首页 > 器件类别 > 无源元件 > 电阻器

CHP0502K2674FGPD

Fixed Resistor, Metal Glaze/thick Film, 0.05W, 2670000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0502, CHIP

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
145113521870
包装说明
SMT, 0502
Reach Compliance Code
unknown
ECCN代码
EAR99
构造
RECTANGULAR PACKAGE
JESD-609代码
e4
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.38 mm
封装长度
1.22 mm
封装形式
SMT
封装宽度
0.7 mm
包装方法
TR, PAPER
额定功率耗散 (P)
0.05 W
额定温度
70 °C
电阻
2670000 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
0502
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
100 ppm/°C
端子面层
Gold (Au) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
容差
1%
工作电压
50 V
文档预览
CHP, HCHP
www.vishay.com
Vishay Sfernice
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h) Thick Film Technology
FEATURES
• CHP: standard passivated version for
industrial, professional and military applications
Available
• Robust terminations
• Large ohmic value range 0.1
to 100 M
• Tight tolerance to 0.5 %
• HCHP: for high frequency applications
• ESCC approved see CHPHR
Available
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
• High temperature (245 °C) see CHPHT
• SMD wraparound chip resistor
• Halogen-free according to IEC 61249-2-21 definition
• Withstand moisture resistance test of AEC-Q200
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at +70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform to specifications NFC 83-240 and
MIL-R-55342 D.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
Sputtered Thin Film terminations, with nickel barrier, are
very convenient for high operating conditions. They can
withstand thousands of very severe thermal shocks.
B (W/A), N (W/A), and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RATED
POWER
Pn
W
LIMITING
ELEMENT
VOLTAGE
V
MAX. OVERLOAD RESISTANCE
TEMPERATURE UNIT
TOLERANCE
VOLTAGE
RANGE
(1)
COEFFICIENT WEIGHT
±%
V
± ppm/°C
mg
1
3
2
4
5
8
8
26
25
21
42
12
CHP0502
0.050
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0502 0502
CHP0505
0505
0.125
50
100
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP0505
CHP0603
0603
0.125
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0603
CHP0805
(2)
0.200
150
300
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0805 0805
CHP1005
1005
0.250
150
300
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1005
CHP1206
1206
0.250
200
400
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1206
CHP1505
0.500
200
400
0.1 to 75M
0.5, 1, 2, 5
100, 200
HCHP1505 1505
CHP2010
2010
1.000
(3)
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2010
CHP1020
1020
1.000
(3)
200
400
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP1020
CHP2208
0.750
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2208 2208
CHP2512
2512
2.000
(3)
250
500
0.1 to 100M
0.5, 1, 2, 5
100, 200
CHP2512
CHP1010
1010
0.500
200
400
0.1 to 25M
0.5, 1, 2, 5
100, 200
CHP1010
Notes
(1)
Shall be read in conjunction with other tables
(2)
Model CHP0805 being same size than case 0705 with same performances, only codification of CHP0805 remains
(3)
With special assembly care
Revision: 24-Jan-18
Document Number: 52023
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
DIMENSIONS
in millimeters
(F) and (W)
(B), (G), and (N)
D
C
D
C
B
B
E
A
E
A
CASE
SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
A
± 0.152
1.22
1.22
1.60
1.85
2.49
2.49
2.49
3.00
3.70
5.03
5.53
6.30
B
± 0.127
0.70
1.25
0.90
1.25
1.25
2.64
5.18
1.73
1.25
2.64
2.05
3.30
C
± 0.127
0.38
0.38
0.38
0.38
0.38
0.38
0.50
0.38
0.50
0.50
0.50
0.50
D
± 0.127
0.20
0.20
0.31
0.31
0.31
0.31
0.31
0.40
0.50
0.50
0.50
0.50
E
± 0.127
0.31
0.31
0.40
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
SUGGESTED LAND PATTERN
(to IPC-7351A) in millimeters
G
min.
X
max.
Z
max.
CASE SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
Z
max.
1.77
1.77
2.15
2.70
3.34
3.34
3.34
3.85
4.55
5.88
6.38
7.15
G
min.
0.19
0.19
0.39
0.44
1.08
1.08
1.08
1.59
2.29
3.62
4.12
4.89
X
max.
0.83
1.38
1.03
1.38
1.38
2.77
5.31
1.85
1.38
2.77
2.18
3.43
Revision: 24-Jan-18
Document Number: 52023
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
POWER DERATING CURVE
Rated Power (%)
100
80
60
40
20
0
Vishay Sfernice
MECHANICAL SPECIFICATIONS
Substrate
Technology
Protection
Alumina
Thick film (ruthenium oxide)
0.5
<
R
< 100 M: epoxy coating
R
0.5
:
overglaze protection
