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CERAMIC CHIP / HIGH VOLTAGE

KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They

offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin

(Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering

applications. An insulating coating may be required to prevent surface arcing. These components are RoHS

compliant.

APPLICATIONS

Applications

• Switch Mode Power Supply

• Input Filter

• Resonators

• Tank Circuit

• Snubber Circuit

• Output Filter

• High Voltage Coupling

• High Voltage DC Blocking

• Lighting Ballast

• Voltage Multiplier Circuits

• Coupling Capacitor/CUK

MARKETS

Markets

• Power Supply

• High Voltage Power Supply

• DC-DC Converter

• LCD Fluorescent Backlight Ballast

• HID Lighting

• Telecommunications Equipment

• Industrial Equipment/Control

• Medical Equipment/Control

• Computer (LAN/WAN Interface)

• Analog and Digital Modems

• Automotive

OUTLINE DRAWING

Outline Drawing

ELECTRODES

TIN PLATE

NICKEL PLATE

TABLE 1 - DIMENSIONS - MILLIMETERS (in.)

Metric

Code

2012

3216

3225

4520

4532

4564

5650

5664

EIA Size

Code

0805

1206

1210

1808

1812

1825

2220

2225

L - Length

2.0 (0.079)

± 0.2 (0.008)

3.2 (0.126)

± 0.2 (0.008)

3.2 (0.126)

± 0.2 (0.008)

4.5 (0.177)

± 0.3 (0.012)

4.5 (0.177)

± 0.3 (0.012)

4.5 (0.177)

± 0.3 (0.012)

5.6 (0.224)

± 0.4 (0.016)

5.6 (0.224)

± 0.4 (0.016)

W - Width

1.2 (0.049)

± 0.2 (0.008)

1.6 (0.063)

± 0.2 (0.008)

2.5 (0.098)

± 0.2 (0.008)

2.0 (0.079

± 0.2 (0.008)

3.2 (0.126)

± 0.3 (0.012)

6.4 (0.250)

± 0.4 (0.016)

5.0 (0.197)

± 0.4 (0.016)

6.4 (0.250)

± 0.4 (0.016)

B - Bandwidth

0.5 (0.02

±0.25 (0.010)

0.5 (0.02)

± 0.25 (0.010)

0.5 (0.02)

± 0.25 (0.010)

0.6 (0.024)

± 0.35 (0.014)

0.6 (0.024)

± 0.35 (0.014)

0.6 (0.024)

± 0.35 (0.014)

0.6 (0.024)

± 0.35 (0.014)

0.6 (0.024)

± 0.35 (0.014)

Band

Separation

0.75 (0.030)

N/A

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Ceramic Surface Mount

CONDUCTIVE

METALLIZATION

CERAMIC CHIP / HIGH VOLTAGE

C0G DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)

Series

Cap

Capacitance

Tolerance

Max

Thickness

(in)

Cap Code/

Voltage

0805

0.050

0.065

1206

0.065

0.101

1210

0.101

0.080

1808

0.080

1812

0.080

0.067

1825

0.067

2220

0.067

2225

0.067

2000

0.080

0.067

2500

1000

1500

2000

1000

1500

2000

1000

1500

2000

2500

3000

1000

1500

2000

2500

3000

1000

1500

2000

2500

3000

1000

1500

2000

2500

3000

1000

1500

1.0-2.4

2.7-5.1

5.6-9.1

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

1000

1100

1200

1300

1500

1600

1800

2000

2200

2400

2700

3000

3300

3600

3900

4300

4700

5100

5600

6200

6800

7500

8200

9100

10,000

C,D

K,M

C,D

J,K,M

C,D

J,K,M

C,D

J,K,M

C,D

J,K,M

C,D

J,K,M

C,D G,J,K,M

D,F,G,J,K,M

F,G,J,K,M

109-249

279-519

569-919

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

101

111

121

131

151

161

181

201

221

241

271

301

331

361

391

431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

3000

500

0.067

* Contact KEMET Sales Representative for C, D, F & G Capacitance Tolerance availability.

Note:

Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available.

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Ceramic Surface Mount

CERAMIC CHIP / HIGH VOLTAGE

X7R DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)

Series

Cap

Capacitance

Tolerance

Max

Thickness

(in)

Cap Code/

Voltage

0805

0.050

0.065

1206

0.065

0.080

1210

0.080

1808

0.080

0.067

1812

0.067

1825

0.067

2220

0.067

2225

0.067

2500

0.067

3000

1000

1500

2000

1000

1500

2000

1000

1500

0.080

2000

2500

3000

1000

1500

2000

2500

3000

1000

1500

2000

2500

3000

1000

1500

2000

2500

3000

1000

1500

Note: Actual thickness dimensions may be less than stated maximum.

Check the KEMET website, www.kemet.com, for additional values and chip sizes available.

KEMET HIGH VOLTAGE SURFACE MOUNT CHIP (VOLTAGE CODES C,D,F,G,H, and Z)

THICKNESS AND REELING QUANTITIES

Chip size

EIA

0805

1206

1210

1808

1812/1813

1825

2220

2225

Metric

2012

3216

3225

4520

4532

4564

5650

5664

Max.

Thickness (in)

0.055

0.065

0.101

0.080

0.067

Max.

