Soldering Profile for RoHS Compliant Chip Resistors and Arrays
275
<1>
Maximum of 20 seconds between
260 °C peak
<1>
255 °C
+255 °C and +260 °C
225
220 °C
Temperature (°C)
190 °C
175
150 °C
60 - 90
seconds
Ramp Down
6 °C/second
Packaging Size
125
60 - 120 seconds
10 seconds minimum
75
Ramp Up
3 °C/second maximum
25
0
50
100
150
Time (seconds)
200
250
300
J2 .......... 0606 Package Size
F4, J4 .... 1206 Package Size
F8 .......... 2406 Package Size for CAT16
J8 .......... 2406 Package Size for CAT16;
1506 Package Size for CAY16
For Standard Values Used in Capacitors,
Inductors, and Resistors,
click here.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CAT/CAY 16 Series - Chip Resistor Arrays
Derating Curve
Rated power in percentage (%)
Schematics
CAT16-J2
CAY16-J2
CAT16-F4, -J4
CAY16-F4, -J4
100
80
60
40
20
0
-55
0
70
125
CAT16-F8, -J8
CAY16-J8
R1
R2
R1
R2
R3
R4
R1
R2
R3
R4
R5
R6
R7
R8
Ambient Temperature (˚C)
Dimensions
Model
CAT16-F4
CAT16-J4
CAY16-F4, -J4
CAT16-J2
CAY16-J2
CAT16-F8, -J8
CAY16-J8
A
0.40 ± 0.15
(.016 ± .006)
0.40 ± 0.15
(.016 ± .006)
0.50 ± 0.15
(.002 ± .006)
0.40 ± 0.15
(.016 ± .006)
—
0.40 ± 0.15
(.016 ± .006)
0.30 ± 0.15
(.012 ± .006)
A’
—
—
0.70 ± 0.10
(.027 ± .004)
—
0.60 ± 0.15
(.024 ± .006)
—
0.30 ± 0.15
(.012 ± .006)
B
3.20 ± 0.20
(.126 ± .008)
C
0.80 ± 0.10
(.032 ± .004)
D
1.60 ± 0.20
(.063 ± .008)
E
0.50 ± 0.10
(.020 ± .004)
0.50 ± 0.10
(.020 ± .004)
0.50 ± 0.10
(.020 ± .004)
0.60 ± 0.15
(.024 ± .006)
0.45 +0.15/-0.10
(.018 +0.006/-0.004)
0.60 ± 0.15
(.024 ± .006)
0.50 ± 0.10
(.02 ± .004)
F
0.30 ± 0.15
(.012 ± .006)
0.30 ± 0.20
(.012 ± .008)
0.30 ± 0.20
(.012 ± .008)
0.30 ± 0.20
(.012 ± .008)
0.30 ± 0.20
(.012 ± .008)
0.30 ± 0.20
(.012 ± .008)
0.30 ± 0.15
(.012 ± .006)
3.20 ± 0.20
0.80 ± 0.10
1.55 ± 0.25
(.126 ± .008) (.032 ± ± .004) (.061 ± .0098)
3.20 ± 0.20
(.126 ± .008)
1.60 ± 0.15
(.063 ± .006)
1.60 ± 0.15
(.063 ± .006)
6.40 ± 0.20
(.252 ± .008)
3.80 ± 0.20
(.15 ± .008)
0.80 ± 0.05
(.032 ± .002)
0.80 ± 0.05
(.032 ± .002)
0.76 ± 0.10
(.030 ± .004)
0.80 ± 0.15
(.032 ± .006)
0.50 ± 0.05
(.02 ± .002)
1.60 ± 0.20
(.063 ± .008)
1.60 ± 0.15
(.063 ± .006)
1.60 ± 0.15
(.063 ± .006)
1.60 ± 0.20
(.063 ± .008)
1.60 ± 0.20
(.063 ± .008)
Configurations
CAT16-F4, -J4
A
CAY16-F4, -J4
A'
A
CAT16-J2
A
CAY16-J2
A'
F
F
F
F
D
C
B
C
B
B
C
C
B
E
F
CAT16-F8, -J8
A
CAY16-J8
A'
A
DIMENSIONS:
MM
(INCHES)
F
F
D
C
B
C
B
E
F
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CAT/CAY 16 Series - Chip Resistor Arrays
Land Patterns
CAT16-F4, -J4, -F8, -J8
Solder
resist
Land
CAY16-F4, -J4, -J8
Solder
resist
Land
CAT16-J2
p
Solder
resist
Land
CAY16-J2
p
Solder
resist
Land
f
f
f
f
Chip
resistor
array
a
a
Chip
resistor
array
a
Chip
resistor
array
a
Chip
resistor
array
b
p
b
p
b
b
Model
CAT16-F4, -J4, -F8, -J8
CAY16-F4, -J4
CAY16-J8
CAT16-J2
CAY16-J2
Packaging Dimensions
1.0
MAX.
