GoldMax 300 Comm X7R HV, Ceramic, 8200 pF, 10%, 630 VDC, X7R, GoldMax, Commercial Standard, Lead Spacing = 5.08mm
General Information
Supplier:
Series:
Style:
Description:
RoHS:
Termination:
Failure Rate:
Halogen Free:
KEMET
GoldMax 300 Comm X7R HV
Radial
GoldMax, Commercial Standard
Yes
Tin
N/A
Yes
Specifications
Dimensions
L
H
T
S
LL
F
3.81mm MAX
5.08mm MAX
3.14mm MAX
5.08mm +/-0.78mm
7mm MIN
0.51mm +0.1/-0.025mm
Capacitance:
Capacitance Tolerance:
Voltage DC:
Dielectric Withstanding
Voltage:
Temperature Range:
Temperature Coefficient:
Dissipation Factor:
Aging Rate:
Insulation Resistance:
8200 pF
10%
630 VDC
945 V
-55/+125C
X7R
2.50% 25C
3% Loss/Decade Hour
100 GOhms
Packaging Specifications
Packaging:
Packaging Quantity:
Bulk, Bag
500
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and
we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the
requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us
with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
作为使用目前嵌入式设备使用最多的协议之一,I2C和SPI都是要研究透的。在我使用的开发板上,SPI协议集成了,只需要使用3个GPIO引脚即可。但I2C协议没有集成,还得自己写I2C的时序驱动,I2C的时序图大家可以百度到,专门的协议文档也有。关于时序图我会贴到博客里。 1. I2C串行总线的组成与工作原理 a. 组成:2根双向信息线,一根数据线SDA,一根时钟线SCL b. I2C总...[详细]