1210

1812

Metric

Size

Code

2012

3216

3225

4532

Length

Width

Thickness

Bandwidth

0.50 (0.02) ± 0.25 (.010)

Separation

Minimum

0.75 (.030)

Mounting

Technique

Solder Wave or

Solder Reflow

Solder Reflow Only

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) See Table 2 for 0.50 (0.02) ± 0.25 (.010)

Thickness 0.50 (0.02) ± 0.25 (.010)

3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)

4.50 (.177) ± 0.30 (.012)

3.20 (.126) ± 0.30 (.012)

0.60 (.024) ± 0.35 (.014)

Ceramic Surface Mount

N/A

Dimensions – Millimeters (Inches) – Flexible Termination

EIA Metric

Size

Code Code

0805

1206

1210

1812

2012

3216

3225

4532

Length

2.00 (.079) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016)

4.50 (.178) ± 0.40 (.016)

Width

1.25 (.049) ± 0.20 (.008)

Thickness

Bandwidth

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.25 (.010)

Ceramic Surface Mount

Separation

Minimum

0.75 (.030)

Mounting

Technique

Solder Wave or

Solder Reflow

Only

1.60 (.063) ± 0.20 (.008) See Table 2 for

Thickness

2.50 (.098) ± 0.20 (.008)

3.20 (.126) ± 0.30 (.012)

N/A

0.70 (.028) ± 0.35 (.014)

Benefits

•

-55°C to +125°C operating temperature range

Open Mode/fail open design

Mid to high capacitance flex mitigation

Pb-Free and RoHS Compliant

EIA 0805, 1206, 1210, and 1812 case sizes

DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V

Capacitance offerings ranging from 1,000 pF to 6.8 μF

Available capacitance tolerances of ±5%, ±10%, and ±20%

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination finish allowing for

excellent solderability

• Commercial and Automotive (AEC–Q200) grades available

• SnPb termination finish option available upon request (5%

minimum)

• Flexible termination option available upon request

C1012_X7R_OPENMODE_SMD • 5/30/2013

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Applications

Typical applications include input side filtering (power plane/bus), high current (battery line) and circuits that cannot be fused to open

when short circuits occur due to flex cracks. Markets include automotive applications that are directly connected to the battery and/or

involve conversion to a 42 V system and raw power input side filtering in power conversion.

Qualification/Certification

Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in

Table 4, Performance and Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.

Environmental Compliance

Pb-Free and RoHS Compliant (excluding SnPb termination finish option).

Electrical Parameters/Characteristics

Item

Operating Temperature Range

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

Dielectric Withstanding Voltage (DWV)

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

-55°C to +125°C

±15%

3.0%

250% of rated voltage

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)

See Insulation Resistance Limit Table

(Rated voltage applied for 120 ±5 seconds @ 25°C)

Parameters/Characteristics

Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF

120 Hz ±10Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

C1012_X7R_OPENMODE_SMD • 5/30/2013

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Dielectric

Rated DC

Voltage

> 25

X7R

16/25

< 16

All

Capacitance

Value

Dissipation Factor

(Maximum %)

3.0

5.0

7.5

±20%

10% of Initial Limit

Capacitance

Shift

Insulation

Resistance

Insulation Resistance Limit Table (X7R Dielectric)

EIA Case Size

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1,000 Megohm

Microfarads or 100 GΩ

N/A

< 0.012 µF

< 0.047 µF

< 0.22 µF

< 0.39 µF

ALL

< 2.2 µF

ALL

< 10 µF

ALL

500 Megohm

Microfarads or 10 GΩ

ALL

≥ 0.012 µF

≥ 0.047 µF

≥ 0.22 µF

≥ 0.39 µF

N/A

≥ 2.2 µF

N/A

≥ 10 µF

N/A

C1012_X7R_OPENMODE_SMD • 5/30/2013

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 1 – Capacitance Range/Selection Waterfall (0805 – 1812 Case Sizes)

Series

Capacitance

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1.0 µF

1.2 µF

1.5 µF

1.8 µF

2.2 µF

2.7 µF

3.3 µF

3.9 µF

4.7 µF

6.8 µF

C0805F

100

200

C1206F

100

200

C1210F

100

200

C1812F

100

200

Cap

Code

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

155

185

225

275

335

395

475

685

Voltage Code

Voltage DC

Capacitance

Tolerance

Voltage DC

Voltage Code

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

100

200

100

200

100

200

100

200

Capacitance

Cap

Code

Series

C0805F

C1206F

C1210F

C1812F

C1012_X7R_OPENMODE_SMD • 5/30/2013

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