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CG2600LSSNTR

Surge Protection Circuit, LEAD FREE PACKAGE-2

器件类别:无线/射频/通信    电信电路   

厂商名称:Littelfuse

厂商官网:http://www.littelfuse.com

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器件参数
参数名称
属性值
零件包装代码
DSS
包装说明
,
针数
2
Reach Compliance Code
unknown
JESD-30 代码
O-XDSS-X2
功能数量
1
端子数量
2
封装主体材料
UNSPECIFIED
封装形状
ROUND
封装形式
SPECIAL SHAPE
表面贴装
NO
电信集成电路类型
SURGE PROTECTION CIRCUIT
端子形式
UNSPECIFIED
端子位置
DUAL
Base Number Matches
1
文档预览
Gas Discharge Tube (GDT) Products
CG/CG2 Series
CG/CG2 Series
Description
Littelfuse highly reliable CG/CG2 Series GDTs provide
a high degree of surge protection in a small size ideal
for board level circuit protection.
GDTs function as switches which dissipate a
minimum amount of energy and therefore handle
currents that far surpass other types of transient
voltage protection. Their gas-filled, rugged ceramic
metal construction make them well suited to adverse
environments.
The CG/CG2 series comes in a variety of forms
including surface mount, core, straight and shaped
leads, to serve a variety of mounting methods.
AGENCY FILE NUMBER
Agency Approvals
AGENCY
The CG Series (75-110V) is ideal for protection of test
and communication equipment and other devices
in which low voltage limits and extremely low arc
voltages are required.
The CG2 Series (145V-1000V) is ideal for protecting
equipment where higher voltage limits and holdover
voltages are necessary.
Features
2 Electrode GDT Graphical Symbol
construction
(<1.5pf)
mount, and a variety of
lead options options
Applications
and equipment
protection
CG/CG2 Series
20
Revised: September 26, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Electrical Characteristics
Device Specifications
(at 25°C)
DC Breakdown
in Volts
(@100V/s)
Life Ratings
Surge
Life
10/1000μs)
Impulse
Break-
down
in Volts
(@100V/μs)
Impulse
Break-
down In
Volts
(@1 Kv/μsec)
Insulation
Capaci-
Arc
Resistance
tance Voltage
(on state
Voltage)
Nominal Nominal
AC
DC
Max
Impulse
AC
Dischage Holdover Impulse
Discharge Discharge Current Voltage
2
Discharge
(9 cycle
Current
Current
Current
(10x1sec
Part
Number
CG75
CG90
CG90 SN
CG110
CG2145
CG2230
CG2250
CG2300
CG2350
CG2420
CG2470
CG2600
CG2800
1
1
MIN
TYP MAX
MAX
MIN
MAX
TYP
TYP
60
72
72
88
75
90
90
110
90
108
108
132
174
174
265
276
288
300
345
360
403
420
483
540
564
690
720
920
400
400
400
450
500
500
600
600
625
625
700
700
750
750
800
850
850
1000
1000
1200
1500
650
600
600
600
600
600
700
700
725
725
800
800
900
900
1000
1200
1200
1400
1400
1500
1600
10 shots
(@10kA)
10 A
65 A
10
10
(at 100V)
135 V
1.5 pf
15 V
400
shots
10 shots
(@20kA)
3
20 A
100 A
2.5kA
80 V
10
10
(at 50V)
52 V
4kA
116 145
195 230
213 250
255 300
297 350
357 420
400 470
510 600
680 800
CG2145 SN 120 145
CG2230 SN 184 230
CG2250 SN 200 250
CG2300 SN 240 300
CG2350 SN 280 350
CG2470 SN 376 470
CG2600 SN 480 600
CG21000
850 1000 1150
Product Characteristics
LS, Axial:
Glow to arc
transition current
Glow Voltage
Materials
Core:
MS:
Storage and
Operational
Temperature
Maximum Follow
On Current
1
Product Marking
LF Logo, Voltage and date code; Black in
positive print
-40 to +90
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
21
Revised: September 26, 2011
CG/CG2 Series
