型号
- 型号
- 关键词
| 型号 | CD74HCT4051M | CD74HC4051H | CD54HC4051H | CD54HC4051F/3A | CD74HC4051M96 |
|---|---|---|---|---|---|
| 描述 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16, |
| 包装说明 | SOP, SOP16,.25 | , DIE OR CHIP | , DIE OR CHIP | DIP, DIP16,.3 | SOP, SOP16,.25 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| 信道数量 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 最大通态电阻 (Ron) | 225 Ω | 225 Ω | 270 Ω | 270 Ω | 225 Ω |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| 封装等效代码 | SOP16,.25 | DIE OR CHIP | DIE OR CHIP | DIP16,.3 | SOP16,.25 |
| 电源 | 5,GND/-5 V | 2/6,GND/-6 V | 2/6,GND/-6 V | 2/6,GND/-6 V | 2/6,GND/-6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大信号电流 | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A |
| 最长接通时间 | 55 ns | 225 ns | 45 ns | 45 ns | 45 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 |
| 厂商名称 | RCA | - | - | RCA | RCA |
| JESD-30 代码 | R-PDSO-G16 | - | - | R-XDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e0 | - | - | e0 | e0 |
| 端子数量 | 16 | - | - | 16 | 16 |
| 封装主体材料 | PLASTIC/EPOXY | - | - | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | SOP | - | - | DIP | SOP |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | - | IN-LINE | SMALL OUTLINE |
| 最大供电电流 (Isup) | 0.16 mA | 0.32 mA | 0.32 mA | - | - |
| 表面贴装 | YES | - | - | NO | YES |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | - | - | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | - | - | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL |
stm32/stm8
单片机
单片机
模拟与混合信号
DIY/开源硬件专区
分立器件
