PL
IA
Features
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Applications
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NT
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Lead free as standard
RoHS compliant*
Low profile
Low power loss, high efficiency
UL 94V-0 classification
High frequency switching power supplies
Inverters
Free wheeling
Polarity protection
*R
oH
S
CO
M
General Information
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components. Bourns offers Schottky Rectifier Diodes for rectification applications, in
compact chip package 2010 size format, which offers PCB real estate savings and
are considerably smaller than most competitive parts. The Schottky Rectifier Diodes
offer a forward current of 1 A with a repetitive peak reverse voltage of 40 V.
Bourns
®
Chip Diodes conform to JEDEC standards, are easy to handle on standard
pick and place equipment and their flat configuration minimizes roll away.
FRP Substrate
and Epoxy
Underfill
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
DC Blocking Voltage
Repetitive Peak Reverse Voltage
Average Forward Rectified Current
1
Instantaneous Forward Voltage @ I
F
= 1.0 A
Reverse Leakage Current @ V
RRM
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
(JEDEC Method)
Notes:
1 See Forward Derating Curve.
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Junction Temperature Range
Storage Temperature Range
Symbol
T
J
T
STG
Min.
-40
-40
Nom.
+25
+25
Max.
+125
+125
Unit
°C
°C
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
6
CD2010-B140 – Surface Mount Schottky Rectifier Diode
Tin Plated
Connectors
Symbol
V
DC
V
RRM
I
(AV)
V
F
I
R
Min.
Nom.
Max.
40
40
1.0
Unit
V
V
A
V
mA
0.45
0.55
0.1
I
FSM
70
A
CD2010-B140 – Surface Mount Schottky Rectifier Diode
Product Dimensions
This is a lead free product. It is packaged with FRP substrate and is
epoxy underfilled. The terminals are pure tin plated and are
solderable per MIL-STD-750, Method 2026. The package weighs
approximately 0.02 g. The package and dimensions are shown
below.
A
Recommended Footprint
The device will mount onto existing JEDEC SOD-106 footprint.
How To Order
CD 2010 - B 1 40
Common Code
Chip Diode
Package
• 2010
Model
B = Schottky Barrier Diode
Current
1=1A
Working Peak Reverse Voltage
40 = 40 V
RWM
(Volts)
B
C
D
E
F
Dimensions
A
B
C
D
E
F
4.40 - 4.60
(0.173 - 0.181)
2.10 - 2.30
(0.083 - 0.091)
0.50
(0.020)
0.75 - 1.15
(0.029 - 0.045)
0.75 - 1.15
(0.029 - 0.045)
0.85 - 1.25
(0.033 - 0.049)
DIMENSIONS:
MM
(INCHES)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD2010-B140 – Surface Mount Schottky Rectifier Diode
Rating and Characteristic Curves
Forward Current Derating Curve
Average Forward Rectified Current (Amps)
1.5
Peak Forward Surge Current (Amps)
Maximum Non-Repetitive Peak Forward Surge Current
80
70
60
50
40
30
20
10
0
1
10
Number of Cycles at 60 Hz
100
Pulse Width 8.3 ms
Single Half Sine-Wave
(JEDEC Method)
1.0
0.5
0
0
25
50
75
100
125
150
Lead Temperature (°C)
Forward Characteristics
10.00
Reverse Characteristics
100
Instantaneous Forward Current (Amps)
10
Instantaneous Reverse Current (mA)
1.00
TJ = 100 °C
1.0
0.10
0.10
1.0
TJ = 25 °C
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
Instantaneous Forward Voltage (Volts)
0.001
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Typical Junction Capacitance
400
Junction Capacitance (pF)
T
J
= 25 °C
f = 1.0 MHz
V
sig
= 50 mVP-P
100
10
0.1
1.0
10
Reverse Voltage (Volts)
100
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD2010-B140 – Surface Mount Schottky Rectifier Diode
Packaging Information
The product will be dispensed in Tape and Reel format (see diagram below).
P
0
P
1
d
E
Index Hole
T
120
°
F
W
B
D2
D1 D
P
Trailer
A
Device
C
Leader
W1
Start
DIMENSIONS:
MM
(INCHES)
End
....... .......
....... .......
.......
....... ....... .......
10 pitches (min.)
10 pitches (min.)
Direction of Feed
Devices are packed in accordance with EIA standard
RS-481-A and specifications shown here.
Item
Carrier Width
Carrier Length
Carrier Depth
Sprocket Hole
Reel Outside Diameter
Reel Inner Diameter
Feed Hole Diameter
Sprocket Hole Position
Punch Hole Position
Punch Hole Pitch
Sprocket Hole Pitch
Embossment Center
Overall Tape Thickness
Tape Width
Reel Width
Quantity per Reel
Symbol
A
B
C
d
D
D1
D2
E
F
P
P0
P1
T
W
W1
—
2010
2.80 ± 0.10
(0.110 ± 0.004)
5.00 ± 0.10
(0.197 ± 0.004)
1.55 ± 0.10
(0.061 ± 0.004)
1.55 ± 0.05
(0.061 ± 0.002)
178
(7.008)
80.0
Min.
(3.150)
13.0 ± 0.20
(0.512 ± 0.008)
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.05
(0.138 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
0.20 ± 0.10
(0.008 ± 0.004)
8.00 ± 0.20
(0.315 ± 0.008)
13.5
Max.
(0.531)
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A. IPA0501 04/05
2,500
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