型号
- 型号
- 关键词
| 型号 | CD4515BD | CD4514BE | CD4515BE | CD4514BD | CD4515BF | CD4514BH | CD4514BF | CD4514BK | CD4515BH |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Decoder/Driver, CMOS, CDIP24, | Decoder/Driver, CMOS, PDIP24, | Decoder/Driver, CMOS, PDIP24, | Decoder/Driver, CMOS, CDIP24, | Decoder/Driver, CMOS, CDIP24, | Decoder/Driver, CMOS, | Decoder/Driver, CMOS, CDIP24, | Decoder/Driver, CMOS, CDFP24, | Decoder/Driver, CMOS, |
| 包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | , DIE OR CHIP | DIP, DIP24,.6 | DFP, FL24,.4 | , DIE OR CHIP |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIE OR CHIP | DIP24,.6 | FL24,.4 | DIE OR CHIP |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | - |
| 厂商名称 | RCA | RCA | RCA | - | - | RCA | RCA | RCA | RCA |
| JESD-30 代码 | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | - | R-XDIP-T24 | R-XDFP-F24 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 | - |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | - | 24 | 24 | - |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | - | CERAMIC | CERAMIC | - |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | - | DIP | DFP | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | IN-LINE | FLATPACK | - |
| 表面贴装 | NO | NO | NO | NO | NO | - | NO | YES | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | FLAT | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | - |
