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CAT93C57ZD4A-1.8-E

IC,SERIAL EEPROM,128X16/256X8,CMOS,LLCC,8PIN,PLASTIC

器件类别:存储    存储   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
ON Semiconductor(安森美)
包装说明
TDFN-8
Reach Compliance Code
compliant
其他特性
IT ALSO OPERATES AT 0.25MHZ AT 1.8MIN
备用内存宽度
8
最大时钟频率 (fCLK)
1 MHz
数据保留时间-最小值
100
耐久性
1000000 Write/Erase Cycles
JESD-30 代码
S-PDSO-N8
JESD-609代码
e3
长度
3 mm
内存密度
2048 bit
内存集成电路类型
EEPROM CARD
内存宽度
16
湿度敏感等级
1
功能数量
1
端子数量
8
字数
128 words
字数代码
128
工作模式
SYNCHRONOUS
最高工作温度
105 °C
最低工作温度
-40 °C
组织
128X16
封装主体材料
PLASTIC/EPOXY
封装代码
HVSON
封装等效代码
SOLCC8,.12,25
封装形状
SQUARE
封装形式
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行
SERIAL
峰值回流温度(摄氏度)
225
电源
2/5 V
编程电压
2.7 V
认证状态
Not Qualified
座面最大高度
0.8 mm
串行总线类型
MICROWIRE
最大待机电流
0.00001 A
最大压摆率
0.003 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
NO LEAD
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
3 mm
写保护
SOFTWARE
文档预览
CAT93C56, CAT93C57
2-Kb Microwire Serial CMOS EEPROM
FEATURES
High speed operation: 2MHz
1.8V to 5.5V supply voltage range
Selectable x8 or x16 memory organization
Sequential read
Software write protection
Power-up inadvertant write protection
Low power CMOS technology
1,000,000 Program/erase cycles
100 year data retention
Industrial and Extended temperature ranges
RoHS-compliant 8-pin PDIP, SOIC, TSSOP and
8-pad TDFN packages
For Ordering Information details, see page 16.
DESCRIPTION
The CAT93C56/57 is a 2-Kb CMOS Serial EEPROM
device which is organized as either 128 registers of 16
bits (ORG pin at V
CC
) or 256 registers of 8 bits (ORG pin
at GND). Each register can be written (or read) serially
by using the DI (or DO) pin. The CAT93C56/57 features
sequential read and self-timed internal write with auto-
clear. On-chip Power-On Reset circuitry protects the
internal logic against powering up in the wrong state.
PIN CONFIGURATION
PDIP (L)
SOIC (V, X)
TSSOP (Y)
TDFN (VP2, ZD4*)
CS
SK
DI
DO
1
2
3
4
8 V
CC
7 NC
6 ORG
5 GND
NC
V
CC
CS
SK
FUNCTIONAL SYMBOL
V
CC
SOIC (W*)
1
2
3
4
8 ORG
7 GND
6 DO
5 DI
ORG
CS
SK
DI
CAT93C56
CAT93C57
DO
* TDFN 3x3mm (ZD4) and SOIC (W) rotated pin-out packages are
available for CAT93C57 and CAT93C56, Rev. E only (not
recommended for new designs of CAT93C56)
GND
PIN FUNCTION
Pin Name
CS
SK
DI
DO
V
CC
GND
ORG
NC
Function
Chip Select
Clock Input
Serial Data Input
Serial Data Output
Power Supply
Ground
Memory Organization
No Connection
Note: When the ORG pin is connected to VCC, the x16 organization
is selected. When it is connected to ground, the x8 pin is selected. If
the ORG pin is left unconnected, then am internal pullup device will
select the x16 organization
© 2008 SCILLC. All rights reserved
Characteristics subject to change without notice
1
Doc. No. MD-1088. Rev. R
CAT93C56, CAT93C57
Absolute Maximum Ratings
(1)
Parameters
Storage Temperature
Voltage on Any Pin with Respect to Ground
(2)
Reliability Characteristics
(3)
Symbol
NEND
(4)
TDR
Parameter
Endurance
Data Retention
Min
1,000,000
100
Units
Program/ Erase Cycles
Years
Ratings
-65 to +150
-0.5 to +6.5
Units
°C
V
D.C. OPERATING CHARACTERISTICS, CAT93C56, Die Rev. G – New Product
V
CC
= +1.8V to +5.5V, T
A
=-40°C to +125°C unless otherwise specified.
Symbol
I
CC1
I
CC2
I
SB1
I
SB2
I
LI
I
LO
V
IL1
V
IH1
V
IL2
V
IH2
V
OL1
V
OH1
V
OL2
V
OH2
Notes:
(1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this
specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
(2) The DC input voltage on any pin should not be lower than -0.5V or higher than V
CC
+ 0.5V. During transitions, the voltage on any pin may
undershoot to no less than -1.5V or overshoot to no more than V
CC
+ 1.5V, for periods of less than 20 ns.
(3) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100
and JEDEC test methods.