(no epoxy coating)
B (W/A):
SnPb over nickel barrier
for solder reflow
N (W/A):
SnAg over nickel barrier
for solder reflow
F (Flip Chip):
SnAg over nickel barrier
for solder reflow
W (one face) and G (W/A) type:
gold over nickel barrier
for other applications
Terminations
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
NUMBER OF PIECES PER
WAFFLE
TAPE AND
PACK
MIN. MAX.
400
4000
100
221
140
60
100
60
60
50
5000
8 mm
4000
100
2000
2500
4000
1000
2000
8 mm
8 mm
8 mm
8 mm
8 mm
Note
• Refer to Application Note “Guidelines for Vishay
Sfernice
Resistive
and
Inductive
Components”
(www.vishay.com/doc?52029) for recommended reflow profile.
Profile #3 applies
SIZE
MOQ
TAPE
WIDTH
CLIMATIC SPECIFICATIONS
Operating temperature
range
-55 °C; +155 °C
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
Note
• For temperature up to 215 °C please consult Vishay Sfernice
BEST TOL. AND TCR VS. OHMIC VALUE
OHMIC VALUE
RANGE in
10
<
R
< 5M
5
<
R
< 10M
1
<
R
<
R
max.
0.1
<
R
<
R
max.
TIGHTEST
TOLERANCE
(%)
0.5 % (D)
1 % (F)
2 % (G)
5 % (J)
(1)
100
BEST
TCR
(ppm/°C)
100 (K)
100 (K)
200 (L)
200 (L)
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
See Part Numbering information to get the quantity desired
by tape.
Note
(1)
Improved performance on request
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
Revision: 24-Jan-18
Document Number: 52023
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
TYPICAL HF PERFORMANCE OF HCHP
2.0
1.8
1.6
1.4
1.2
2.0
1
Ω
10
Ω
1.8
1.6
1.4
1.2
1
Ω
10
Ω
Vishay Sfernice
|Z|/R
|Z|/R
1.0
0.8
0.6
0.4
0.2
0
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
100
Ω
200
Ω
1.0
0.8
0.6
100
Ω
1 kΩ
200
Ω
1 kΩ
0.4
0.2
0
10 000
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
10 000
Size 0603 (W/A)
f (MHz)
Size 0603 (Flip chip)
f (MHz)
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,
PRA Arrays, CHP Thick Film)
www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206 / 1505 / 1020 / 2010 / 2512).
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
Uncoated
ceramic
Enlarged
termination
C
E
B
D
A
CASE
SIZE
1206
1505
2010
1020
2208
2512
A
± 0.152
3.00
3.70
5.03
2.49
5.53
6.30
B
± 0.127
1.73
1.25
2.64
5.18
2.05
3.30
C
± 0.127
0.38
0.50
0.50
0.50
0.50
0.50
D
± 0.127
0.40
0.50
0.50
0.31
0.50
0.50
E
± 0.127
1.19
1.54
2.20
0.93
2.45
2.84
Revision: 24-Jan-18
Document Number: 52023
4
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
CASE SIZE
1206
1505
2010
1020
2208
2512
DIMENSIONS (IN MILLIMETERS)
Z
max.
3.85
4.55
5.88
3.34
6.38
7.15
G
min.
0.50
0.50
0.50
0.50
0.50
0.50
X
max.
1.86
1.38
2.77
5.31
2.18
3.43
OPTION: MARKING
Option to order 0013:
Marking of ohmic value and tolerance:
Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
Tolerance indicated by a color dot.
Option to order 0014:
Marking of ohmic value:
Sizes 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
No standard marking available for smaller sizes.
A price adder will apply to the unit price of the parts for options 0013 and 0014.
PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at +260 °C
5 cycles
-55 °C
+155 °C
Phase A dry heat
Phase B damp heat
Phase C cold -55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C / 85 % RH / Pn / 10
1000 h
6.25 Pr
for 2 s
1000 h at rated power
90’/30’ at +70 °C
REQUIREMENTS
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
Rapid temperature change
< ± 0.1 %
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
± (1 % + 0.05
)
± (1 % + 0.05
)
5 % + 0.05
± (0.25 % + 0.05
)
1000 h
± (1 % + 0.05
)
1000 h
< 0.25 %
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05
< ± 0.1 %
2000 h
< 0.5 %
10 000 h
<1%
Revision: 24-Jan-18
Document Number: 52023
5
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
查看更多>
国产FPGA芯片第四坑综合提示ERROR (EX0320) : Can not find GAO specified net "...
我使用的官方LED例程,想测试PLL就加了一个顶层文件,例化了原来的LED和新添加的PLL,综合时...
littleshrimp 国产芯片交流
如何采用蓝牙4.2实现物联网
在许多无线物联网设备中,如可穿戴电子设备和电池供电或自供电传感器,将功耗保持在最低水平至关...
Jacktang RF/无线
英特尔:已具备更早地过渡到Intel 18A的能力
英特尔即将实现 四年五个制程节点 计划,将提前把工程资源从Intel 20A投入到Int...
叶落便知秋 移动便携
网桥的功能
1.源地址跟踪   网桥具有一定的路径选择功能,它在任何时候收到一个帧以后,都要确定其正确的传输路径...
mdreamj RF/无线
有没有谁碰到USART无故进中断出不来的情况?
USART1打开RXNE和TC 然后用串口调试工具进行10ms间隔不停地发数据 发现,过一段时间...
jlizheng stm32/stm8
【2024 DigiKey创意大赛】AI赋能的智能家居系统
【项目背景与概述】 本项目利用乐鑫 ESP32-C6-DEVKITC-1-N8 开发...
夷则玖 DigiKey得捷技术专区
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消