描述 |
RF Transceiver FSK/GFSK/MSK/OOK 20-Pin VQFN EP Tube |
RF Transceiver S-Chip Lo POW RF |
RF Transceiver 2.4GHz TRANSCEIVER CHIP |
Low Cost, Low-Power 2.4 GHz RF Transceiver Designed for Low-Power Wireless Apps in the 2.4 GHz ISM B |
Brand Name |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否Rohs认证 |
- |
符合 |
符合 |
符合 |
零件包装代码 |
- |
QFN |
QFN |
QFN |
包装说明 |
- |
HVQCCN, LCC20,.16SQ,20 |
HVQCCN, LCC20,.16SQ,20 |
HVQCCN, LCC20,.16SQ,20 |
针数 |
- |
20 |
20 |
20 |
Reach Compliance Code |
- |
compli |
compli |
compli |
JESD-30 代码 |
- |
S-PQCC-N20 |
S-PQCC-N20 |
S-PQCC-N20 |
JESD-609代码 |
- |
e4 |
e4 |
e4 |
长度 |
- |
4 mm |
4 mm |
4 mm |
湿度敏感等级 |
- |
3 |
3 |
3 |
功能数量 |
- |
1 |
1 |
1 |
端子数量 |
- |
20 |
20 |
20 |
最高工作温度 |
- |
85 °C |
85 °C |
85 °C |
最低工作温度 |
- |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
- |
HVQCCN |
HVQCCN |
HVQCCN |
封装等效代码 |
- |
LCC20,.16SQ,20 |
LCC20,.16SQ,20 |
LCC20,.16SQ,20 |
封装形状 |
- |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
- |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) |
- |
260 |
260 |
260 |
电源 |
- |
1.8/3.6 V |
1.8/3.6 V |
1.8/3.6 V |
认证状态 |
- |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
- |
0.9 mm |
0.9 mm |
0.9 mm |
标称供电电压 |
- |
3 V |
3 V |
3 V |
表面贴装 |
- |
YES |
YES |
YES |
技术 |
- |
CMOS |
CMOS |
CMOS |
电信集成电路类型 |
- |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
温度等级 |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
- |
NO LEAD |
NO LEAD |
NO LEAD |
端子节距 |
- |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
- |
QUAD |
QUAD |
QUAD |
处于峰值回流温度下的最长时间 |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
- |
4 mm |
4 mm |
4 mm |