型号
- 型号
- 关键词
IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,DIP,28PIN,PLASTIC
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：Renesas(瑞萨电子)
下载文档| 型号 | CDP68HSC05P4BE28 | CDP68HSC05P4BM28 | CDP68HCL05P4BM20 | CDP68HC05P4BE28 | CDP68HC05P4BM20 |
|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,DIP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,SOP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,SOP,20PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,DIP,28PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,SOP,20PIN,PLASTIC |
| Reach Compliance Code | compliant | compli | compli | not_compliant | not_compliant |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | 6805 | 6805 | 6805 | 6805 | 6805 |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G20 | R-PDIP-T28 | R-PDSO-G20 |
| 端子数量 | 28 | 28 | 20 | 28 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | DIP | SOP |
| 封装等效代码 | DIP28,.6 | SOP28,.4 | SOP20,.4 | DIP28,.6 | SOP20,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 176 | 176 | 176 | 176 | 176 |
| ROM（单词） | 4160 | 4160 | 4160 | 4160 | 4160 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 速度 | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz |
| 表面贴装 | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | DIP, DIP28,.6 | SOP, SOP28,.4 | SOP, SOP20,.4 | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 |