• ZENER DIODE CHIPS
• ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE
• ELECTRICALLY EQUIVALENT TO 1N5221B THRU 1N5272B
• 0.5 WATT CAPABILITY WITH PROPER HEAT SINKING
• COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES,
WITH THE EXCEPTION OF SOLDER REFLOW
CD5221B
thru
CD5272B
ELECTRICAL CHARACTERISTICS
@ 25°C, unless otherwise specifed
NOMINAL
ZENER
VOLTAGE
(Note 1)
VZ @ lZT
VOLTS
CD5221B
CD5222B
CD5223B
CD5224B
CD5225B
CD5226B
CD5227B
CD5228B
CD5229B
CD5230B
CD5231B
CD5232B
CD5233B
CD5234B
CD5235B
CD5236B
CD5237B
CD5238B
CD5239B
CD5240B
CD5241B
CD5242B
CD5243B
CD5244B
CD5245B
CD5246B
CD5247B
CD5248B
CD5249B
CD5250B
CD5251B
CD5252B
CD5253B
CD5254B
CD5255B
CD5256B
CD5257B
CD5258B
CD5259B
CD5260B
CD5261B
CD5262B
CD5263B
CD5264B
CD5265B
CD5266B
CD5267B
CD5268B
CD5269B
CD5270B
CD5271B
CD5272B
2.4
2.5
2.7
2.8
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.0
6.2
6.8
7.5
8.2
8.7
9.1
10
11
12
13
14
15
16
17
18
19
20
22
24
25
27
28
30
33
36
39
43
47
51
56
60
62
68
75
82
87
91
100
110
MAXIMUM
ZENER IMPEDANCE
(Note 2)
ZZT @ lZT
ZZK@lZK=0.25mA
OHMS
OHMS
30
30
30
30
29
28
24
23
22
19
17
11
7.0
7.0
5.0
6.0
8.0
8.0
10
17
22
30
13
15
16
17
19
21
23
25
29
33
35
41
44
49
58
70
80
93
105
125
150
170
185
230
270
330
370
400
500
750
1200
1250
1300
1400
1600
1600
1700
1900
2000
1900
1600
1600
1600
1000
750
500
500
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
700
700
800
900
1000
1100
1300
1400
1400
1600
1700
2000
2200
2300
2600
3000
MAXIMUM
REVERSE CURRENT
lR @ V R
23 MILS
15 MILS
TYPE
NUMBER
TEST
CURRENT
lZT
mA
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
9.5
9.0
8.5
7.8
7.4
7.0
6.6
6.2
5.6
5.2
5.0
4.6
4.5
4.2
3.8
3.4
3.2
3.0
2.7
2.5
2.2
2.1
2.0
1.8
1.7
1.5
1.4
1.4
1.3
1.1
µ
A
100
100
75
75
50
25
15
10
5.0
5.0
5.0
5.0
5.0
5.0
3.0
3.0
3.0
3.0
3.0
3.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VOLTS
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
3.5
4.0
5.0
6.0
6.5
6.5
7.0
8.0
8.4
9.1
9.9
10
11
12
13
14
14
15
17
18
19
21
21
23
25
27
30
33
36
39
43
46
47
52
56
62
68
69
76
84
BACKSIDE IS CATHODE
FIGURE 1
DESIGN DATA
METALLIZATION:
Top: (Anode)......................Al
Back: (Cathode)................Au
AL THICKNESS..............25,000
Å
Min
GOLD THICKNESS...
.......4,000
Å
Min
CHIP THICKNESS.............
.......10 Mils
CIRCUIT LAYOUT DATA:
For Zener operation, cathode
must be operated positive with
respect to anode.
TOLERANCES:
ALL
Dimensions + 2 mils
NOTES ON PAGE 158
6 LAKE STREET, LAWRENCE,
PHONE (978) 620-2600
WEBSITE: http://www.microsemi.com
M A S S A C H U S E T T S 01841
FAX (978) 689-0803
203
15 MILS
23 MILS
