Ver. 201207
Multilayer Power Inductor
CIG21L Series (2012/ EIA 0805)
APPLICATION
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
FEATURES
Super Low DC resistance
Low Profile (1.0mm max)
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
RECOMMENDED LAND PATTERN
DIMENSION
TYPE
Dimension [mm]
L
2.0±0.1
W
1.25±0.1
T
0.9±0.1
D
0.5+0.2
-0.3
21
DESCRIPTION
Part no.
CIG21LR47MNE
CIG21L1R0MNE
CIG21L1R2MNE
CIG21L1R5MNE
CIG21L2R2MNE
CIG21L3R3MNE
CIG21L4R7MNE
Size
(inch/mm)
0805/2012
0805/2012
0805/2012
0805/2012
0805/2012
0805/2012
0805/2012
Inductance
(uH)@1MHz
0.47 ±20 %
1.0 ±20 %
1.2 ±20 %
1.5 ±20 %
2.2 ±20 %
3.3 ±20 %
4.7 ±20 %
DC
Resistance(Ω)
0.080 ±20 %
0.110 ±20 %
0.125 ±20 %
0.140 ±20 %
0.160 ±20 %
0.220 ±20 %
0.260 ±20 %
Rated Current (A)
Max.
1.30
1.15
1.10
1.05
0.95
0.80
0.75
※
Rated Current: DC current value when the self-generation of heat rises to 40
℃
(Reference ambient temperature:25
℃
)
C
※
Operating temperature range: –40 to +125° ( Including self-temperature rise)
Test equipment: Agilent :E4991A+16092A
※
CHARACTERISTIC DATA
1) Frequency characteristics (Typ.)
2) DC Bias characteristics (Typ.)
Ver. 201207
PRODUCT IDENTIFICATION
CI
(1)
(1)
(3)
(5)
(7)
(8)
G
(2)
21
(3)
L
(4)
1R0
(5)
M
(6)
N
(7)
E
(8)
Chip Inductor
(2) Power Inductor
Dimension
(4) Product Series (L:Low RDC Type)
Inductance (R47:0.47uH, 1R0:1.0uH)
(6) Tolerance (M:±20%)
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
Packaging(C:paper tape, E:embossed tape)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
FLOW SOLDERING
PACKAGING
Packaging Style
Embossed Taping
Quantity(pcs/reel)
3,000
■
NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