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Device Dimensions
Leaded 'L' Type Straight Axial Devices
PROFILE VIEW
0.81
DIA. TYP.
[0.032]
8.10
DIA. MAX.
[0.319] 
Leaded 'LS' Type Shaped Lead Devices
PROFILE VIEW
6.07 ± 0.3
[0.239 ± 0.012]
TOP VIEW
TOP VIEW
8.10 Max.
[0.319 DIA Max.]
8.40 ± 0.3
[0.331 ± 0.012]
6.07 ± 0.15
[0.239 ± 0.006]
0.004
62 ± 2
2 Surfaces
9.85 ± 0.30
[0.388 ± 0.012]
11.15 ± 0.30
[0.439 ± 0.012]
0.40 ± 0.03
[0.0157 ± 0.0012]
8.4 ± 0.3
[0.331 ± 0.012]
0.80
[0.032]
Core Devices
SOLDER PAD LAYOUT
9.85
[0.388]
TOP VIEW
8.10 Max.
[0.032 Max.]
PROFILE VIEW
SEMI–PROFILE VIEW
8.60
[0.339]
6.07 ± 0.15
[0.239 ± 0.0059]
5.89
[0.232]
8.10 Max.
1.80
[0.071]
11.65
[0.459]
0.47 ± 0.1
[0.019 ± 0.0039]
'MS' Type Devices
TOP VIEW
8.30 ± 0.1
[0.327 ± 0.0039]
4 ± 0.2
[0.157 ± 0.0079]
PROFILE VIEW
SEMI–PROFILE VIEW
5.58
[0.220]
6.05 ± 0.2
[0.238 ± 0.0079]
ø8.30±0.1
R5.29
[R0.208]
[0
2
9]
0.
7
±
.00
30
0
9.
6 ±
6
.3
0.47 ± 0.1
[0.019 ± 0.0039]
SOLDER PAD LAYOUT
2.29
[0.090]
8.71
[0.343]
5.89
[0.232]
CG/CG2 Series
22
Revised: September 26, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (Min to Max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
+0/-5
T
P
150°C
Ramp-up
t
P
Critical Zone
T
L
to T
P
Temperature
200°C
T
L
T
S(max)
Preheat
t
L
Ramp-down
T
S(min)
5°C/second max
217°C
t
S
25
time to peak temperature
(t 25ºC to peak)
Time
Peak Temperature (T
P
)
Time within
5°C
of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
°C
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
Recommended Process Parameters:
Wave Parameter
Preheat:
100
°
C
150
°
C
Solder Pot Temperature:
Solder Dwell Time:
Lead-Free Recommendation
Temperature
(°C) - Measured on bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
0
°
2-5 seconds
Time
(Seconds)
Preheat
Time
Dwell
Time
Cooling
Time
Soldering Parameters - Hand Soldering
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
23
Revised: September 26, 2011
CG/CG2 Series
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Packaging Dimensions
For 'L' Type Axial Lead Items
<1.2 Max. Lead Bend
254.0 - 356.0
[10.0
- 14.0]
<0.8 Max
52.4
[2.063]
22.8
[0.898]
0.0
15]
Direction of Feed
6.4
[0.252]
5.0 Pitch
[0.197]
Core and 'MS' Type Items
275.0
[10.83]
10x4 ± 0.1 = 40
± 0.2
[10
x 0.157 ± 0.004 = 1.575
± 0.008]
0.4 ± 0.05
[0.016 ± 0.002]
1.75 ± 0.1
[0.069 ± 0.004]
1.5 DIA. MAX.
[0.059]
4 ± 0.1
[0.157 ± 0.004]
76.0
[2.99]
100.0
[3.94]
25.0
[0.98]
8.5 ± 0.1
[0.335 ± 0.004]
7.5 ± 0.1
[0.295 ± 0.004]
16 +0.3 / -0.1
[0.630
+0.012 / -0.004]
1.5 DIA. MAX.
[0.059]
17.7
[0.697]
Direction of Feed
8.6 ± 0.1
[0.339 ± 0.004]
12 ± 0.1
[0.472 ± 0.004]
For 'LS' Type Shaped Lead Items
10x4 ± 0.1 = 40
± 0.2
[10x.157
± 0.004 = 1.575
± 0.008]
0.5 ± 0.05
[0.020 ± 0.002]
1.9
[0.075]
1.75 ± 0.1
[0.069 ± 0.004]
1.5 DIA. MAX.
[0.059]
4 ± 0.1
[0.157 ± 0.004]
275.0
[10.82]
100.0
[3.93]
76.0
[2.99]
25.0
[0.98]
11.5 ± 0.1
[0.453 ± 0.004]
24 +0.3 / -0.1
[0.945
+0.019 / -0.004]
25.7
[1.01]
Direction of Feed
11.75 ± 0.1
[0.463 ± 0.004]
8 ± 0.1
[0.315 ± 0.004]
0.5 ± 0.01
[0.020 ± 0.004]
9 ± 0.1
[0.354 ± 0.004]
1.5 DIA. MAX.
[0.059]
16 ± 0.1
[0.630 ± 0.004]
CG/CG2 Series
24
Revised: September 26, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
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