The definition of termination finish W has been changed to eliminate the
pure tin option (see
table IV).
The requirements to comply with this new
definition must be completed by 1 year from the date of this document.
Before then, use of the previous definition is authorized.
The requirements to comply with the board flex (see
3.21.1.1)
and shear
stress (see
3.21.1.2)
tests must be completed by 6 months from the date of
this document.
INCH-POUND
MIL-PRF-55681G
12 July 2016
SUPERSEDING
MIL-PRF-55681F
3 September 2004
PERFORMANCE SPECIFICATION
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED,
CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY
AND NON-ESTABLISHED RELIABILITY,
GENERAL SPECIFICATION FOR
Termination finish W (see
table IV)
is inactive for new design after
12 July 2016. For new design, use termination finish Z.
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the general requirements for non-established reliability (non-ER) and
established reliability (ER), ceramic dielectric, multiple layer, chip capacitors. ER capacitors covered by this
specification have failure rate levels (FRL) ranging from 1.0 percent to 0.001 percent per 1,000 hours. These FRLs
are established at a 90-percent confidence level and maintained at a 10 percent producer's risk and are based on life
tests performed at maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been
used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage
at rated temperature.
1.2 Classification.
1.2.1 Part or Identifying Number (PIN). The PIN is in the following form, and as specified (see
3.1).
CDR01
BX
100
A
K
Z
M
Style
(1.2.1.1)
Rated temperature
and voltage-
temperature limits
(1.2.1.2)
Capacitance Rated voltage Capacitance
(1.2.1.3)
(1.2.1.4)
tolerance
(1.2.1.5)
Termination
finish
(1.2.1.6)
Product level
designator
(1.2.1.7)
1.2.1.1 Style. The style is identified by the three-letter symbol "CDR" followed by a two-digit number. The letters
identify non-ER and ER, ceramic dielectric, fixed, chip capacitors.
1.2.1.2 Rated temperature and voltage-temperature limits. The rated temperature and voltage-temperature limits
are identified by a two-digit symbol. The first letter "B" indicates the rated temperature of -55°C to +125°C; the second
letter indicates the voltage-temperature limits as shown in
table I.
1.2.1.3 Capacitance. The nominal capacitance value expressed in picofarads (pF) is identified by a three-digit
number; the first two digits represent significant figures and the last digit specifies the number of zeros to follow.
When the nominal value is less than 10 pF, the letter "R" is used to indicate the decimal point and the succeeding
digit(s) of the group represent significant figure(s). For example, 1R0 indicates 1.0 pF and 0R5 indicates 0.5 pF.
Comments, suggestions, or questions on this document should be addressed to: CERDEC PRD: RDER-PRO,
Building 6010 K-130, Aberdeen Proving Ground, Aberdeen, MD 21005, or emailed to:
usarmy.apg.cerdec.mbx.standardizationcrx@mail.mil.
Since contact information can change, you may want to
verify the currency of this address information using the ASSIST Online database at
https://assist.dla.mil.
AMSC N/A
FSC 5910
MIL-PRF-55681G
TABLE I. Voltage-temperature limits.
Capacitance change with reference to +25°C
Step A through step Percent rated Step E through step
D of
table XIII
voltage
G of
table XIII
90
±
20 ppm/°C
0
±
30 ppm/°C
±
15 percent
±
15 percent
±
15 percent
100
100
100
100
60
90
±
20 ppm/°C
0
±
30 ppm/°C
+15, -40 percent
+15, -25 percent
+15, -45 percent
Symbol
G
P 1/
R
X
Z
1/ At measurement point F of
table XIII,
the capacitance measurement may
be
±
0.1 percent or
±
0.05 pF, whichever is greater, from the +25°C
reference.
1.2.1.4 Rated voltage. The rated voltage for continuous operation at +125°C is identified by a single letter as
shown in
table II.
TABLE II. Rated voltage.
Symbol
V
W
X
Y
Z
A
B
K
C
D
E
Rated voltage
4
6.3
10
16
25
50
100
150
200
300
500
1.2.1.5 Capacitance tolerance. The capacitance tolerance is identified by a single letter as shown in
table III.
TABLE III. Capacitance tolerance.
Symbol 1/
B
C
D
F
G
J
K
M
Capacitance tolerance (±)
.10 pF
.25 pF
.50 pF
1 percent
2 percent
5 percent
10 percent
20 percent
1/ Symbols B, C, and D are applicable for capacitance values
of less than 10 pF only. For capacitance values of .10 pF
through .50 pF, the capacitance will never be zero.
2
MIL-PRF-55681G
1.2.1.6 Termination finish. The termination finish is identified by a single letter as shown in
table IV.
Only the user
should make substitutions.
TABLE IV. Termination finish.
Symbol 1/
M
N 2/
S
T
U
W 4/
Y 5/
Z
Finish
Palladium/silver alloy
Silver - nickel - gold
Solder coated final with a minimum of 3 percent lead
Silver
Base metallization - nickel - solder coated (tin/lead alloy, with a minimum of 3
percent lead) 3/
Base metallization – nickel - solder coated (tin/lead alloy, with a minimum of 3
percent lead)
Base metallization - nickel - tin (100 percent)
Base metallization - nickel - solder plated (tin/lead alloy, with a minimum of 3 percent
lead)
1/ Terminations P (silver-copper-gold) and Q (palladium-gold) are no longer available.
2/ See
6.4.1.
3/ Solder will have a melting point of +200°C or less. Solder coat thickness will be a minimum of 60
micro-inches.
