型号 | CL001N02730L0AJ-60 | NBB20-L3M-US-V93 | 20633C | CL001N02730L0AJ-70 |
---|---|---|---|---|
描述 | Fast Page DRAM Module, 2MX72, 60ns, CMOS | Inductive sensor | Fast Page DRAM Module, 2MX72, 70ns, CMOS | Fast Page DRAM Module, 2MX72, 70ns, CMOS |
Reach Compliance Code | unknown | - | unknown | unknown |
ECCN代码 | EAR99 | - | EAR99 | EAR99 |
访问模式 | FAST PAGE | - | FAST PAGE | FAST PAGE |
最长访问时间 | 60 ns | - | 70 ns | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-XDMA-N168 | - | R-XDMA-N168 | R-XDMA-N168 |
内存密度 | 150994944 bit | - | 150994944 bit | 150994944 bit |
内存集成电路类型 | FAST PAGE DRAM MODULE | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
内存宽度 | 72 | - | 72 | 72 |
功能数量 | 1 | - | 1 | 1 |
端口数量 | 1 | - | 1 | 1 |
端子数量 | 168 | - | 168 | 168 |
字数 | 2097152 words | - | 2097152 words | 2097152 words |
字数代码 | 2000000 | - | 2000000 | 2000000 |
工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | - | 70 °C | 70 °C |
组织 | 2MX72 | - | 2MX72 | 2MX72 |
封装主体材料 | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V |
表面贴装 | NO | - | NO | NO |
技术 | CMOS | - | CMOS | CMOS |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD |
端子位置 | DUAL | - | DUAL | DUAL |