oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
■
■
■
■
■
Concave terminals
Lead free version available (see How to
Order “Termination” options)
RoHS compliant*
8 bit multiple applications
Smallest bussed chip array
■
E 24 Series from 10 ohms to 1 megohm
*R
CAT25 - Thick Film Chip Resistor Arrays
Electrical Characteristics
Parameters
Number of Resistors
Resistance Range E24
Resistance Tolerance
Power Rating/Resistor
Rating Temperature
T.C.R.
Maximum Operating Voltage
Operating Temperature
CAT25
8
10 ohms to 1 megohm
5%
62.5 mW
+70 °C
+/-200 ppm/°C
25 V
-55 °C to +125 °C
Test Method
How To Order
CA T 25 - 103 J A __
Product
CA = Chip Array
Pin Style
T = Concave
Model
Resistance Value
103 = 10K ohms
Tolerance
J=5%
Electrical Circuit
A = 8 Resistors, Bussed Type
JIS-C-5202.5.1
JIS-C-5202.5.2
Environmental Characteristics
Specification
Short Time Overload
Load Life
Humidity Load Life
Resistance to Soldering Heat
Terminal Strength
Temperature Cycle
Vibration
Insulation Resistance
Dielectric Withstanding Voltage
Lead Solderability
Characteristics
+/-(3 % +0.1 ohm)
+/-(5 % +0.1 ohm)
+/-(3 % +0.1 ohm)
+/-(1 % +0.1 ohm)
+/-(1 % +0.1 ohm)
+/-(2 % +0.1 ohm)
+/-(1 % +0.1 ohm)
1000 megohms minimum
50 VRMS
>95 %
Test Method
JIS-C-5202.5.5
JIS-C-5202.7.10
JIS-C-5202.7.9
JIS-C-5202.6.4
JIS-C-5202.6.
JIS-C-5202.7.4
JIS-C-5202.6.3
JIS-C-5202.5.6
JIS-C-5202.5.7
JIS-C-5202.6.5
Terminations
LF = Tin-plated (lead free)
Blank = Solder-plated
For Standard Values Used in Capacitors,
Inductors, and Resistors,
click here.
Outline Drawing
Land Pattern
4.8 - 5.2
(.190 - .205)
2.10 ± 0.20
(.083 ± .008)
2.8 - 3.0
(.110 - .118)
0.9 - 1.1
(.035 - .043)
103
0.30 ± 0.20
(.012 ± .008)
0.80 ± 0.10
(.032 ± .004)
4.00 ± 0.20
(.157 ± .008)
0.35 ± 0.20
(.014 ± .008)
0.25 ± 0.20
(.010 ± .008)
0.55 ± 0.10
(.022 ± .004)
3.3 - 3.4
(.130 - .133)
3.2 - 3.5
(.125 - .138)
0.50 ± 0.20
(.020 ± .008)
0.4 - 0.5
(.016 - .020)
0.80
(.032)
0.25 ± 0.15
DIA.
(.010 ± .006)
Electrical Circuit
0.40 ± 0.20
(.016 ± .008)
DIMENSIONS ARE:
MM
(INCHES)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CAT25 - Thick Film Chip Resistor Arrays
Soldering Profile for Lead Free Chip Resistors and Arrays
275
<1>
Maximum of 20 seconds between
260 °C peak
<1>
255 °C
+255 °C and +260 °C
225
220 °C
Temperature (°C)
190 °C
175
150 °C
60 - 90
seconds
Ramp Down
3 °C/second
125
60 - 120 seconds
10 seconds minimum
75
Ramp Up
3 °C/second maximum
25
0
50
100
150
Time (seconds)
200
250
300
Packaging
12
(.472) embossed tape
4,000 pcs. per reel
Material
Substrate
Element
Coating
Terminal
Alumina 96
Ruthenium Oxide
Glass
AgPb, Plated Ni+SnPb
REV. 04/06
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
