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CBRHD-06 TR13

IC RECT BRIDGE 600V 0.5A HD DIP

器件类别:半导体    分立半导体   

厂商名称:Central Semiconductor

器件标准:

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器件参数
参数名称
属性值
二极管类型
单相
技术
标准
电压 - 峰值反向(最大值)
600V
电流 - 平均整流(Io)
500mA
不同 If 时的电压 - 正向(Vf
1V @ 400mA
不同 Vr 时的电流 - 反向漏电流
5µA @ 600V
工作温度
-65°C ~ 150°C(TJ)
安装类型
表面贴装
封装/外壳
4-SMD,鸥翼
供应商器件封装
4-HD DIP
文档预览
CBRHD SERIES
SURFACE MOUNT SILICON
HIGH DENSITY
0.5 AMP
BRIDGE RECTIFIER
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CBRHD series
devices are silicon full wave bridge rectifiers mounted
in a durable epoxy surface mount molded case, utilizing
glass passivated chips.
MARKING CODES:
CBRHD-02: CBD2
CBRHD-06: CBD6
CBRHD-04: CBD4
CBRHD-10: CBD10
HD DIP CASE
FEATURES:
Efficient use of board space: requires only 42mm
2
of
board space vs. 120mm
2
of board space needed for
industry standard 1.0 Amp surface mount bridge rectifier.
MAXIMUM RATINGS:
(TA=25°C unless otherwise noted)
SYMBOL
Peak Repetitive Reverse Voltage
VRRM
DC Blocking Voltage
VR
RMS Reverse Voltage
Average Forward Current (TA=40°C) (Note 1)
Average Forward Current (TA=40°C) (Note 2)
Peak Forward Surge Current
Operating & Storage Junction Temperature
VR(RMS)
IO
IO
IFSM
TJ, Tstg
50% higher density (Amps/mm
2
) than the industry
standard 1.0 Amp surface mount bridge rectifier.
Glass passivated chips for high reliability.
CBRHD
-04
-06
400
600
400
280
0.5
0.8
30
-65 to +150
600
420
-02
200
200
140
-10*
1000
1000
700
UNITS
V
V
V
A
A
A
°C
ELECTRICAL CHARACTERISTICS PER DIODE:
(TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
TYP
MAX
IR
VR=Rated VRRM
5.0
IR
VR=Rated VRRM, TA=125°C
500
VF
CJ
IF=400mA
VR=4.0V, f=1.0MHz
1.0
20
UNITS
μA
μA
V
pF
Notes: (1) Mounted on Glass-Epoxy PCB.
(2) Mounted on Ceramic PCB.
* Available on special order, please consult factory.
R5 (18-February 2016)
CBRHD SERIES
SURFACE MOUNT SILICON
HIGH DENSITY
0.5 AMP
BRIDGE RECTIFIER
HD DIP CASE - MECHANICAL OUTLINE
MARKING CODES:
CBRHD-02: CBD2
CBRHD-04: CBD4
CBRHD-06: CBD6
CBRHD-10: CBD10
R5 (18-February 2016)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2
nd
day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1.
2.
If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s
LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
w w w. c e n t r a l s e m i . c o m
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