SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85
器件类别:嵌入式处理器和控制器 微控制器和处理器
器件标准:
敬请期待型号 | CC2630F128RHBT | CC2630F128RSMR | CC2630F128RSMT | CC2630F128RHBR | CC2630F128RGZR |
---|---|---|---|---|---|
描述 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 32-VQFN -40 to 85 | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications 48-VQFN -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
Reach Compliance Code | compli | compli | compli | compli | compli |
Factory Lead Time | 6 weeks | 6 weeks | 8 weeks | 6 weeks | 8 weeks |
具有ADC | YES | YES | YES | YES | YES |
位大小 | 16 | 16 | 16 | 16 | 16 |
DAC 通道 | NO | NO | NO | NO | NO |
DMA 通道 | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N48 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
长度 | 5 mm | 4 mm | 4 mm | 5 mm | 7 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
I/O 线路数量 | 15 | 10 | 10 | 15 | 31 |
端子数量 | 32 | 32 | 32 | 32 | 48 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
速度 | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
最大供电电压 | 3.8 V | 3.8 V | 3.8 V | 3.8 V | 3.8 V |
最小供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.4 mm | 0.4 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 5 mm | 4 mm | 4 mm | 5 mm | 7 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - |
Samacsys Descripti | Ultra-low power wireless MCU targeting 2.4GHz applications | SimpleLink ultra-low power wireless MCU targeting Zigbee® and 6LoWPAN applications | RF Microcontrollers - MCU SimpleLink ultra-low power wireless MCU targeting Zigbee and 6LoWPAN applications 32-VQFN -40 to 85 | - | - |
ECCN代码 | - | 5A992C | - | 5A992C | 5A992C |