MCP2210
Breakout Module
User’s Guide
©
2012 Microchip Technology Inc.
DS52056A
Note the following details of the code protection feature on Microchip devices:
•
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
•
•
•
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
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and may be superseded by updates. It is your responsibility to
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The Microchip name and logo, the Microchip logo, dsPIC,
K
EE
L
OQ
, K
EE
L
OQ
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32
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© 2012, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
ISBN: 978-1-62076-117-5
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
==
ISO/TS 16949
==
DS52056A-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
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are for its PIC
®
MCUs and dsPIC
®
DSCs, K
EE
L
OQ
®
code hopping
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©
2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Web Site ........................................................................................ 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 MCP2210 Breakout Module General Description .......................................... 9
1.3 What the MCP2210 Breakout Module Kit Includes ........................................ 9
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Board Setup ................................................................................................. 11
2.3 Board Operation ........................................................................................... 12
2.4 MCP2210 Typical Usage Scenarios ............................................................. 14
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 17
A.2 Board – Schematic ....................................................................................... 18
A.3 Board – Top Silk and Pads .......................................................................... 19
A.4 Board – Top Silk, Pads and Copper ............................................................ 20
A.5 Board – Top Pads and Copper .................................................................... 21
A.6 Board – Bottom Silk and Pads ..................................................................... 22
A.7 Board – Bottom Silk, Pads and Copper ....................................................... 23
A.8 Board – Bottom Pads and Copper ............................................................... 24
Appendix B. Bill of Materials
Worldwide Sales and Service .................................................................................... 26
©
2012 Microchip Technology Inc.
DS52056A-page 3
MCP2210 Breakout Module User’s Guide
DS52056A-page 4
©
2012 Microchip Technology Inc.
MCP2210 BREAKOUT MODULE
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB
®
IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP2210 Breakout Module. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP2210 Breakout Module board. The
manual layout is as follows:
•
Chapter 1. “Product Overview”
– Important information about the MCP2210
Breakout Module
•
Chapter 2. “Installation and Operation”
– Covers the initial set-up of this board,
required tools, board setup and Graphical User Interface (GUI)
•
Appendix A. “Schematic and Layouts”
– Shows the schematic and board
layouts for the MCP2210 Breakout Module User’s Guide
•
Appendix B. “Bill of Materials”
– Lists the parts used to populate the MCP2210
Breakout Module
©
2012 Microchip Technology Inc.
DS52056A-page 5
