201208
Chip Bead
For EMI Suppression
CIB/CIM10 Series (1608/ EIA 0603)
APPLICATION
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
FEATURES
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or
reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
RECOMMENDED LAND PATTERN
0.6~0.8mm
0.6~0.8mm
0.6~0.8mm
0.6~0.8mm
DIMENSION
Type
Dimension [mm]
L
W
t
d
10
1.6±0.15 0.8±0.15 0.8±0.15
0.3±0.2
DESCRIPTION
Part no.
CIB10P100
CIB10P220
CIB10P260
CIB10P300
CIB10P330
CIM10U800
CIM10U121
CIM10U221
CIM10U241
CIM10U301
CIM10U471
CIM10U601
CIM10U102
CIM10U202
CIB10J300
CIM10J400
CIM10J470
CIM10J600
CIM10J750
CIM10J800
CIM10J121
CIM10J151
CIM10J221
CIM10J241
Thickness
(mm)
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
Impedance
(
Ω
)±25%@100MHz
10
22
26
30
33
80
120
220
240
300
470
600
1000
2000(at 70MHz)
30
40
47
60
75
80
120
150
220
240
DC Resistance
(
Ω
) Max.
0.05
0.05
0.08
0.08
0.08
0.10
0.15
0.25
0.25
0.30
0.35
0.38
0.50
1.20
0.10
0.12
0.12
0.12
0.15
0.15
0.20
0.20
0.30
0.30
Rated Current
(mA) Max.
1000
1500
1000
1000
1000
600
500
400
400
400
300
500
400
200
1000
600
600
600
550
550
500
400
400
400
Ver 201208
Part no.
CIM10J301
CIM10J471
CIM10J601
CIM10J751
CIM10J102
CIM10J152
CIM10J252
CIM10K152
CIM10K202
CIM10K252
CIM10N700
CIM10N121
CIM10N241
CIM10F470
CIM10F600
CIM10F121
CIM10F331
CIM10F471
Thickness
(mm)
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
Impedance
(
Ω
)±25%@100MHz
300
470
600
750
1000
1500
2500
1500
2000
2500
70
120
240
47
60
120
330
470
DC Resistance
(
Ω
) Max.
0.35
0.35
0.45
0.50
0.60
0.70
1.50
0.80
1.00
1.20
0.30
0.45
0.60
0.25
0.25
0.30
0.58
0.85
Rated Current
(mA) Max.
400
300
300
300
250
250
200
250
200
200
500
400
300
550
550
500
400
300
CHARACTERISTIC DATA
Ver 201208
Ver 201208
Ver 201208
PRODUCT IDENTIFICATION
CI
(1)
(1)
(3)
(5)
(6)
(7)
M
(2)
10 U
(3) (4)
121
(5)
N C
(6) (7)
Chip Beads
(2) M: Multi-layer type B:Mono-layer type
Dimension
(4) Material Code
Nominal impedance (121:120
Ω
, 202:2000
Ω
)
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
Packaging(C:paper tape, E:embossed tape)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
FLOW SOLDERING
PACKAGING
Packaging Style
Card Board Taping
Quantity(pcs/reel)
4000
■
NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
