型号
- 型号
- 关键词
| 型号 | CD4011UBK | CD4011UBE | CD4011UBF | CD4011UBD |
|---|---|---|---|---|
| 描述 | NAND Gate, CMOS, CDFP14 | NAND Gate, 4000/14000/40000 Series, 4-Func, 2-Input, CMOS, PDIP14 | NAND Gate, 4000/14000/40000 Series, 4-Func, 2-Input, CMOS, CDIP14 | NAND Gate, 4000/14000/40000 Series, 4-Func, 2-Input, CMOS, CDIP14, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknow | unknown | unknown | unknown |
| JESD-30 代码 | R-XDFP-F14 | R-PDIP-T14 | R-GDIP-T14 | R-CDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 最大I（ol） | 0.00036 A | 0.00042 A | 0.00036 A | 0.00036 A |
| 端子数量 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | DIP | DIP |
| 封装等效代码 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO |
| 表面贴装 | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - |
| 系列 | - | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| 功能数量 | - | 4 | 4 | 4 |
| 输入次数 | - | 2 | 2 | 2 |
| Prop。Delay @ Nom-Sup | - | 120 ns | 120 ns | 120 ns |
| 最大供电电压 (Vsup) | - | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V |