CHPHT
www.vishay.com
Vishay Sfernice
High Temperature (245 °C) Thick Film Chip Resistor
FEATURES
• High temperature (245 °C)
• Large ohmic value range 0.1
to 100 M
• Operating temperature range
(- 55 °C to + 230 °C)
• SMD wraparound chip resistor
• Storage temperature range
(- 55 °C to + 245 °C)
For applications such as down hole applications or aircraft
breaking systems, the need for parts able to withstand very
severe conditions (temperature as high as 230 °C powered
or up to 245 °C un-powered) has leaded Vishay Sfernice to
push out the limit of the thick film technology. Designers
might read the application note “Power Dissipation
Considerations in High Precision Vishay Sfernice Thin Film
Chips Resistors and Arrays (P, PRA etc.) (High Temperature
Applications)” (www.vishay.com/doc?53047) in conjunction
with this data sheet to help them to properly design their
PCBs and get the best performances of the CHPHT.
Vishay Sfernice R&D engineers will be willing to support any
customer design considerations.
• Gold terminations for HMP process (< 1 μm thick) for
temperature up to 245 °C
• Tin/silver terminations for operating temperature up to
200 °C
• Compliant to RoHS Directive 2002/95/EC
• Halogen-free according to IEC 61249-2-21 definition
Note
*
Pb containing terminations are not RoHS compliant, exemptions
may apply
DIMENSIONS
in millimeters
D
C
B
E
A
CASE SIZE
0603
0805
1206
2010
A
± 0.152
1.60
1.85
3.00
5.03
B
± 0.127
0.90
1.25
1.73
2.64
C
± 0.127
0.38
0.38
0.38
0.50
D
± 0.127
0.31
0.31
0.40
0.50
E
± 0.127
0.40
0.50
0.50
0.50
SUGGESTED LAND PATTERN
(to IPC-7351A)
G
min.
X
max.
Z
max.
CASE SIZE
0603
0805
1206
2010
Revision: 16-Nov-11
Z
max.
2.15
2.70
3.85
5.88
G
min.
0.39
0.44
1.59
3.62
X
max.
1.03
1.38
1.85
2.77
Document Number: 52032
1
For technical questions, contact:
sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHPHT
www.vishay.com
Vishay Sfernice
ELECTRICAL SPECIFICATIONS
CASE SIZE
POWER RATING
Pn
mW
(at 230 °C)
12.5
20
25
100
LIMITING ELEMENT
VOLTAGE
V
50
150
200
200
MAX. OVERLOAD
VOLTAGE
V
100
300
400
400
MAX.
RESISTANCE
(1)
M
25
25
50
100
UNIT WEIGHT
mg
2
4
8
26
0603
0805
1206
2010
Notes
• Other sizes upon request
(1)
Shall be read in conjunction with other tables
ELECTRICAL SPECIFICATIONS
Resistance range:
Resistance tolerance:
Power dissipation:
Temperature coefficient:
0.1R to 100M
1 %, 2 %, 5 %
Pn: 12.5 mW to 100 mW
(at 230 °C)
K: 100 ppm/°C
L: 200 ppm/°C
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only). (For 0603, 0805, and 1206 only.)
NUMBER OF PIECESPER PACKAGE
SIZE
WAFFLE
PACK
TAPE AND REEL
MIN.
MAX.
5000
100
100
140
60
2000
4000
8 mm
TAPE
WIDTH
MECHANICAL SPECIFICATIONS
Substrate:
Technology:
Protection:
Terminations:
Alumina
Thick film (Ruthenium oxyde)
Parts have double and organic coating
(0R5 to 100M)
N (W/A):
SnAg over nickel barrier for
temperature up to 200 °C
G (W/A) type:
Gold (< 1 μm) over nickel
barrier for temperature up to 245 °C
0603
0805
0705
1206
2010
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code
Note
• Refer to Application Note “Guidelines for Vishay Sfernice
Resistive and Inductive Components” (document number:
52029) for recommended reflow profile. Profile #3 applies.