4/ Termination finish W is inactive for new design. Capacitors with termination finish W and date
codes prior to 1728 (see
3.23)
may contain 100 percent tin and promote tin whisker growth (see
6.4.2).
Contact the manufacturer for specific composition.
5/ Termination Y is 100 percent tin and may promote tin whisker growth (see
6.4.2).
1.2.1.7 Product level designator. The product level designator is identified by a single letter as shown in
table V.
TABLE V. Product level designator.
Symbol
C
M
P
R
S
Product level
non-ER
1.0
1/
0.1
1/
0.01 1/
0.001 1/
1/ FRL (percent per 1,000 hours).
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of the documents cited in sections 3 and 4 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract (see
6.2).
3
MIL-PRF-55681G
DEPARTMENT OF DEFENSE SPECIFICATIONS
(See
supplement 1
for list of associated specification sheets.)
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-202
MIL-STD-202-103
MIL-STD-202-104
MIL-STD-202-106
MIL-STD-202-107
MIL-STD-202-108
MIL-STD-202-208
MIL-STD-202-210
MIL-STD-202-211
MIL-STD-202-301
MIL-STD-202-302
MIL-STD-202-305
MIL-STD-690
MIL-STD-790
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Electronic and Electrical Component Parts, Test Methods for
Method 103, Humidity (Steady State)
Method 104, Immersion
Method 106, Moisture Resistance
Method 107, Thermal Shock
Method 108, Life (at Elevated Ambient Temperature)
Method 208, Solderability
Method 210, Resistance to Soldering Heat
Method 211, Terminal Strength
Method 301, Dielectric Withstanding Voltage
Method 302, Insulation Resistance
Method 305, Capacitance
Failure Rate Sampling Plans and Procedures
Standard Practice for Established Reliability and High Reliability Qualified
Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts
Specifications
(Copies of these documents are available online at
http://quicksearch.dla.mil/
.)
2.3 Non-Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES (IPC)
J-STD-004
J-STD-005
J-STD-006
-
-
-
Requirements for Soldering Fluxes
Requirements for Soldering Pastes
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-
Fluxed Solid Solders for Electronic Soldering Applications
(Copies of these documents are available online at
www.ipc.org.)
SAE INTERNATIONAL (SAE)
SAE EIA-554-1
-
Assessment of Average Outgoing Quality Levels in Parts Per Million (ppm)
(Copies of these documents are available online at
www.sae.org.)
SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD557
-
Statistical Process Control Systems
(Copies of this document are available online at
http://www.jedec.org.)
2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein (except for related specification sheets), the text of this
document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
4
MIL-PRF-55681G
3. REQUIREMENTS
3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the
applicable specification sheets. In the event of any conflict between requirements of this specification and the
specification sheet, the latter shall govern (see
6.2).
3.2 Qualification. Capacitors furnished under this specification shall be products which are authorized by the
qualifying activity for listing on the applicable qualified products list (QPL) before contract award. In addition, the
manufacturer shall obtain certification from the qualifying activity that the product assurance requirements of
4.2
have
been met and are being maintained.
3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by this
specification. Requirements for this system are specified in
MIL-STD-690
(ER parts only) and
MIL-STD-790.
In
addition, the manufacturer shall establish a Statistical Process Control (SPC) and Part Per Million (ppm) system that
meets the requirements specified in
3.3.1
and
3.3.2.
3.3.1 SPC system. As part of the overall
MIL-STD-790
QPL system, the manufacturer shall establish a SPC
system that meets the requirements of
JESD557.
3.3.2 PPM system. As part of the overall
MIL-STD-790
QPL system, the manufacturer shall establish a ppm
system for assessing the average outgoing quality of lots in accordance with
SAE EIA-554-1.
Data exclusion, in
accordance with
SAE EIA-554-1
may be used with approval of the qualifying activity. The ppm system shall identify
the ppm rate at the end of each month and shall be based on a six month moving average. Style reporting may
include both non-ER and ER style combinations.
3.4 Material. The material shall be as specified herein. However, when a definite material is not specified, a
material shall be used which enables the capacitors to meet the performance requirements of this specification.
Acceptance or approval of any constituent material shall not be construed as a guarantee of the acceptance of the
finished product.
3.4.1 Soldering flux. Soldering flux shall be in accordance with
J-STD-004.
No acid, acid salts, or type RA fluxes
shall be used in preparation for or during soldering.
3.5 Interface and physical dimension requirements. Capacitors shall meet the interface requirements and physical
dimensions specified (see
3.1).
3.5.1 Terminations. The terminations shall be of solderable metals or metal alloys. Termination finishes, as
identified in
1.2.1.6,
shall be as specified (see
3.1).
3.5.1.1 Reprocessing of terminations for solderability enhancement. The manufacturer may reprocess the
terminations of capacitors supplied to this specification for the purpose of solderability enhancement, provided the
termination process has been approved by the qualifying activity.
3.5.1.1.1 Reprocessing option. If the manufacturer reprocesses the terminations of the capacitors as a part of
normal production, or as a corrective action for solderability failure, the reprocessed lot shall be subjected to the
group A, subgroup 1, electrical tests.
3.5.2 Electrode parameters. Nickel electrodes shall not be used in capacitors supplied to this specification (see
6.12).
3.6 Voltage conditioning. When tested as specified in
4.8.3,
capacitors shall meet the following requirements:
a. Dielectric withstanding voltage (DWV) (at +25°C): Shall be as specified in
3.12,
with the following exceptions:
(1) For capacitors with a voltage rating of 500 volts, 200 percent of rated voltage shall be applied.
(2) Not applicable if the optional voltage conditioning was performed at or above 250 percent of rated voltage.
5
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