(.039)
1.5 + 0.1 - 0
(.059 + .004 - 0)
a
0.7 to 0.9
(.028 to .035)
0.7 to 0.9
(.028 to .035)
0.7 to 0.9
(.028 to .035)
0.7 to 0.9
(.028 to .035)
0.7 to 0.9
(.028 to .035)
b
0.4 to 0.45
(.016 to .0178)
0.4 to 0.45
(.016 to .0178)
0.3 to 0.35
(.012 to .014)
0.4 to 0.45
(.016 to .0178)
0.4 to 0.5
(.016 to .020)
p
0.80
(.032)
0.80
(.032)
0.50
(.020)
0.80
(.032)
0.80
(.032)
f
2.2 to 2.6
(.087 to .102)
2.4 to 2.8
(.094 to .11)
2.0 to 2.2
(.079 to .087)
2.2 to 2.6
(.087 to .102)
2.0 to 2.6
(.079 to .102)
4.0
±
0.1
(.158
±
.004)
2.0
±
0.5
(.079
±
.020)
13.0
±
0.5
(.511
±
.020)
b
c
60
(2.362)
a
DIMENSIONS:
MM
(INCHES)
2.0 + 0.1/-0.2
(.08 + .004/-.008)
4.0
±
0.1
(.157
±
.004)
180
(7.087)
21.0
±
0.8
(.827
±
.031)
d
e
Model
CAT16-F4, -J4 & CAY16-F4, J4
CAT16-J2 & CAY16-J2
CAT16-F8, -J8
CAY16-J8
• 5,000 pcs. per reel (J2, J4, CAY16-J8)
4,000 pcs. per reel (CAT16-F8, -J8)
• Paper tape
a
3.60 ± 0.20
(.142 ± .008)
1.80 ± 0.10
(.070 ± .004)
6.90 ± 0.20
(.272 ± .008)
4.10 ± 0.15
(.161 ± .012)
b
3.50 ± .005
(.138 ± .004)
3.50 ± .005
(.138 ± .004)
5.50 ± 0.10
(.217 ± .004)
3.50 ± 0.05
(.138 ± .002)
c
8.0 ± 0.3
(.315 ± .012)
8.0 ± 0.3
(.315 ± .012)
12.0 ± 0.2
(.472 ± .008)
8.0 ± 0.3
(.315 ± .012)
d
9.0 ± 0.3
(.354 ± .012)
9.0 ± 0.3
(.354 ± .012)
13.0 ± 0.2
(.512 ± .008)
9.0 ± 0.3
(.354 ± .012)
e
11.4 ± 1.0
(.449 ± .040)
11.4 ± 1.0
(.449 ± .040)
15.4 ± 1.0
(.606 ± .040)
11.4 ± 1.0
(.449 ± .040)
REV. 09/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Chip Resistor Arrays - Application Note
Component Placement
a. Reduce the mechanical stress to a minimum during and after placing of the unit in order not to damage the terminals and
protective coating.
b. Misplacement of components may cause solder bridges.
Soldering
a. Reflow soldering: Recommendation is shown in the following chart.
b. Wave soldering: Recommendation according to IEC standards.
c. Hand soldering: Don’t touch the protective coating of the part. Solder within 3 seconds when the temperature is over 280 ºC.
Temperature (°C)
Preheating
250
200
150
100
50
0
60 sec. min.
Soldering
Gradual Cooling
10-30 sec.
120 sec. min.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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