CLIMATIC SPECIFICATIONS
Operating temperature range: - 55 °C to + 230 °C
Storage temperature range: - 55 °C to + 245 °C
BEST TOL. AND TCR VERSUS OHMIC VALUE
TIGHTEST
TOLERANCE
1 % (F)
2 % (G)
5 % (J)
OHMIC
VALUES
5
<
R
< 10M
1
<
R
<
R
max.
0.1
<
R
<
R
max.
BEST TCR
ppm/°C
100 (K)
200 (L)
200 (L)
Revision: 16-Nov-11
Document Number: 52032
2
For technical questions, contact:
sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHPHT
www.vishay.com
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: “Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA
Arrays, CHP Thick Film” (www.vishay.com/doc?53048).
Option to order: 0063 (applies to size 1206/2010).
Vishay Sfernice
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
A
Uncoated
ceramic
Enlarged
termination
B
F
D
E
A
CASE
SIZE
MAX. TOL.
+ 0.152
MIN. TOL.
- 0.152
NOMINAL
1206
2010
3.06 (0.120)
5.08 (0.200)
B
MAX. TOL.
+ 0.127
MIN. TOL.
- 0.127
NOMINAL
1.60 (0.063)
2.54 (0.100)
E
MAX. TOL.
+ 0.13
MIN. TOL.
- 0.13
NOMINAL
0.40 (0.016)
0.48 (0.019)
D
MAX. TOL.
+ 0.13
MIN. TOL.
- 0.13
NOMINAL
1.22 (0.048)
2.23 (0.088)
NOMINAL
0.63 (0.024)
0.63 (0.024)
F
MIN.
0.50 (0.020)
0.50 (0.020)
MAX.
0.76 (0.030)
0.76 (0.030)
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
DIMENSIONS (in millimeters)
CHIP SIZE
Z
max.
1206
2010
3.91 (0.154)
5.93 (0.233)
G
min.
0.50 (0.020)
0.50 (0.020)
X
max.
1.73 (0.068)
2.67 (0.105)
Revision: 16-Nov-11
Document Number: 52032
3
For technical questions, contact:
sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHPHT
www.vishay.com
Vishay Sfernice
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
< ± 0.1 %
PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
Rapid temperature change
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at + 260 °C
5 cycles
- 55 °C to + 155 °C
Phase A dry heat
Phase B damp heat
Phase C cold - 55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C/85 % RH/Pn
1000 h
6.25 Pn
for 2 s
1000 h at rated power
at 230 °C
1000 h at 245 °C
REQUIREMENTS
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
Shelf life
± (1 % + 0.05
)
± (1 % + 0.05
)
3 % + 0.05
± (0.25 % + 0.05
)
-
-
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05
< ± 0.1 %
1 % max.
1 % max.
GLOBAL PART NUMBER INFORMATION
Global Part Numbering: CHPHT0805K1001FGT
C
GLOBAL
MODEL
CHPHT
H
P
H
T
0
8
0
5
K
1
0
0
1
F
G
T
SIZE
0603
0805
1206
2010
TCR
K
= 100 ppm
L
= 200 ppm
VALUE
The first 3 digits
are significant
figures and the
last digit specifies
the number of
zeros to follow.
R designates
decimal point
10R0 = 10
3901 = 3900
1004 = 1 M
TOLERANCE
F
=±1%
G
=±2%
J
=±5%
TERMINATION
(1)
N:
SnAg over nickel barrier
G:
Gold over nickel barrier
PACKAGING
(2)
Blank
=
Waffle pack
T
=
Tape and reel
PT
=
Paper tape
(3)
OPTION
Leave blank
if no option
Notes
(1)
N terminations for temperature up to 200 °C
G terminations for temperature up to 230 °C
(2)
For specific quantity of parts per packaging please consult Vishay Sfernice
(3)
For paper tape please consult Vishay Sfernice
Revision: 16-Nov-11
Document Number: 52032
4
For technical questions, contact:
sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Revision: 12-Mar-12
1
Document Number: 91000