FPC Connector
CIC
Type (H=2.4mm)
1.0mm Spacing (SMT)
-01
No. of Pins
B
A
q
Upper Contact Type CFP24
Hold Down Packing Style
01
02
11
12
With
Without
With
Without
(2.0)
Embossed Taping
Embossed Taping
Vinyl Bag
Vinyl Bag
1.0(Spacing)
C
3.4
1. 1.0mm-pitch SMT-ready FPC connector usable
with CIC printing.
2. Either upper or lower contact location available.
3. Of the ZIF structure.
4. Supplied in emboss-tape packaging for
automatic mounting.
0.3
2.4
1.0
D
2.4
q
Lower Contact Type CFP25
1.7
s
Features
1.5
5.2
-01
No. of Pins
s
Specifications
1. Rating : 0.5A 100V AC/DC
2. Contact Resistance : 30mΩ max.
3. Insulation Resistance : 500MΩ min. at 500V DC
4. Withstanding Voltage : 500V AC for one minute
5. Operating Temperature Range : –25˚C to +70˚C
B
A
Hold Down Packing Style
01
02
11
12
With
Without
With
Without
(2.0)
Embossed Taping
Embossed Taping
Vinyl Bag
Vinyl Bag
1.0(Spacing)
C
3.4
Housing : Polyphenylene Sulfide
(Natural Color) 94V-0
q
Cover : Polyphenylene Sulfide
(Natural Color) 94V-0
q
Contact : Phosphor Bronze Tin-lead Plating
q
Frame : Phosphor Bronze Tin-lead Plating
q
1.5
0.3
2.4
1.0
D
1.7
5.2
s
Material and Plating
2.4
No. of Pins
4
5
6
7
8
9
10
11
12
13
14
15
A
03.0
04.0
05.0
06.0
07.0
08.0
09.0
10.0
11.0
12.0
13.0
14.0
B
05.1
06.1
07.1
08.1
09.1
10.1
11.1
12.1
13.1
14.1
15.1
16.1
C
09.7
10.7
11.7
12.7
13.7
14.7
15.7
16.7
17.7
18.7
19.7
20.7
D
04.5
05.5
06.5
07.5
08.5
09.5
10.5
11.5
12.5
13.5
14.5
15.5
No. of Pins
16
17
18
19
20
21
22
24
26
28
29
30
A
15.0
16.0
17.0
18.0
19.0
20.0
21.0
23.0
25.0
27.0
28.0
29.0
B
17.1
18.1
19.1
20.1
21.1
22.1
23.1
25.1
27.1
29.1
30.1
31.1
C
21.7
22.7
23.7
24.7
25.7
26.7
27.7
29.7
31.7
33.7
34.7
35.7
D
16.5
17.5
18.5
19.5
20.5
21.5
22.5
24.5
26.5
28.5
29.5
30.5
s
PC Board Dimension
2.4
0.2
3.0
0.5
0.25
s
Applicable FPC Dimension
Silver ink/carbon paste : 10µmin.
2.0
2.6
1.0
±
0.05
A
±
0.05
+ 0.1
(D 0.6)
0
0.5
+ 0.1
0
4.0min.
R
0.
4
1.0
±
0.05
A
±
0.05
(A 2)
±
0.1
0.7
±
0.08
1.0
±
0.15
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