CD3156,CD3156 pdf中文资料,CD3156引脚图,CD3156电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否无铅

含铅

是否Rohs认证

不符合

厂商名称

Microsemi

零件包装代码

DIE

包装说明

DIE-2

针数

Reach Compliance Code

unknown

ECCN代码

EAR99

配置

SINGLE

二极管元件材料

SILICON

二极管类型

ZENER DIODE

最大动态阻抗

25 Ω

JESD-30 代码

S-XUUC-N2

JESD-609代码

元件数量

端子数量

最高工作温度

100 °C

封装主体材料

UNSPECIFIED

封装形状

SQUARE

封装形式

UNCASED CHIP

峰值回流温度（摄氏度）

NOT SPECIFIED

认证状态

Not Qualified

标称参考电压

8.4 V

表面贴装

YES

技术

ZENER

端子面层

TIN LEAD

端子形式

NO LEAD

端子位置

UPPER

处于峰值回流温度下的最长时间

NOT SPECIFIED

电压温度Coeff-Max

0.168 mV/°C

最大电压容差

工作测试电流

10 mA

文档预览

• MONOLITHIC TEMPERATURE COMPENSATED ZENER REFERENCE CHIPS

• ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE

• 8.4 VOLT NOMINAL ZENER VOLTAGE + 5%

• ELECTRICALLY SIMILAR TO 1N3154 THRU 1N3156

• COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES,

WITH THE EXCEPTION OF SOLDER REFLOW

CD3154

thru

CD3156

38 MILS

23 MILS

MAXIMUM RATINGS

Operating Temperature: -65°C to +175°C

Storage Temperature: -65°C to +175°C

38 MILS

10 MILS

23 MILS

FIGURE 1

ELECTRICAL CHARACTERISTICS

@ 25°C, unless otherwise speci½ed.

MAXIMUM

VOLTAGE

TEMPERATURE

ZENER

TEMPERATURE

RANGE

IMPEDANCE

STABILITY

ZZT

³V

MAXIMUM

(Note 1)

VOLTS

CD3154

CD3155

CD3156

8.00-8.80

OHMS

(Note 2)

130

°C

-55 to + 100

% / °C

0.01

0.005

0.002

JEDEC

TYPE

NUMBER

ZENER

VOLTAGE

ZENER

TEST

CURRENT

EFFECTIVE

TEMPERATURE

COEFFICIENT

DESIGN DATA

METALLIZATION:

Top: C (Cathode).............Al

A (Anode)................Al

Back:.................................Au

AL THICKNESS.......25,000

Min

GOLD THICKNESS...4,000

Min

CHIP THICKNESS.............10

Mils

NOTE 1

Zener impedance is derived by superimposing on lZT @ 60Hz rms a.c. current equal

to 10% of l .

The maximum allowable change observed over the entire temperature range

i.e.,the diode voltage will not exceed the speci½ed mV at any discrete

temperature between the established limits, per JEDEC standard No. 5.

NOTE 2

CIRCUIT LAYOUT DATA:

Backside must be electrically

isolated.

Backside is not cathode.

For Zener operation cathode must

be operated positive with respect

to anode.

TOLERANCES:

ALL

Dimensions + 2 mils

6 LAKE STREET, LAWRENCE,

PHONE (978) 620-2600

WEBSITE: http://www.microsemi.com

M A S S A C H U S E T T S 01841

FAX (978) 689-0803

185

11 MILS

CD3154

thru

CD3156

Pd, Rated Power

Dissipation (mW)

600

500

400

300

200

100

125

150

175

TL, Ambient temperature (C°)

100

FIGURE 2

POWER DERATING CURVE

ZENER IMPEDANCE ZZT (OHMS)

OPERATING CURRENT lZT (mA)

FIGURE 3

ZENER IMPEDANCE

VS.

OPERATING CURRENT

+.0015

CHANGE IN TEMPERATURE COEFFICIENT ( %/°C)

+.0010

+.0005

-.0005

-.0010

-.0015

OPERATING CURRENT lZT (mA)

FIGURE 4

TYPICAL CHANGE OF TEMPERATURE COEFFICIENT

WITH CHANGE IN OPERATING CURRENT

186

参数对比

与CD3156相近的元器件有：CD3154、CD3155。描述及对比如下：

型号	CD3156	CD3154	CD3155
描述	Zener Diode, 8.4V V(Z), 5%, Silicon, DIE-2	Zener Diode, 8.4V V(Z), 5%, Silicon, DIE-2	Zener Diode, 8.4V V(Z), 5%, Silicon, DIE-2
是否无铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合
零件包装代码	DIE	DIE	DIE
包装说明	DIE-2	S-XUUC-N2	DIE-2
针数	2	2	2
Reach Compliance Code	unknown	compliant	unknown
ECCN代码	EAR99	EAR99	EAR99
配置	SINGLE	SINGLE	SINGLE
二极管元件材料	SILICON	SILICON	SILICON
二极管类型	ZENER DIODE	ZENER DIODE	ZENER DIODE
最大动态阻抗	25 Ω	25 Ω	25 Ω
JESD-30 代码	S-XUUC-N2	S-XUUC-N2	S-XUUC-N2
JESD-609代码	e0	e0	e0
元件数量	1	1	1
端子数量	2	2	2
最高工作温度	100 °C	100 °C	100 °C
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装形状	SQUARE	SQUARE	SQUARE
封装形式	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified
标称参考电压	8.4 V	8.4 V	8.4 V
表面贴装	YES	YES	YES
技术	ZENER	ZENER	ZENER
端子面层	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	NO LEAD	NO LEAD	NO LEAD
端子位置	UPPER	UPPER	UPPER
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电压温度Coeff-Max	0.168 mV/°C	0.84 mV/°C	0.42 mV/°C
最大电压容差	5%	5%	5%
工作测试电流	10 mA	10 mA	10 mA
厂商名称	Microsemi	-	Microsemi