Thickness (mm)

1.27

1.65

2.57

2.03

1.70

Tape Width

(mm)

Qty per Reel Qty per Reel

7" Plastic

13" Plastic

2,500

10,000

2,000

8,000

2,000

8,000

1,000

4,000

1,000

4,000

1,000

4,000

1,000

4,000

1,000

4,000

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Ceramic Surface Mount

100

110

120

130

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2000

2200

2700

3300

3900

4700

5600

6800

8200

10,000

12,000

15,000

18,000

22,000

27,000

33,000

39,000

47,000

56,000

62,000

68,000

82,000

100,000

120,000

150,000

180,000

220,000

J,K,M

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

101

111

121

131

151

181

221

271

331

391

471

561

681

821

102

122

152

182

202

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

623

683

823

104

124

154

184

224

2000

500

CERAMIC CHIP / HIGH VOLTAGE

CAPACITOR ORDERING

Information

Capacitor Ordering

INFORMATION

Style

C - Ceramic

Chip Size

0805

102

0805; 1206; 1210; 1808;

1812; 1825; 2220; 2225

Specification

C - Standard

Capacitance Code, pF

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

(Use “8” for 0.1 through .99 pF)

Capacitance Tolerance

End

Metallization

C = Standard

Failure Rate

Level

Failure

A = Not Applicable

Temperature

Characteristic

Designated by Capacitance

Change over Temperature Range

G – (C0G) (±30ppm/C) (-55°C +125°C)

R – X7R (±15%) (-55°C +125°C)

C = 500V

D = 1000V

F = 1500V

Voltage

G = 2000V

Z = 2500V

H = 3000V

C = ±0.25pF*

J = ±5%

D = ±0.5pF*

K = ±10%

F = ±1%*

M = ±20%

G = ±2%*

* Contact KEMET Sales for availability.

ELECTRICAL PARAMETERS

Electrical Parameters

Property

Capacitance

Cap Tolerance

Voltage Ratings

Operating Temperature Range

25ºC IR @ 500V

125ºC IR @ 500V

-55ºC TCC

+125ºC TCC

Dielectric Strength

Ripple Current

Specification

C0G: 1 pF to 0.010 µF

X7R: 10 pF to 0.22 µF

25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for

≤ 1000

pF (C0G only)

C0G: C*, D*, F*, G*, J, K, M

* Contact KEMET Sales for availability.

X7R: J, K, M

C0G: 0.1% Max

X7R: 2.5% Max

500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V

From

-55ºC

to +125C

-55C

to +125ºC

100 GΩ or 1000 MΩ-µF, whichever is less

10 GΩ or 100 MΩ-µF, whichever is less

X7R: + 15%

C0G: + 30 ppm / ºC

150% of Rated Voltage for Rated Voltage <1000 V

120% of Rated Voltage for Rated Voltage >=1000V

Consult KEMET Sales Representative

MARKING

Marking

These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.

Details on the marking format is located on page 97.

Packaging

PACKAGING

KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk

bag as outlined on page 83. Please consult factory for waffle packaging options.

SOLDERING

Process

Soldering

PROCESS

The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and

larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of

pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of

the termination.

Recommended Solder

PAD DIMENSIONS

RECOMMENDED SOLDER

Pad Dimensions

Chip Size

0805

1206

1210

1808

1812

1825

2220

2225

T (Total Length)

3.30

4.50

5.90

7.00

in.

0.130

0.177

0.232

0.276

S (Separation

0.70

1.50

2.30

3.30

in.

0.028

0.059

0.091

0.130

W (Pad Width)

1.60

2.00

2.90

2.40

3.70

6.90

5.50

6.80

in.

0.063

0.079

0.114

0.094

0.146

0.272

0.217

0.268

L (Pad Length)

1.30

1.50

1.80

1.85

in.

0.051

0.059

0.071

0.073

CERAMIC CHIP CAPACITORS

Packaging Information

Tape & Reel Packaging

KEMET offers Multilayer Ceramic Chip Capacitors

packaged in 8mm and 12mm plastic tape on 7" and

13" reels in accordance with EIA standard 481-1:

Taping of surface mount components for automatic

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 78

for details on reeling quantities for commercial chips

and page 87 for MIL-PRF-55681 chips.

handling. This packaging system is compatible with all

tape fed automatic pick and place systems. See page 81

for details on reeling quantities for commercial chips

and page 90 for MIL-PRF-55681 chips.

Anti-Static Reel

Embossed Carrier*

0402 and 0603 case sizes

available on punched paper only.

Chip Orientation

in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

Embossment

8mm

±.30

(.315

±.012")

12mm

±.30

(.472

±.012")

178mm (7.00")

330mm (13.00")

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

* Punched paper carrier used for 0402 and 0603 case size.

SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM

Grid

placement

courtyard

Placement

Reflow Solder

Dimension

0402

0603

0805

1206

1210

1812

1825

2220

2225

2.14

2.78

3.30

4.50

5.90

7.00

0.28

0.68

0.70

1.50

2.30

3.30

X Y(ref) C(ref)

0.74 0.93 1.21

1.08 1.05 1.73

1.60 1.30 2.00

2.00 1.50 3.00

2.90 1.50 3.00

3.70 1.80 4.10

6.90 1.80 4.10

5.50 1.85 5.15

6.80 1.85 5.15

3.18

3.70

4.90

Wave Solder

0.80

1.10

1.40

2.00

Y(ref) Smin

1.25

1.50

1.70

1.93

2.20

3.20

Not Recommended

Courtyard

0.68

0.70

1.50

Not Recommended

Calculation Formula

Z = Lmin + 2Jt + Tt

G = Smax - 2Jh -Th

X = Wmin + 2Js + Ts

Tt, Th, Ts = Combined tolerances

Packaging