型号
- 型号
- 关键词
High Speed CMOS Logic Octal Transparent Latches with 3-State Outputs 20-SOIC -55 to 125
器件标准：
| 型号 | CD74HC573M96 | CD74HC573M | CD74HC573M96G4 | CD74HC573MG4 | CD74HC573EE4 |
|---|---|---|---|---|---|
| 描述 | High Speed CMOS Logic Octal Transparent Latches with 3-State Outputs 20-SOIC -55 to 125 | Latch Transparent 3-ST 8-CH D-Type 20-Pin SOIC Tube | High Speed CMOS Logic Octal Transparent Latches with 3-State Outputs 20-SOIC -55 to 125 | Latch Transparent 3-ST 8-CH D-Type 20-Pin SOIC Tube | High Speed CMOS Logic Octal Transparent Latches with 3-State Outputs 20-PDIP -55 to 125 |
| Brand Name | Texas Instruments | - | Texas Instruments | - | Texas Instruments |
| 是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | - | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | - | SOIC | - | DIP |
| 包装说明 | SOP, SOP20,.4 | - | SOP, SOP20,.4 | - | DIP, DIP20,.3 |
| 针数 | 20 | - | 20 | - | 20 |
| Reach Compliance Code | compli | - | compli | - | compli |
| Factory Lead Time | 6 weeks | - | 6 weeks | - | 6 weeks |
| 控制类型 | ENABLE LOW/HIGH | - | ENABLE LOW/HIGH | - | ENABLE LOW/HIGH |
| 计数方向 | UNIDIRECTIONAL | - | UNIDIRECTIONAL | - | UNIDIRECTIONAL |
| 系列 | HC | - | HC | - | HC |
| JESD-30 代码 | R-PDSO-G20 | - | R-PDSO-G20 | - | R-PDIP-T20 |
| JESD-609代码 | e4 | - | e4 | - | e4 |
| 长度 | 12.8 mm | - | 12.8 mm | - | 25.4 mm |
| 负载电容（CL） | 50 pF | - | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER |
| 最大I（ol） | 0.0078 A | - | 0.0078 A | - | 0.0078 A |
| 位数 | 8 | - | 8 | - | 8 |
| 功能数量 | 1 | - | 1 | - | 1 |
| 端口数量 | 2 | - | 2 | - | 2 |
| 端子数量 | 20 | - | 20 | - | 20 |
| 最高工作温度 | 125 °C | - | 125 °C | - | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | - | -55 °C |
| 输出特性 | 3-STATE | - | 3-STATE | - | 3-STATE |
| 输出极性 | TRUE | - | TRUE | - | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOP | - | SOP | - | DIP |
| 封装等效代码 | SOP20,.4 | - | SOP20,.4 | - | DIP20,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | SMALL OUTLINE | - | IN-LINE |
| 包装方法 | TR | - | TR | - | TUBE |
| 峰值回流温度（摄氏度） | 260 | - | 260 | - | NOT SPECIFIED |
| 电源 | 2/6 V | - | 2/6 V | - | 2/6 V |
| 最大电源电流（ICC） | 0.08 mA | - | 0.08 mA | - | 0.08 mA |
| Prop。Delay @ Nom-Su | 53 ns | - | 53 ns | - | 53 ns |
| 传播延迟（tpd） | 265 ns | - | 265 ns | - | 265 ns |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified |
| 座面最大高度 | 2.65 mm | - | 2.65 mm | - | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V | - | 6 V | - | 6 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | - | 2 V |
| 标称供电电压 (Vsup) | 4.5 V | - | 4.5 V | - | 4.5 V |
| 表面贴装 | YES | - | YES | - | NO |
| 技术 | CMOS | - | CMOS | - | CMOS |
| 温度等级 | MILITARY | - | MILITARY | - | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | - | GULL WING | - | THROUGH-HOLE |
| 端子节距 | 1.27 mm | - | 1.27 mm | - | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
| 翻译 | N/A | - | N/A | - | N/A |
| 宽度 | 7.5 mm | - | 7.5 mm | - | 7.62 mm |
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