(4) Block Mode, V
CC
= 5V, 25°C
Parameter
Power Supply Current
(Write)
Power Supply Current
(Read)
Power Supply Current
(Standby) (x8 Mode)
Power Supply Current
(Standby) (x16 Mode)
Input Leakage Current
Output Leakage
Current
Input Low Voltage
Input High Voltage
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Output Low Voltage
Output High Voltage
Test Conditions
f
SK
= 1MHz, V
CC
= 5.0V
f
SK
= 1MHz, V
CC
= 5.0V
V
IN
= GND or V
CC
,
CS = GND ORG = GND
V
IN
= GND or V
CC
, CS =
GND ORG = Float or V
CC
V
IN
= GND to V
CC
V
OUT
= GND to V
CC
,
CS = GND
4.5V
V
CC
< 5.5V
4.5V
V
CC
< 5.5V
1.8V
V
CC
< 4.5V
1.8V
V
CC
< 4.5V
4.5V
V
CC
< 5.5V,
I
OL
= 2.1mA
4.5V
V
CC
< 5.5V,
I
OH
= -400µA
1.8V
V
CC
< 4.5V,
I
OL
= 1mA
1.8V
V
CC
< 4.5V,
I
OH
= -100µA
T
A
= -40°C to +85°C
T
A
= -40°C to +125°C
T
A
= -40°C to +85°C
T
A
= -40°C to +125°C
T
A
= -40°C to +85°C
T
A
= -40°C to +125°C
T
A
= -40°C to +85°C
T
A
= -40°C to +125°C
Min
Max
1
500
2
4
1
2
1
2
1
2
Units
mA
µA
µA
µA
µA
µA
V
V
V
V
V
V
-0.1
2
0
V
CC
x 0.7
0.8
V
CC
+ 1
V
CC
x 0.2
V
CC
+ 1
0.4
2.4
0.2
V
CC
- 0.2
V
V
Doc. No. MD-1088, Rev. R
2
© 2008 SCILLC. All rights reserved
Characteristics subject to change without notice
CAT93C56, CAT93C57
D.C. OPERATING CHARACTERISTICS, CAT93C56/57, Die Rev. E – Mature Product
(CAT93C56, Rev. E – NOT RECOMMENDED FOR NEW DESIGNS)
V
CC
= +1.8V to +5.5V, T
A
=-40°C to +125°C unless otherwise specified.
Symbol
I
CC1
I
CC2
I
SB1
I
SB2
I
LI
I
LO
V
IL1
V
IH1
V
IL2
V
IH2
V
OL1
V
OH1
V
OL2
V
OH2
Parameter
Power Supply Current (Write)
Power Supply Current (Read)
Power Supply Current
(Standby) (x8 Mode)
Power Supply Current
(Standby) (x16 Mode)
Input Leakage Current
Output Leakage Current
Input Low Voltage
Input High Voltage
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Output Low Voltage
Output High Voltage
Test Conditions
f
SK
= 1MHz, V
CC
= 5.0V
f
SK
= 1MHz, V
CC
= 5.0V
V
IN
= GND or V
CC
, CS = GND
ORG = GND
V
IN
= GND or V
CC
, CS = GND
ORG = Float or V
CC
V
IN
= GND to V
CC
V
OUT
= GND to V
CC
, CS = GND
4.5V
V
CC
< 5.5V
4.5V
V
CC
< 5.5V
1.8V
V
CC
< 4.5V
1.8V
V
CC
< 4.5V
4.5V
V
CC
< 5.5V, I
OL
= 2.1mA
4.5V
V
CC
< 5.5V, I
OH
= -400µA
1.8V
V
CC
< 4.5V, I
OL
= 1mA
1.8V
V
CC
< 4.5V, I
OH
= -100µA
V
CC
- 0.2
2.4
0.2
-0.1
2
0
V
CC
x 0.7
Min
Max
3
500
10
10
1
1
0.8
V
CC
+ 1
V
CC
x 0.2
V
CC
+ 1
0.4
Units
mA
µA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
PIN CAPACITANCE
T
A
= 25°C, f = 1MHz, V
CC
= 5V
Symbol
C
OUT(1)
C
IN(1)
Notes:
(1) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100
and JEDEC test methods.
Test
Output Capacitance (DO)
Input Capacitance (CS, SK, DI, ORG)
Conditions
V
OUT
= 0V
V
IN
= 0V
Min
Typ
Max
5
5
Units
pF
pF
© 2008 SCILLC. All rights reserved
Characteristics subject to change without notice
3
Doc. No. MD-1088, Rev. R
CAT93C56, CAT93C57
A.C. CHARACTERISTICS
(1)
, CAT93C56, Die Rev. G – New Product
V
CC
= +1.8V to +5.5V, T
A
= -40°C to +125°C, unless otherwise specified.
Limits
Symbol
t
CSS
t
CSH
t
DIS
t
DIH
t
PD1
t
PD0
t
HZ(2)
t
EW
t
CSMIN
t
SKHI
t
SKLOW
t
SV
SK
MAX
Parameter
CS Setup Time
CS Hold Time
DI Setup Time
DI Hold Time
Output Delay to 1
Output Delay to 0
Output Delay to High-Z
Program/Erase Pulse Width
Minimum CS Low Time
Minimum SK High Time
Minimum SK Low Time
Output Delay to Status Valid
Maximum Clock Frequency
DC
0.25
0.25
0.25
0.25
2000
Min
50
0
100
100
0.25
0.25
100
5
Max
Units
ns
ns
ns
ns
µs
µs
ns
ms
µs
µs
µs
µs
kHz
A.C. CHARACTERISTICS
(1)
, CAT93C56/57, Die Rev. E – Mature Product
(CAT93C56 Rev. E - NOT RECOMMENDED FOR NEW DESIGNS)
Limits
Symbol
t
CSS
t
CSH
t
DIS
t
DIH
t
PD1
t
PD0
t
HZ(2)
t
EW
t
CSMIN
t
SKHI
t
SKLOW
t
SV
SK
MAX
Notes
:
(1)
(2)
Test conditions according to “A.C. Test Conditions” table.
These parameters are tested initially and after a design or process change that affects the parameter according to appropriate
AEC-Q100 and JEDEC test methods.
Parameter
CS Setup Time
CS Hold Time
DI Setup Time
DI Hold Time
Output Delay to 1
Output Delay to 0
Output Delay to High-Z
Program/Erase Pulse Width
Minimum CS Low Time
Minimum SK High Time
Minimum SK Low Time
Output Delay to Status Valid
Maximum Clock Frequency
V
CC
= 1.8V - 5.5V
Min
200
0
400
400
1
1
400
10
1
1
1
1
DC
250
Max
V
CC
= 2.5V - 5.5V
Min
100
0
200
200
0.5
0.5
200
10
0.5
0.5
0.5
0.5
DC
500
Max
V
CC
= 4.5V - 5.5V
Min
50
0
100
100
0.25
0.25
100
10
0.25
0.25
0.25
0.25
DC
1000
Max
Units
ns
ns
ns
ns
µs
µs
ns
ms
µs
µs
µs
µs
kHz
Doc. No. MD-1088, Rev. R
4
© 2008 SCILLC. All rights reserved
Characteristics subject to change without notice
CAT93C56, CAT93C57
POWER-UP TIMING
(1) (2)
Symbol
t
PUR
t
PUW
Parameter
Power-up to Read Operation
Power-up to Write Operation
Max
1
1
Units
ms
ms
Notes
:
(1) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate
AEC-Q100 and JEDEC test methods.
(2) t
PUR
and t
PUW
are the delays required from the time V
CC
is stable until the specified operation can be initiated.
A.C. Test Conditions
Input Rise and Fall Times
Input Pulse Voltages
Timing Reference Voltages
Input Pulse Voltages
Timing Reference Voltages
Output Load
50 ns
0.4V to 2.4V
0.8V, 2.0V
0.2V
CC
to 0.7V
CC
0.5V
CC
4.5V
V
CC
5.5V
4.5V
V
CC
5.5V
1.8V
V
CC
4.5V
1.8V
V
CC
4.5V
Current Source I
OLmax
/I
OHmax
; CL=100pF
DEVICE OPERATION
The CAT93C56/57 is a 2048-bit nonvolatile memory
intended for use with industry standard micropro-
cessors. The CAT93C56/57 can be organized as
either registers of 16 bits or 8 bits. When organized as
X16, seven 10-bit instructions for 93C57 or seven 11-
bit instructions for 93C56 control the reading, writing
and erase operations of the device. When organized
as X8, seven 11-bit instructions for 93C57 or seven
12-bit instructions for 93C56 control the reading,
writing and erase operations of the device. The
CAT93C56/57 operates on a single power supply and
will generate on chip, the high voltage required during
any write operation.
Instructions, addresses, and write data are clocked
into the DI pin on the rising edge of the clock (SK).
The DO pin is normally in a high impedance state
Figure 1. Sychronous Data Timing
tSKHI
SK
tDIS
DI
tCSS
CS
tDIS
DO
tPD0,tPD1
DATA VALID
tCSMIN
VALID
VALID
tDIH
tSKLOW
tCSH
except when reading data from the device, or when
checking the ready/busy status after a write operation.
The serial communication protocol follows the timing
shown in Figure 1.
The ready/busy status can be determined after the start
of internal write cycle by selecting the device (CS high)
and polling the DO pin; DO low indicates that the write
operation is not completed, while DO high indicates that
the device is ready for the next instruction. If necessary,
the DO pin may be placed back into a high impedance
state during chip select by shifting a dummy “1” into the
DI pin. The DO pin will enter the high impedance state
on the rising edge of the clock (SK). Placing the DO pin
into the high impedance state is recommended in
applications where the DI pin and the DO pin are to be
tied together to form a common DI/O pin.
© 2008 SCILLC. All rights reserved
Characteristics subject to change without notice
5
Doc. No. MD-1088, Rev. R
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